JP3909772B2 - 半導体実装方法およびフレキシブル配線板 - Google Patents
半導体実装方法およびフレキシブル配線板 Download PDFInfo
- Publication number
- JP3909772B2 JP3909772B2 JP2004303959A JP2004303959A JP3909772B2 JP 3909772 B2 JP3909772 B2 JP 3909772B2 JP 2004303959 A JP2004303959 A JP 2004303959A JP 2004303959 A JP2004303959 A JP 2004303959A JP 3909772 B2 JP3909772 B2 JP 3909772B2
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- Japan
- Prior art keywords
- liquid crystal
- crystal polymer
- wiring board
- flexible wiring
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 26
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 45
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 45
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 37
- 239000000758 substrate Substances 0.000 description 7
- 230000005284 excitation Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007430 reference method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000544 Gore-Tex Polymers 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 230000002535 lyotropic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Wire Bonding (AREA)
Description
12,12A 液晶ポリマのフィルム
14,14A 配線(リード配線)
16 半導体ベアチップ
16A 半導体ベアチップの実装領域
Claims (6)
- 液晶ポリマのフィルムを用いたフレキシブル配線板の配線に半導体ベアチップのバンプを超音波フリップチップ接合技術により実装する半導体実装方法であって、
前記半導体チップに前記液晶ポリマの配向方向と略同方向に超音波振動を加えて接合することを特徴とする半導体実装方法。 - フレキシブル配線板の配線の最終めっき処理が金めっきであり、半導体ベアチップのバンプが金バンプである請求項1の半導体実装方法。
- 液晶ポリマは、全芳香族ポリエステル樹脂であり、液晶ポリマのフィルムは厚さが25μm以下である請求項1または2の半導体実装方法。
- フレキシブル配線板の温度を、液晶ポリマの配向方向の引っ張り粘弾性率が3GPa以上となる温度領域に保持しつつ接合する請求項1〜3のいずれかの半導体実装方法。
- 半導体ベアチップのバンプが接合されるフレキシブル配線板の主なリード配線が液晶ポリマの配向方向にほぼ一致している請求項1〜4のいずれかの半導体実装方法。
- 請求項1〜5のいずれかの半導体実装方法に用いるフレキシブル配線板であって、
半導体ベアチップのバンプが接合される位置につながるフレキシブル配線板の主なリード配線の方向が、液晶ポリマの配向方向にほぼ一致しているフレキシブル配線板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303959A JP3909772B2 (ja) | 2004-10-19 | 2004-10-19 | 半導体実装方法およびフレキシブル配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303959A JP3909772B2 (ja) | 2004-10-19 | 2004-10-19 | 半導体実装方法およびフレキシブル配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006120683A JP2006120683A (ja) | 2006-05-11 |
JP3909772B2 true JP3909772B2 (ja) | 2007-04-25 |
Family
ID=36538316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004303959A Active JP3909772B2 (ja) | 2004-10-19 | 2004-10-19 | 半導体実装方法およびフレキシブル配線板 |
Country Status (1)
Country | Link |
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JP (1) | JP3909772B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10278289B2 (en) | 2015-09-02 | 2019-04-30 | Murata Manufacturing Co., Ltd. | Resin circuit board and resin circuit board having component mounted thereon |
US10741462B2 (en) | 2015-09-01 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008210891A (ja) * | 2007-02-23 | 2008-09-11 | Fujikura Ltd | フレキシブルプリント基板 |
CN204991657U (zh) * | 2013-04-26 | 2016-01-20 | 株式会社村田制作所 | 电子元器件及电路基板 |
CN206042553U (zh) | 2014-09-03 | 2017-03-22 | 株式会社村田制作所 | 模块器件 |
CN207074656U (zh) | 2015-08-10 | 2018-03-06 | 株式会社村田制作所 | 多层基板、部件安装基板 |
CN207458915U (zh) | 2015-11-10 | 2018-06-05 | 株式会社村田制作所 | 多层基板、部件安装基板 |
-
2004
- 2004-10-19 JP JP2004303959A patent/JP3909772B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10741462B2 (en) | 2015-09-01 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate |
US10278289B2 (en) | 2015-09-02 | 2019-04-30 | Murata Manufacturing Co., Ltd. | Resin circuit board and resin circuit board having component mounted thereon |
Also Published As
Publication number | Publication date |
---|---|
JP2006120683A (ja) | 2006-05-11 |
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