TW200715582A - Multi-chip sensor package - Google Patents
Multi-chip sensor packageInfo
- Publication number
- TW200715582A TW200715582A TW094134861A TW94134861A TW200715582A TW 200715582 A TW200715582 A TW 200715582A TW 094134861 A TW094134861 A TW 094134861A TW 94134861 A TW94134861 A TW 94134861A TW 200715582 A TW200715582 A TW 200715582A
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor
- substrate
- sensor device
- sensor package
- chip sensor
- Prior art date
Links
Abstract
A multi-chip sensor package mainly includes a substrate, a sensor device, an encapsulant and a semiconductor device. The sensor device is disposed on an upper surface of the substrate and has a sensor area. A plurality of electrically connecting components electrically connect the substrate and the sensor device. The encapsulant seals the electrically connecting components but exposes the sensor area of the sensor device. The semiconductor device is bonded on/in a lower surface of the substrate and electrically connected to the sensor device to increase the memory capacity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94134861A TWI285435B (en) | 2005-10-05 | 2005-10-05 | Multi-chip sensor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94134861A TWI285435B (en) | 2005-10-05 | 2005-10-05 | Multi-chip sensor package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715582A true TW200715582A (en) | 2007-04-16 |
TWI285435B TWI285435B (en) | 2007-08-11 |
Family
ID=39456720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94134861A TWI285435B (en) | 2005-10-05 | 2005-10-05 | Multi-chip sensor package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI285435B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI495023B (en) * | 2007-09-28 | 2015-08-01 | Stats Chippac Ltd | Integrated circuit packaging system with base structure device |
TWI550525B (en) * | 2015-05-22 | 2016-09-21 | 南茂科技股份有限公司 | Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof |
-
2005
- 2005-10-05 TW TW94134861A patent/TWI285435B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI495023B (en) * | 2007-09-28 | 2015-08-01 | Stats Chippac Ltd | Integrated circuit packaging system with base structure device |
TWI550525B (en) * | 2015-05-22 | 2016-09-21 | 南茂科技股份有限公司 | Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI285435B (en) | 2007-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |