TW200715582A - Multi-chip sensor package - Google Patents

Multi-chip sensor package

Info

Publication number
TW200715582A
TW200715582A TW094134861A TW94134861A TW200715582A TW 200715582 A TW200715582 A TW 200715582A TW 094134861 A TW094134861 A TW 094134861A TW 94134861 A TW94134861 A TW 94134861A TW 200715582 A TW200715582 A TW 200715582A
Authority
TW
Taiwan
Prior art keywords
sensor
substrate
sensor device
sensor package
chip sensor
Prior art date
Application number
TW094134861A
Other languages
Chinese (zh)
Other versions
TWI285435B (en
Inventor
Yung-Li Lu
Gwo-Liang Weng
Ying-Tsai Yeh
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94134861A priority Critical patent/TWI285435B/en
Publication of TW200715582A publication Critical patent/TW200715582A/en
Application granted granted Critical
Publication of TWI285435B publication Critical patent/TWI285435B/en

Links

Abstract

A multi-chip sensor package mainly includes a substrate, a sensor device, an encapsulant and a semiconductor device. The sensor device is disposed on an upper surface of the substrate and has a sensor area. A plurality of electrically connecting components electrically connect the substrate and the sensor device. The encapsulant seals the electrically connecting components but exposes the sensor area of the sensor device. The semiconductor device is bonded on/in a lower surface of the substrate and electrically connected to the sensor device to increase the memory capacity.
TW94134861A 2005-10-05 2005-10-05 Multi-chip sensor package TWI285435B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94134861A TWI285435B (en) 2005-10-05 2005-10-05 Multi-chip sensor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94134861A TWI285435B (en) 2005-10-05 2005-10-05 Multi-chip sensor package

Publications (2)

Publication Number Publication Date
TW200715582A true TW200715582A (en) 2007-04-16
TWI285435B TWI285435B (en) 2007-08-11

Family

ID=39456720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94134861A TWI285435B (en) 2005-10-05 2005-10-05 Multi-chip sensor package

Country Status (1)

Country Link
TW (1) TWI285435B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495023B (en) * 2007-09-28 2015-08-01 Stats Chippac Ltd Integrated circuit packaging system with base structure device
TWI550525B (en) * 2015-05-22 2016-09-21 南茂科技股份有限公司 Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495023B (en) * 2007-09-28 2015-08-01 Stats Chippac Ltd Integrated circuit packaging system with base structure device
TWI550525B (en) * 2015-05-22 2016-09-21 南茂科技股份有限公司 Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
TWI285435B (en) 2007-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees