TW200501862A - Wiring substrate and electronic parts packaging structure - Google Patents

Wiring substrate and electronic parts packaging structure

Info

Publication number
TW200501862A
TW200501862A TW093110838A TW93110838A TW200501862A TW 200501862 A TW200501862 A TW 200501862A TW 093110838 A TW093110838 A TW 093110838A TW 93110838 A TW93110838 A TW 93110838A TW 200501862 A TW200501862 A TW 200501862A
Authority
TW
Taiwan
Prior art keywords
electronic parts
wiring substrate
packaging structure
connection pad
parts packaging
Prior art date
Application number
TW093110838A
Other languages
Chinese (zh)
Other versions
TWI337056B (en
Inventor
Kei Murayama
Masahiro Sunohara
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200501862A publication Critical patent/TW200501862A/en
Application granted granted Critical
Publication of TWI337056B publication Critical patent/TWI337056B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25F—COMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F1/00—Combination or multi-purpose hand tools
    • B25F1/003—Combination or multi-purpose hand tools of pliers'-, scissors'- or wrench-type with at least one movable jaw
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25F—COMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F1/00—Combination or multi-purpose hand tools
    • B25F1/02—Combination or multi-purpose hand tools with interchangeable or adjustable tool elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B13/00—Hand shears; Scissors
    • B26B13/22—Hand shears; Scissors combined with auxiliary implements, e.g. with cigar cutter, with manicure instrument
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81205—Ultrasonic bonding
    • H01L2224/81206—Direction of oscillation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support the connection pad upon the ultrasonic flip-chip packaging is filled is arranged in the insulating film under the connection pad.
TW093110838A 2003-04-24 2004-04-19 An electronic parts packaging structure TWI337056B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003120499A JP4170137B2 (en) 2003-04-24 2003-04-24 Wiring board and electronic component mounting structure

Publications (2)

Publication Number Publication Date
TW200501862A true TW200501862A (en) 2005-01-01
TWI337056B TWI337056B (en) 2011-02-01

Family

ID=32959676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093110838A TWI337056B (en) 2003-04-24 2004-04-19 An electronic parts packaging structure

Country Status (7)

Country Link
US (2) US7183647B2 (en)
EP (1) EP1471574B1 (en)
JP (1) JP4170137B2 (en)
KR (1) KR20040092411A (en)
CN (1) CN1541053A (en)
DE (1) DE602004011421T2 (en)
TW (1) TWI337056B (en)

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* Cited by examiner, † Cited by third party
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JP4170137B2 (en) * 2003-04-24 2008-10-22 新光電気工業株式会社 Wiring board and electronic component mounting structure
JP4636850B2 (en) * 2004-10-29 2011-02-23 富士通株式会社 Electronic component mounting method
CN101213891B (en) 2005-08-29 2011-03-30 株式会社村田制作所 Ceramic electronic component and method for manufacturing the same
JP4639147B2 (en) * 2005-12-14 2011-02-23 インターナショナル・ビジネス・マシーンズ・コーポレーション Dielectric multilayer substrate
KR101058309B1 (en) * 2006-01-13 2011-08-22 파나소닉 주식회사 3D circuit board and its manufacturing method
JP2008227309A (en) 2007-03-14 2008-09-25 Shinko Electric Ind Co Ltd Wiring substrate and manufacturing method thereof
KR101044203B1 (en) * 2009-11-18 2011-06-29 삼성전기주식회사 Electromagnetic bandgap structure and Printed circuit board having the same
US8237272B2 (en) * 2010-02-16 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive pillar structure for semiconductor substrate and method of manufacture
KR20120080923A (en) * 2011-01-10 2012-07-18 삼성전자주식회사 Semiconductor package and method of forming the same
JP5860256B2 (en) * 2011-09-26 2016-02-16 京セラサーキットソリューションズ株式会社 Wiring board
CN104220954B (en) * 2012-05-17 2018-07-17 英特尔公司 For the film insert molded of device manufacturing
KR101483874B1 (en) * 2013-07-29 2015-01-16 삼성전기주식회사 Printed Circuit Board
CN206879237U (en) 2014-09-26 2018-01-12 株式会社村田制作所 Layered module substrate and layered module
CN106449575B (en) * 2015-08-07 2020-07-24 晶宏半导体股份有限公司 Bump structure of semiconductor device
CN207074656U (en) * 2015-08-10 2018-03-06 株式会社村田制作所 Multilager base plate, component-mounted substrate
JPWO2017038790A1 (en) 2015-09-01 2018-03-01 株式会社村田製作所 Resin substrate, component mounting resin substrate, component mounting resin substrate manufacturing method
CN208227405U (en) 2015-10-15 2018-12-11 株式会社村田制作所 Resin substrate and component install resin substrate
JP2017076698A (en) * 2015-10-15 2017-04-20 日本特殊陶業株式会社 Wiring board and manufacturing method of the same
WO2017082029A1 (en) * 2015-11-10 2017-05-18 株式会社村田製作所 Multilayer substrate, component mounting substrate, and method for manufacturing component mounting substrate
CN108713351B (en) * 2016-03-11 2021-01-15 本田技研工业株式会社 Electronic circuit board and ultrasonic bonding method
KR20170107823A (en) * 2016-03-16 2017-09-26 삼성전자주식회사 Semiconductor apparatus capable of dispersing stresses
JP7260220B2 (en) * 2019-02-26 2023-04-18 日清紡マイクロデバイス株式会社 semiconductor equipment
DE102019215471B4 (en) * 2019-10-09 2022-05-25 Vitesco Technologies GmbH Electronic component with a contact arrangement and method for producing an electronic component
US10741483B1 (en) * 2020-01-28 2020-08-11 Advanced Semiconductor Engineering, Inc. Substrate structure and method for manufacturing the same
CN115023052A (en) * 2022-06-29 2022-09-06 生益电子股份有限公司 Printed circuit board, preparation method thereof and micro light-emitting display device

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JP4170137B2 (en) * 2003-04-24 2008-10-22 新光電気工業株式会社 Wiring board and electronic component mounting structure

Also Published As

Publication number Publication date
US7557450B2 (en) 2009-07-07
US7183647B2 (en) 2007-02-27
US20040212087A1 (en) 2004-10-28
EP1471574A3 (en) 2006-07-12
EP1471574B1 (en) 2008-01-23
DE602004011421T2 (en) 2008-05-21
US20070114673A1 (en) 2007-05-24
EP1471574A2 (en) 2004-10-27
JP4170137B2 (en) 2008-10-22
KR20040092411A (en) 2004-11-03
CN1541053A (en) 2004-10-27
DE602004011421D1 (en) 2008-03-13
JP2004327721A (en) 2004-11-18
TWI337056B (en) 2011-02-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees