TW200709445A - Bonding pads structure of the package - Google Patents
Bonding pads structure of the packageInfo
- Publication number
- TW200709445A TW200709445A TW094128449A TW94128449A TW200709445A TW 200709445 A TW200709445 A TW 200709445A TW 094128449 A TW094128449 A TW 094128449A TW 94128449 A TW94128449 A TW 94128449A TW 200709445 A TW200709445 A TW 200709445A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- package
- ribs
- pad
- bonding
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
A bonding pad fabricated on the substrate of the flip chip in package is disclosed. The pad connects electrically with the functional bumps of the driving chip via an anisotropic conductive film (ACF). The pad includes a substrate having bonding regions, a plurality of ribs made in the bonding regions on the substrate, and a conductive film formed on the ribs and parts of the substrate. The ribs are applied to make the bonding pad a rough surface. The recessions of the rough surface can trap the conductive particles of the ACF.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94128449A TWI263349B (en) | 2005-08-19 | 2005-08-19 | Bonding pads structure of the package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94128449A TWI263349B (en) | 2005-08-19 | 2005-08-19 | Bonding pads structure of the package |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI263349B TWI263349B (en) | 2006-10-01 |
TW200709445A true TW200709445A (en) | 2007-03-01 |
Family
ID=37966346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94128449A TWI263349B (en) | 2005-08-19 | 2005-08-19 | Bonding pads structure of the package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263349B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM408126U (en) | 2010-12-10 | 2011-07-21 | Chunghwa Picture Tubes Ltd | Conductive pad structure, chip package structure and active device array substrate |
CN113823637B (en) * | 2020-06-19 | 2024-05-10 | 元太科技工业股份有限公司 | Electronic device |
-
2005
- 2005-08-19 TW TW94128449A patent/TWI263349B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI263349B (en) | 2006-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |