TWI550525B - Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof - Google Patents
Wiring pattern forming method, fingerprint sensing circuit board and manufacturing method thereof Download PDFInfo
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Description
本發明係關於一種導線圖案形成方法、指紋感測電路板及其製作方法,並且特別地,本發明係關於一種能簡易地形成導線圖案的方法,以及應用此方法製作出的指紋感測電路板。 The present invention relates to a wire pattern forming method, a fingerprint sensing circuit board, and a method of fabricating the same, and in particular, the present invention relates to a method for easily forming a wire pattern, and a fingerprint sensing circuit board produced by the method .
在各種不同的電子設備中,電路板乃是不可獲缺的一部分。不論是何種型態的電路板,都佈設有導線於其上,以對設置在電路板上的各種電子元件進行電性連接。隨著電子設備功能要求日益複雜,電路板上的電子元件以及線路也越來越密集。 Circuit boards are an integral part of a variety of electronic devices. Regardless of the type of circuit board, wires are disposed thereon to electrically connect various electronic components disposed on the circuit board. As the functional requirements of electronic devices become more complex, electronic components and circuits on the board are becoming more and more dense.
一般的電路板製作首先會進行佈線,亦即在基板上佈設用來電性連接各電子元件或外部電路的導線。導線的佈設通常經過下列步驟:於基板上塗佈金屬層、塗佈光阻層於金屬層上、對光阻層進行曝光及顯影、對其上具有顯影後之光阻層圖案的金屬層進行蝕刻而形成導線圖案、以及去除剩餘光阻(脫模)等步驟。如上所述,傳統電路板的導線製作除了步驟繁瑣造成生產成本上升之外,所使用的各種化學藥液(例如光阻劑、顯影劑、蝕刻液等)對於環境皆有不同程度上的汙染問題。 In general, the circuit board is first wired, that is, a wire for electrically connecting each electronic component or an external circuit is disposed on the substrate. The wire is usually laid through the steps of: coating a metal layer on the substrate, coating the photoresist layer on the metal layer, exposing and developing the photoresist layer, and performing a metal layer having the developed photoresist layer pattern thereon; The steps of etching to form a wire pattern, and removing residual photoresist (release). As described above, in addition to the cumbersome steps of the conventional circuit board, the production cost is increased, and various chemical liquids (for example, photoresist, developer, etching liquid, etc.) used have different degrees of pollution to the environment. .
另一方面,近年來由於通訊及網路的發達,人與人之間的資訊交流的方式從面對面為主轉變為網路溝通,並且商業交易的型態也持續地改變,信用卡、金融卡以及電子錢包等日益普及。雖然以電腦和網路為媒介的電子資訊傳輸方式相當便利,但相對地第三者也很容易取得重要的個人資料,例如,個人帳戶及密碼等。因此,如何防止重要資料被盜取,乃是身處於資訊化社會中不可輕忽的一環。特別是已成為現代人生活中不可或缺的行動裝置,例如智慧型手機、平板電腦、筆記型電腦等,更有賴資料防護功能的提升來防止資料外洩的問題。 On the other hand, in recent years, due to the development of communication and the Internet, the way of information exchange between people has changed from face-to-face to network communication, and the type of business transactions has continued to change, credit cards, financial cards, and Electronic wallets and the like are becoming increasingly popular. Although computer and network-based electronic information transmission is quite convenient, relatively third parties can easily obtain important personal information, such as personal accounts and passwords. Therefore, how to prevent the theft of important information is a part of the information society that cannot be neglected. In particular, it has become an indispensable mobile device in modern people's lives, such as smart phones, tablets, notebook computers, etc., and it is more dependent on the improvement of data protection functions to prevent data leakage.
目前不論是固定式電子裝置或是行動通訊裝置,均可利用生物辨識方式來對裝置本身進行加密,換言之,利用個人的身體上的特徵辨識使用者是否為裝置所有人或者是被允許的裝置操作者。習知的生物辨識方式有指紋辨識、聲紋辨識、虹膜辨識及視網膜辨識等,其中,基於安全舒適及辨識效率的綜合考量,指紋辨識成為生物辨識的主流。 At present, whether it is a fixed electronic device or a mobile communication device, the biometric method can be used to encrypt the device itself, in other words, using the physical characteristics of the individual to identify whether the user is operating the device owner or the allowed device. By. The known biometric methods include fingerprint identification, voiceprint recognition, iris recognition and retina recognition. Among them, based on the comprehensive consideration of safety comfort and recognition efficiency, fingerprint recognition has become the mainstream of biometric identification.
上述的指紋辨識方法可透過指紋感測電路及晶片來達成。於先前技術中,指紋感測電路板的其中一種形式係在基板的兩相對表面的對應位置上設置互相垂直的導線群,兩互相垂直的導線群會形成網格狀的感測電路。指紋感測電路板的兩側的導線群,於先前技術中也是透過如同前述之微影蝕刻方式形成於基板上。因此,感測電路的形成同樣需經塗佈、曝光、顯影、蝕刻等製程,也會產生前述的製程繁瑣及環境汙染等問題。 The fingerprint identification method described above can be achieved through a fingerprint sensing circuit and a chip. In the prior art, one form of the fingerprint sensing circuit board is provided with mutually perpendicular groups of wires at corresponding positions on opposite surfaces of the substrate, and two mutually perpendicular groups of wires form a grid-like sensing circuit. The group of wires on both sides of the fingerprint sensing circuit board is also formed on the substrate by the lithography etching method as described in the prior art. Therefore, the formation of the sensing circuit also needs to be coated, exposed, developed, etched, etc., which also causes the aforementioned cumbersome process and environmental pollution.
基於上述問題,有必要研發一種能簡易地形成導線圖案於基板上之方法,以降低電路板(包含指紋感測電路板)的生產成本及所帶來的環境汙染。 Based on the above problems, it is necessary to develop a method for easily forming a wiring pattern on a substrate to reduce the production cost of the circuit board (including the fingerprint sensing circuit board) and the environmental pollution caused.
本發明的一範疇在於提供一種導線圖案形成方法,根據本發明之一具體實施例,導線圖案形成方法包含了以下步驟:塗佈液態之膠層於基板的導線圖案預定位置之上;接著佈設多個導電粒子於液態之膠層上;最後,對液態之膠層進行固化製程,使得液態之膠層由液態轉變為半固態,再進一步轉變為固態,進而在基板的導線圖案預定位置上形成導線圖案。 One aspect of the present invention is to provide a wire pattern forming method. According to an embodiment of the present invention, a wire pattern forming method includes the steps of: applying a liquid glue layer over a predetermined position of a wire pattern of a substrate; The conductive particles are on the liquid glue layer; finally, the liquid glue layer is subjected to a curing process, so that the liquid glue layer is changed from a liquid state to a semi-solid state, and then further converted into a solid state, thereby forming a wire at a predetermined position of the wire pattern of the substrate. pattern.
本發明之另一範疇在於提供一種指紋感測電路板,根據本發明之另一具體實施例,指紋感測電路板包含基板、第一膠體導線圖案及第二膠體導線圖案。基板上具有相對的第一表面與第二表面,並且第一表面與第二表面上分別具有互相對應的第一線路設置區與第二線路設置區。第一膠體導線圖案沿著第一方向設置在第一線路設置區中,而第二膠體導線圖案則沿著垂直於第一方向之第二方向設置在第二線路設置區中,並且第一膠體導線圖案及第二膠體導線圖案內包含多個導電粒子。 Another aspect of the present invention is to provide a fingerprint sensing circuit board. According to another embodiment of the present invention, a fingerprint sensing circuit board includes a substrate, a first colloidal conductor pattern, and a second colloidal conductor pattern. The substrate has opposite first and second surfaces, and the first surface and the second surface respectively have a first line setting area and a second line setting area corresponding to each other. The first colloidal conductor pattern is disposed in the first line setting area along the first direction, and the second colloidal conductor pattern is disposed in the second line setting area along the second direction perpendicular to the first direction, and the first colloid The conductive pattern and the second colloidal conductor pattern comprise a plurality of conductive particles.
本發明之另一範疇在於提供一種指紋感測電路板之製作方法,根據本發明之另一具體實施例,指紋感測電路板之製作方法包含下列步驟:提供具有相對之第一表面與第二表面的基板,第一表面與第二表面上分別具有對應的第一線路設置區及第二線路設置區; 於第一線路設置區上,沿第一方向塗佈液態膠層以形成第一膠體線路層;於第二線路設置區上,沿著垂直於第一方向之第二方向塗佈液態膠層以形成第二膠體線路層;佈設多個導電粒子於第一膠體線路層及第二膠體線路層上;最後,對液態膠層之第一膠體線路層及第二膠體線路層進行固化製程,使得液態膠層由液態轉變為半固態,再進一步轉變為固態,進而形成第一膠體導線圖案與第二膠體導線圖案。 Another aspect of the present invention is to provide a method for fabricating a fingerprint sensing circuit board. According to another embodiment of the present invention, a method for fabricating a fingerprint sensing circuit board includes the following steps: providing an opposite first surface and a second a substrate on the surface, the first surface and the second surface respectively have corresponding first line setting areas and second line setting areas; Applying a liquid glue layer in a first direction to form a first gel line layer on the first line setting area; and applying a liquid glue layer in a second direction perpendicular to the first direction on the second line setting area Forming a second colloidal circuit layer; arranging a plurality of conductive particles on the first colloidal wiring layer and the second colloidal wiring layer; finally, performing a curing process on the first colloidal wiring layer and the second colloidal wiring layer of the liquid adhesive layer to make the liquid The glue layer is transformed from a liquid state to a semi-solid state, and further converted into a solid state to form a first colloidal wire pattern and a second colloidal wire pattern.
關於本發明之優點與精神可以藉由以下的發明詳述以及所附圖式得到進一步的了解。 The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
20‧‧‧基板 20‧‧‧Substrate
200‧‧‧導線圖案預定位置 200‧‧‧Wire pattern predetermined position
22‧‧‧導線圖案 22‧‧‧Wire pattern
22a‧‧‧膠層 22a‧‧‧ glue layer
24‧‧‧導電粒子 24‧‧‧ conductive particles
M1‧‧‧模具 M1‧‧‧Mold
3‧‧‧指紋感測電路板 3‧‧‧Fingerprint sensing circuit board
30‧‧‧基板 30‧‧‧Substrate
300‧‧‧第一表面 300‧‧‧ first surface
302‧‧‧第二表面 302‧‧‧ second surface
3000‧‧‧第一線路設置區 3000‧‧‧First line setting area
3020‧‧‧第二線路設置區 3020‧‧‧Second line setting area
32‧‧‧第一膠體導線圖案 32‧‧‧First colloidal wire pattern
34‧‧‧第二膠體導線圖案 34‧‧‧Second colloidal wire pattern
36‧‧‧絕緣保護層 36‧‧‧Insulating protective layer
38‧‧‧電子元件 38‧‧‧Electronic components
5‧‧‧導電粒子 5‧‧‧ conductive particles
40‧‧‧基板 40‧‧‧Substrate
400‧‧‧第一表面 400‧‧‧ first surface
402‧‧‧第二表面 402‧‧‧ second surface
4000‧‧‧第一線路設置區 4000‧‧‧First line setting area
4020‧‧‧第二線路設置區 4020‧‧‧Second line setting area
42a‧‧‧第一膠體線路層 42a‧‧‧First gel line layer
44a‧‧‧第二膠體線路層 44a‧‧‧Second gel line layer
42‧‧‧第一膠體導線圖案 42‧‧‧First colloidal wire pattern
44‧‧‧第二膠體導線圖案 44‧‧‧Second colloidal wire pattern
46‧‧‧導電粒子 46‧‧‧Electrical particles
48‧‧‧絕緣保護層 48‧‧‧Insulating protective layer
M2‧‧‧模具 M2‧‧‧Mold
圖一A至圖一E係繪示根據本發明之多個具體實施例之導線圖案形成方法的流程示意圖。 FIG. 1A to FIG. 1E are schematic flow charts showing a method of forming a wire pattern according to various embodiments of the present invention.
圖二A係繪示根據本發明之一具體實施例之指紋感測電路板的側視圖。 2A is a side elevational view of a fingerprint sensing circuit board in accordance with an embodiment of the present invention.
圖二B係繪示圖二A之指紋感測電路板的俯視圖。 2B is a top view of the fingerprint sensing circuit board of FIG. 2A.
圖三A至圖三H係繪示根據本發明之多個具體實施例之指紋感測電路板之製作方法的流程示意圖。 FIG. 3A to FIG. 3H are schematic flowcharts showing a method of fabricating a fingerprint sensing circuit board according to various embodiments of the present invention.
請參閱圖一A至圖一C,圖一A至圖一C係繪示根據本發明之一具體實施例之導線圖案形成方法的流程示意圖。根據一具體實施例,導線圖案形成方法包含下列步驟:塗佈液態之膠層22a於基板20的導線圖案預定位置200上,如圖一A所示;佈設多個導電粒子24於液態之膠層22a上,如圖一B所示;以及,對液態之膠層22a進行固化製程, 使液態之膠層22a由液態轉變為半固態再進一步轉變成固態,以於導線圖案預定位置200之上形成導線圖案22,如圖一C所示。 Referring to FIG. 1A to FIG. 1C, FIG. 1A to FIG. 1C are schematic flowcharts showing a method for forming a wire pattern according to an embodiment of the present invention. According to a specific embodiment, the wire pattern forming method comprises the steps of: coating a liquid glue layer 22a on a predetermined position 200 of the wire pattern of the substrate 20, as shown in FIG. 1A; and arranging a plurality of conductive particles 24 in a liquid glue layer. 22a, as shown in FIG. 1B; and, the liquid layer 22a is subjected to a curing process, The liquid glue layer 22a is converted from a liquid state to a semi-solid state and further converted into a solid state to form a wire pattern 22 above the predetermined position 200 of the wire pattern, as shown in FIG.
於圖一A中,液態之膠層22a可採用例如網版印刷或噴墨列印等印刷方式形成於導線圖案預定位置200上。於圖一B中,導電粒子24可以噴灑的方式佈設在液態之膠層22a上。於實務中,噴灑於液態之膠層22a上之導電粒子24會慢慢地滲入液態之膠層22a中。於實務中,導電粒子24之材料可選自石墨、碳黑、奈米碳管、奈米碳球或碳纖維,或者金(Au)、銀(Ag)、鉑(Pt)、鎳(Ni)、鋁(Al)、鈦(Ti)、鐵(Fe)、銅(Cu)、鉬(Mo)、錫(Sn)、鉭(Ta)、鎂(Mg)、鎢(W)或上述金屬之合金,也可選自上列各種材料的任意組合。 In FIG. 1A, the liquid glue layer 22a can be formed on the predetermined position 200 of the wire pattern by a printing method such as screen printing or ink jet printing. In FIG. 1B, the conductive particles 24 may be sprayed on the liquid glue layer 22a. In practice, the conductive particles 24 sprayed on the liquid layer 22a slowly penetrate into the liquid layer 22a. In practice, the material of the conductive particles 24 may be selected from graphite, carbon black, carbon nanotubes, carbon spheres or carbon fibers, or gold (Au), silver (Ag), platinum (Pt), nickel (Ni), Aluminum (Al), titanium (Ti), iron (Fe), copper (Cu), molybdenum (Mo), tin (Sn), tantalum (Ta), magnesium (Mg), tungsten (W) or an alloy of the above metals, It can also be selected from any combination of the various materials listed above.
液態之膠層22a內部包含多個導電粒子24而具有導電的功能,經由圖一C中之固化製程轉變為固態後即形成固體的導線圖案22。為使所形成的導線圖案22的各導線能具有更均勻的導電性,可在上述具體實施例之導線圖案形成方法的固化步驟中再進一步地加工。請參閱圖一D以及圖一E,圖一D至圖一E係繪示根據本發明之另一具體實施例之導線圖案形成方法的流程示意圖。於本具體實施例中,導線圖案形成方法仍包含如圖一A及圖一B所示之塗佈液態之膠層22a於基板20以及佈設多個導電粒子24於液態之膠層22a上的步驟,接著,於圖一C所示的液態之膠層22a固化製程中,液態之膠層22a由液態轉變為半固態。 The liquid glue layer 22a contains a plurality of conductive particles 24 inside and has a function of conducting electricity. After the solidification process in FIG. 1C is converted into a solid state, a solid wire pattern 22 is formed. In order to enable the wires of the formed wire pattern 22 to have more uniform conductivity, it can be further processed in the curing step of the wire pattern forming method of the above specific embodiment. Please refer to FIG. 1D and FIG. 1E. FIG. 1D to FIG. 1E are schematic flow diagrams showing a method for forming a wire pattern according to another embodiment of the present invention. In the present embodiment, the wire pattern forming method still includes the steps of applying the liquid glue layer 22a to the substrate 20 and the plurality of conductive particles 24 to the liquid glue layer 22a as shown in FIG. 1A and FIG. Then, in the liquid phase of the liquid layer 22a shown in FIG. 1C, the liquid layer 22a is converted from a liquid state to a semi-solid state.
接著,如圖一D所示,對半固態之膠層22a施加壓力,使得導電粒子24深入並均勻分佈於半固態的膠層22a中;以及,於圖一E 中,對受壓後的半固態之膠層22a進一步進行固化製程,使其轉變為固態之膠層,即形成導線圖案22。於圖一D中,對半固態之膠層22a施加壓力之步驟可透過模具M1朝基板20施力,以對半固態之膠層22a垂直施壓。於圖一B中噴灑在液態之膠層22a表面的多個導電粒子24,經過施壓後,會更進一步地被壓入半固態之膠層22a中,同時均勻地分佈於半固態之膠層22a內。更甚者,導電粒子24受壓而在膠層22a內形成緊密連接的導電結構,更有利於電性傳導。須注意的是,圖一C、圖一D以及圖一E並不限定於分段式的步驟,亦即,固化製程並不需中途停止並待施壓完成後再繼續進行固化,而是可以不間斷地進行固化程序直至膠層22a轉變為固態為止,並當膠層22a轉為半固態時同時進行固化製程及施壓。 Next, as shown in FIG. 1D, pressure is applied to the semi-solid glue layer 22a such that the conductive particles 24 are deeply and evenly distributed in the semi-solid glue layer 22a; and, in FIG. In the middle, the pressed semi-solid adhesive layer 22a is further subjected to a curing process to be converted into a solid adhesive layer, that is, a wire pattern 22 is formed. In FIG. 1D, the step of applying pressure to the semi-solid glue layer 22a can be applied to the substrate 20 through the mold M1 to apply pressure to the semi-solid glue layer 22a. The plurality of conductive particles 24 sprayed on the surface of the liquid adhesive layer 22a in FIG. 1B are further pressed into the semi-solid adhesive layer 22a after being pressed, and uniformly distributed in the semi-solid adhesive layer. Within 22a. Moreover, the conductive particles 24 are pressed to form a tightly connected conductive structure in the adhesive layer 22a, which is more advantageous for electrical conduction. It should be noted that FIG. 1C, FIG. 1D, and FIG. 1E are not limited to the stepwise step, that is, the curing process does not need to be stopped in the middle and the curing is continued after the pressure is completed, but The curing process is continuously performed until the adhesive layer 22a is turned into a solid state, and the curing process and pressure are simultaneously performed when the adhesive layer 22a is turned into a semi-solid state.
綜上所述,本發明之導線圖案形成方法利用半導體製程或IC封裝中常用的膠體,配合分佈於膠體中的導電粒子,可簡易地在各種基板上形成各種電路結構。因此,省去了塗佈、曝光、顯影、蝕刻等繁雜的微影蝕刻製程步驟,並可避免前述製程中使用的化學藥液對環境造成汙染。 In summary, the wire pattern forming method of the present invention can form various circuit structures on various substrates easily by using a colloid commonly used in a semiconductor process or an IC package, and with conductive particles distributed in the colloid. Therefore, the complicated micro-lithography etching process steps such as coating, exposure, development, etching, etc. are omitted, and the chemical liquid used in the above process can be prevented from polluting the environment.
請參閱圖二A及圖二B,圖二A係繪示根據本發明之一具體實施例之指紋感測電路板3的側視圖,圖二B係繪示圖二A之指紋感測電路板3的俯視圖。如圖二A及圖二B所示,指紋感測電路板3包含基板30、第一膠體導線圖案32及第二膠體導線圖案34。基板30分別具有相對的第一表面300及第二表面302,其上分別具有互相對應的第一線路設置區3000與第二線路設置區3020。基板30於實務中可為高介電材 料,例如陶瓷基板,或可為可撓性基板。 Please refer to FIG. 2A and FIG. 2B. FIG. 2A is a side view of the fingerprint sensing circuit board 3 according to an embodiment of the present invention, and FIG. 2B is a fingerprint sensing circuit board of FIG. Top view of 3. As shown in FIG. 2A and FIG. 2B, the fingerprint sensing circuit board 3 includes a substrate 30, a first colloidal conductor pattern 32, and a second colloidal conductor pattern 34. The substrate 30 has an opposite first surface 300 and a second surface 302 respectively, and has a first line setting area 3000 and a second line setting area 3020 corresponding to each other. The substrate 30 can be a high dielectric material in practice. The material, for example, a ceramic substrate, or may be a flexible substrate.
第一膠體導線圖案32可為沿著第一方向設置在第一線路設置區3000內的多個導線。第二膠體導線圖案34可為沿著第二方向設置在第二線路設置區3020內的多個導線,其中,第一方向與第二方向互相垂直。第一膠體導線圖案32與第二膠體導線圖案34的各導線內包含多個導電粒子5,因此,第一膠體導線圖案32與第二膠體導線圖案34的導線在基板30相對表面上對應形成網格狀的指紋感測線路,可供使用者直接或間接地以手指接觸而感測其指紋。 The first colloidal conductor pattern 32 may be a plurality of wires disposed within the first line setting region 3000 along the first direction. The second colloidal conductor pattern 34 may be a plurality of wires disposed in the second line setting region 3020 along the second direction, wherein the first direction and the second direction are perpendicular to each other. The plurality of conductive particles 5 are included in each of the first colloidal conductor patterns 32 and the second colloidal conductor patterns 34. Therefore, the first colloidal conductor patterns 32 and the second colloidal conductor patterns 34 are formed on the opposite surfaces of the substrate 30 to form a net. The grid-shaped fingerprint sensing circuit allows the user to sense the fingerprint directly or indirectly with a finger contact.
於圖二A中,指紋感測電路板3進一步包含絕緣保護層36,至少局部地覆蓋在第一膠體導線圖案32及第二膠體導線圖案34之上以提供指紋感測線路保護效果。此外,指紋感測電路板3還可包含其他電子元件38,例如:晶片、封裝體、被動元件等。舉例而言,當電子元件38為晶片時,可將晶片電性連接至第一膠體導線圖案32及第二膠體導線圖案34,以接收指紋感測線路的感測訊號並據以計算感測結果。 In FIG. 2A, the fingerprint sensing circuit board 3 further includes an insulating protective layer 36 overlying at least partially over the first colloidal conductor pattern 32 and the second colloidal conductor pattern 34 to provide a fingerprint sensing line protection effect. In addition, the fingerprint sensing circuit board 3 may also include other electronic components 38 such as a wafer, a package, a passive component, and the like. For example, when the electronic component 38 is a wafer, the wafer can be electrically connected to the first colloidal conductor pattern 32 and the second colloidal conductor pattern 34 to receive the sensing signal of the fingerprint sensing line and calculate the sensing result accordingly. .
上述指紋感測電路板可進一步連接到另一個印刷電路板或軟性電路板上,構成指紋辨識系統,以利用辨識結果達成特定功能,例如進出管制、登入各種電子裝置或系統等。此外,根據另一具體實施例,感測電路板可直接整合於另一電路板,不需使用額外基板。例如,將前述第一膠體導線圖案32及第二膠體導線圖案34、晶片及外部電路同時設置在軟性電路板上,換言之,此處的軟性電路板即為前述具體實施例中之基板30。於實務中,第一膠體導線圖案32及第二膠 體導線圖案34可沿互相垂直的第一方向及第二方向,分別設置在軟性電路板的同一表面的兩對應區域之上,接著折疊軟性電路板,使得兩對應區域背靠背地疊合,進而形成前述的網格狀的指紋感測線路。 The fingerprint sensing circuit board can be further connected to another printed circuit board or a flexible circuit board to form a fingerprint identification system to utilize the identification result to achieve specific functions, such as access control, login to various electronic devices or systems, and the like. Moreover, according to another embodiment, the sensing circuit board can be directly integrated into another circuit board without the use of an additional substrate. For example, the first colloidal conductor pattern 32 and the second colloidal conductor pattern 34, the wafer, and the external circuit are simultaneously disposed on the flexible circuit board. In other words, the flexible circuit board herein is the substrate 30 in the foregoing specific embodiment. In practice, the first colloidal conductor pattern 32 and the second glue The body conductor patterns 34 may be respectively disposed on two corresponding regions of the same surface of the flexible circuit board along the mutually perpendicular first direction and the second direction, and then the flexible circuit board is folded such that the two corresponding regions are stacked back to back, thereby forming The aforementioned grid-like fingerprint sensing circuit.
於先前各具體實施例中,第一膠體導線圖案32及第二膠體導線圖案34內分別包含有多個導電粒子5,並形成多條導線於基板30的兩個相對表面300、302。導電粒子5之材料可選自石墨、碳黑、奈米碳管、奈米碳球或碳纖維,或者金(Au)、銀(Ag)、鉑(Pt)、鎳(Ni)、鋁(Al)、鈦(Ti)、鐵(Fe)、銅(Cu)、鉬(Mo)、錫(Sn)、鉭(Ta)、鎂(Mg)、鎢(W)或上述金屬之合金,也可選自上列各種材料的任意組合。 In the previous specific embodiments, the first colloidal conductor pattern 32 and the second colloidal conductor pattern 34 respectively include a plurality of conductive particles 5 and form a plurality of wires on the two opposite surfaces 300, 302 of the substrate 30. The material of the conductive particles 5 may be selected from graphite, carbon black, carbon nanotubes, carbon spheres or carbon fibers, or gold (Au), silver (Ag), platinum (Pt), nickel (Ni), aluminum (Al). , titanium (Ti), iron (Fe), copper (Cu), molybdenum (Mo), tin (Sn), tantalum (Ta), magnesium (Mg), tungsten (W) or alloys of the above metals, may also be selected from Any combination of the above materials.
請參閱圖三A至圖三E,圖三A至圖三E係繪示根據本發明之一具體實施例之指紋感測電路板之製作方法的流程示意圖。圖三A至圖三E之製作方法可以製作出如圖二A及圖二B之指紋感測電路板3。以下對本具體實施例之指紋感測電路板之製作方法進行說明。 Please refer to FIG. 3A to FIG. 3E. FIG. 3A to FIG. 3E are schematic flowcharts showing a method for fabricating a fingerprint sensing circuit board according to an embodiment of the present invention. The fingerprint sensing circuit board 3 of FIG. 2A and FIG. 2B can be fabricated by the manufacturing method of FIG. 3A to FIG. Hereinafter, a method of manufacturing the fingerprint sensing circuit board of the specific embodiment will be described.
本具體實施例之指紋感測電路板之製作方法包含下列步驟:如圖三A所示,提供基板40,其中基板40具有相對之第一表面400及第二表面402,且第一表面400具有第一線路設置區4000,第二表面402具有對應第一線路設置區4000之第二線路設置區4020;如圖三B所示,於第一線路設置區4000上,沿第一方向塗佈液態之膠層而形成第一膠體線路層42a;如圖三C所示,於第二線路設置區4020上,沿第二方向塗佈液態之膠層而形成第二膠體線路層44a,且第二方向與第一方向係互相垂直的;如圖三D所示,佈設多個導電粒子46於第一膠體線路層42a以及第二膠體線路層44a上;以及,如圖三E所示,對液態膠層之 第一膠體線路層42a以及第二膠體線路層44a進行固化製程,使包含導電粒子46之液態膠層由液態轉變為半固態,並進一步轉變為固態,以分別形成第一膠體導線圖案42及第二膠體導線圖案44,第一膠體導線圖案42與第二膠體導線圖案44可參照圖二A及圖二B之第一膠體導線圖案32及第二膠體導線圖案34。本具體實施例之方法,於第一線路設置區4000及第二線路設置區4020中形成的第一膠體導線圖案42及第二膠體導線圖案44可對應構成網格狀的指紋感測線路,以供使用者直接或間接以手指接觸來感測其指紋。 The method for fabricating the fingerprint sensing circuit board of the present embodiment includes the following steps: as shown in FIG. 3A, a substrate 40 is provided, wherein the substrate 40 has a first surface 400 and a second surface 402 opposite thereto, and the first surface 400 has a first line setting area 4000, the second surface 402 has a second line setting area 4020 corresponding to the first line setting area 4000; as shown in FIG. 3B, on the first line setting area 4000, the liquid is applied in the first direction a first colloidal wiring layer 42a is formed on the second bonding region 4020, and a liquid adhesive layer is applied in the second direction to form a second colloidal wiring layer 44a, and a second The direction is perpendicular to the first direction; as shown in FIG. 3D, a plurality of conductive particles 46 are disposed on the first colloid line layer 42a and the second colloid line layer 44a; and, as shown in FIG. 3E, the liquid is Adhesive layer The first colloidal wiring layer 42a and the second colloidal wiring layer 44a are subjected to a curing process to convert the liquid adhesive layer containing the conductive particles 46 from a liquid state to a semi-solid state, and further converted into a solid state to form a first colloidal conductor pattern 42 and a first The second colloidal conductor pattern 44, the first colloidal conductor pattern 42 and the second colloidal conductor pattern 44 can be referred to the first colloidal conductor pattern 32 and the second colloidal conductor pattern 34 of FIGS. 2A and 2B. In the method of the embodiment, the first colloidal conductor pattern 42 and the second colloidal conductor pattern 44 formed in the first line setting area 4000 and the second line setting area 4020 may correspond to a grid-shaped fingerprint sensing line, The user can directly or indirectly touch the finger to sense the fingerprint.
同樣地,於圖三B及圖三C中,液態之膠層可採用例如網版印刷或噴墨列印等印刷方式形成於第一線路設置區4000及第二線路設置區4020上。在圖三D中,可藉由噴灑的方式將導電粒子46佈設在第一膠體線路層42a與第二膠體線路層44a上。而導電粒子46之材料可選自石墨、碳黑、奈米碳管、奈米碳球或碳纖維,或者金(Au)、銀(Ag)、鉑(Pt)、鎳(Ni)、鋁(Al)、鈦(Ti)、鐵(Fe)、銅(Cu)、鉬(Mo)、錫(Sn)、鉭(Ta)、鎂(Mg)、鎢(W)或上述金屬之合金,也可選自上列各種材料的任意組合。 Similarly, in FIG. 3B and FIG. 3C, the liquid glue layer can be formed on the first line setting area 4000 and the second line setting area 4020 by printing methods such as screen printing or ink jet printing. In FIG. 3D, conductive particles 46 may be disposed on the first colloid line layer 42a and the second colloid line layer 44a by spraying. The material of the conductive particles 46 may be selected from graphite, carbon black, carbon nanotubes, carbon spheres or carbon fibers, or gold (Au), silver (Ag), platinum (Pt), nickel (Ni), aluminum (Al). ), titanium (Ti), iron (Fe), copper (Cu), molybdenum (Mo), tin (Sn), tantalum (Ta), magnesium (Mg), tungsten (W) or alloys of the above metals, also available Any combination of the various materials listed above.
請參閱圖三F及圖三G,圖三F以及圖三G係繪示根據本發明之另一具體實施例之指紋感測電路板之製作方法的流程示意圖。於本具體實施例中,指紋感測電路板之製作方法仍包含如圖三A至圖三D所示之於基板上塗佈液態之膠層以及佈設多個導電粒子46於液態膠層的步驟,接著,於圖三E所示之液態膠體的固化製程中,第一膠體線路層42a以及第二膠體線路層44a的液態膠體由液態轉變為半固態。 Referring to FIG. 3F and FIG. 3G, FIG. 3F and FIG. 3G are schematic flowcharts showing a method for fabricating a fingerprint sensing circuit board according to another embodiment of the present invention. In this embodiment, the method for fabricating the fingerprint sensing circuit board further includes the steps of applying a liquid glue layer on the substrate and arranging the plurality of conductive particles 46 to the liquid glue layer as shown in FIG. 3A to FIG. 3D. Next, in the curing process of the liquid colloid shown in FIG. 3E, the liquid colloids of the first colloidal wiring layer 42a and the second colloidal wiring layer 44a are converted from a liquid state to a semi-solid state.
接著,如圖三F所示,以模具M2對半固態之膠層施加壓 力,使得第一膠體線路層42a以及第二膠體線路層44a平坦化,並使導電粒子46深入並均勻分佈於兩者之中;以及,如圖三G所示,對受壓後的第一膠體線路層42a以及第二膠體線路層44a的半固態膠層進一步進行固化製程,使其轉變為固態之膠層而形成第一膠體導線圖案42及第二膠體導線圖案44。本具體實施例之方法所製作出之指紋感測電路板的指紋感測電路具有均勻的導電性。 Next, as shown in FIG. 3F, a pressure is applied to the semi-solid glue layer by the mold M2. The force causes the first colloidal wiring layer 42a and the second colloidal wiring layer 44a to be planarized, and the conductive particles 46 are deeply and uniformly distributed in the two; and, as shown in FIG. 3G, the first after being pressed The semi-solid adhesive layer of the colloidal wiring layer 42a and the second colloidal wiring layer 44a is further subjected to a curing process to be converted into a solid adhesive layer to form a first colloidal conductor pattern 42 and a second colloidal conductor pattern 44. The fingerprint sensing circuit of the fingerprint sensing circuit board produced by the method of the embodiment has uniform conductivity.
請參閱圖三H,圖三H係繪示根據本發明之另一具體實施例之指紋感測電路板之製作方法的流程示意圖。於本具體實施例中,指紋感測電路板之製作方法仍包含如圖三A至圖三E之流程步驟,並且當執行完這些步驟獲得具有第一膠體導線圖案42及第二膠體導線圖案44的指紋感測電路後,進一步包含如圖三H所示之步驟:形成絕緣保護層48於基板40上,並分別至少局部覆蓋第一膠體導線圖案42及第二膠體導線圖案44。此步驟所形成之絕緣保護層48可參照圖二A之絕緣保護層36,其可用以提供指紋感測線路保護效果。 Please refer to FIG. 3H. FIG. 3H is a schematic flow chart of a method for fabricating a fingerprint sensing circuit board according to another embodiment of the present invention. In this embodiment, the method for fabricating the fingerprint sensing circuit board still includes the flow steps of FIG. 3A to FIG. 3E, and when the steps are performed, the first colloidal conductor pattern 42 and the second colloidal conductor pattern 44 are obtained. After the fingerprint sensing circuit, the method further includes the step of forming an insulating protective layer 48 on the substrate 40, and at least partially covering the first colloidal conductor pattern 42 and the second colloidal conductor pattern 44, respectively. The insulating protective layer 48 formed in this step can be referred to the insulating protective layer 36 of FIG. 2A, which can be used to provide a fingerprint sensing line protection effect.
綜上所述,本發明之導線圖案形成方法可在基板上簡易地形成電路結構,除了省去傳統以微影蝕刻製程製作導線圖案時的繁瑣製作過程之外,也可避免前述製程中使用的化學藥液會對環境造成汙染破壞的問題。此外,本發明之導線圖案形成方法可用以形成指紋感測電路板上之感測電路,其係以內含導電粒子的膠體作為導線圖案,步驟簡單且減少對環境有害之化學藥液的使用,可有效降低指紋感測電路板的生產成本。 In summary, the wire pattern forming method of the present invention can easily form a circuit structure on a substrate, and can avoid the cumbersome manufacturing process when the wire pattern is conventionally fabricated by a photolithography process, and can also avoid the use in the foregoing process. Chemical liquids can cause pollution damage to the environment. In addition, the wire pattern forming method of the present invention can be used to form a sensing circuit on a fingerprint sensing circuit board, which uses a colloid containing conductive particles as a wire pattern, which is simple in steps and reduces the use of chemical liquids harmful to the environment. It can effectively reduce the production cost of the fingerprint sensing circuit board.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描 述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。 With the detailed description of the above preferred embodiments, it is hoped that the description will be more clearly described. The scope and spirit of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
3‧‧‧指紋感測電路板 3‧‧‧Fingerprint sensing circuit board
30‧‧‧基板 30‧‧‧Substrate
32‧‧‧第一膠體導線圖案 32‧‧‧First colloidal wire pattern
34‧‧‧第二膠體導線圖案 34‧‧‧Second colloidal wire pattern
36‧‧‧絕緣保護層 36‧‧‧Insulating protective layer
38‧‧‧電子元件 38‧‧‧Electronic components
300‧‧‧第一表面 300‧‧‧ first surface
302‧‧‧第二表面 302‧‧‧ second surface
3000‧‧‧第一線路設置區 3000‧‧‧First line setting area
3020‧‧‧第二線路設置區 3020‧‧‧Second line setting area
5‧‧‧導電粒子 5‧‧‧ conductive particles
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI644601B (en) * | 2017-03-03 | 2018-12-11 | 致伸科技股份有限公司 | Jig of fingerprint recognition module and method for fabricating fingerprint recognition module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200715582A (en) * | 2005-10-05 | 2007-04-16 | Advanced Semiconductor Eng | Multi-chip sensor package |
CN201111087Y (en) * | 2007-09-05 | 2008-09-03 | 飞信半导体股份有限公司 | Touch sliding type finger print identifier encapsulation structure |
US20140103941A1 (en) * | 2012-10-12 | 2014-04-17 | Bruce C. S. CHOU | Capacitive sensing array device with high sensitivity and electronic apparatus using the same |
TWM490064U (en) * | 2014-05-15 | 2014-11-11 | Tpk Touch Solutions Xiamen Inc | Touch panel |
CN104479298A (en) * | 2014-12-29 | 2015-04-01 | 宁波大榭开发区综研化学有限公司 | Conductive resin composition and preparation method thereof |
TW201519724A (en) * | 2013-11-01 | 2015-05-16 | Ind Tech Res Inst | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101974191B1 (en) * | 2012-11-29 | 2019-04-30 | 에스케이하이닉스 주식회사 | Semiconductor device and method for forming the same |
-
2015
- 2015-05-22 TW TW104116425A patent/TWI550525B/en active
- 2015-07-29 CN CN201510454142.XA patent/CN106168862B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200715582A (en) * | 2005-10-05 | 2007-04-16 | Advanced Semiconductor Eng | Multi-chip sensor package |
CN201111087Y (en) * | 2007-09-05 | 2008-09-03 | 飞信半导体股份有限公司 | Touch sliding type finger print identifier encapsulation structure |
US20140103941A1 (en) * | 2012-10-12 | 2014-04-17 | Bruce C. S. CHOU | Capacitive sensing array device with high sensitivity and electronic apparatus using the same |
TW201519724A (en) * | 2013-11-01 | 2015-05-16 | Ind Tech Res Inst | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
TWM490064U (en) * | 2014-05-15 | 2014-11-11 | Tpk Touch Solutions Xiamen Inc | Touch panel |
CN104479298A (en) * | 2014-12-29 | 2015-04-01 | 宁波大榭开发区综研化学有限公司 | Conductive resin composition and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI644601B (en) * | 2017-03-03 | 2018-12-11 | 致伸科技股份有限公司 | Jig of fingerprint recognition module and method for fabricating fingerprint recognition module |
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CN106168862B (en) | 2019-06-25 |
TW201642178A (en) | 2016-12-01 |
CN106168862A (en) | 2016-11-30 |
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