TW200719487A - Flip chip package structure - Google Patents

Flip chip package structure

Info

Publication number
TW200719487A
TW200719487A TW094139584A TW94139584A TW200719487A TW 200719487 A TW200719487 A TW 200719487A TW 094139584 A TW094139584 A TW 094139584A TW 94139584 A TW94139584 A TW 94139584A TW 200719487 A TW200719487 A TW 200719487A
Authority
TW
Taiwan
Prior art keywords
bumps
chip
disposed
package structure
active surface
Prior art date
Application number
TW094139584A
Other languages
Chinese (zh)
Other versions
TWI292958B (en
Inventor
Jiun-Heng Wang
Geng-Shin Shen
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW94139584A priority Critical patent/TWI292958B/en
Publication of TW200719487A publication Critical patent/TW200719487A/en
Application granted granted Critical
Publication of TWI292958B publication Critical patent/TWI292958B/en

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

A flip chip package structure including a chip, a flexible carrier, a plurality of bumps, a plurality of dummy bumps, and an underfill layer is provided. The chip has an active surface and a plurality of bonding pads, wherein the bonding pads are disposed on the active surface. The flexible carrier has a flexible substrate and a circuit layer, wherein the circuit layer is disposed on the flexible substrate. In addition, the bumps are disposed on the bonding pads, and the circuit layer is electrically connected with the bonding pads through the bumps. Further, the dummy bumps are disposed on the active surface, and the flexible carrier is connected with the active surface of the chip through the dummy bumps. The underfill layer is setup to cover the bumps and the dummy bumps between the chip and the flexible carrier.
TW94139584A 2005-11-11 2005-11-11 Flip chip package structure TWI292958B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94139584A TWI292958B (en) 2005-11-11 2005-11-11 Flip chip package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94139584A TWI292958B (en) 2005-11-11 2005-11-11 Flip chip package structure

Publications (2)

Publication Number Publication Date
TW200719487A true TW200719487A (en) 2007-05-16
TWI292958B TWI292958B (en) 2008-01-21

Family

ID=45067679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94139584A TWI292958B (en) 2005-11-11 2005-11-11 Flip chip package structure

Country Status (1)

Country Link
TW (1) TWI292958B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI662633B (en) * 2017-07-03 2019-06-11 南茂科技股份有限公司 Bumping process and flip chip structure
TWI838816B (en) * 2022-08-09 2024-04-11 啟碁科技股份有限公司 Package structure and method for fabricating the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393232B (en) * 2009-03-05 2013-04-11 Chipmos Technologies Inc Package substrate and chip package structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI662633B (en) * 2017-07-03 2019-06-11 南茂科技股份有限公司 Bumping process and flip chip structure
TWI838816B (en) * 2022-08-09 2024-04-11 啟碁科技股份有限公司 Package structure and method for fabricating the same

Also Published As

Publication number Publication date
TWI292958B (en) 2008-01-21

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