TW200709445A - Bonding pads structure of the package - Google Patents

Bonding pads structure of the package

Info

Publication number
TW200709445A
TW200709445A TW094128449A TW94128449A TW200709445A TW 200709445 A TW200709445 A TW 200709445A TW 094128449 A TW094128449 A TW 094128449A TW 94128449 A TW94128449 A TW 94128449A TW 200709445 A TW200709445 A TW 200709445A
Authority
TW
Taiwan
Prior art keywords
substrate
package
ribs
pad
bonding
Prior art date
Application number
TW094128449A
Other languages
Chinese (zh)
Other versions
TWI263349B (en
Inventor
Shih-Ping Chou
Hui-Chang Chen
Chun-Yu Lee
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW94128449A priority Critical patent/TWI263349B/en
Application granted granted Critical
Publication of TWI263349B publication Critical patent/TWI263349B/en
Publication of TW200709445A publication Critical patent/TW200709445A/en

Links

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  • Wire Bonding (AREA)

Abstract

A bonding pad fabricated on the substrate of the flip chip in package is disclosed. The pad connects electrically with the functional bumps of the driving chip via an anisotropic conductive film (ACF). The pad includes a substrate having bonding regions, a plurality of ribs made in the bonding regions on the substrate, and a conductive film formed on the ribs and parts of the substrate. The ribs are applied to make the bonding pad a rough surface. The recessions of the rough surface can trap the conductive particles of the ACF.
TW94128449A 2005-08-19 2005-08-19 Bonding pads structure of the package TWI263349B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94128449A TWI263349B (en) 2005-08-19 2005-08-19 Bonding pads structure of the package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94128449A TWI263349B (en) 2005-08-19 2005-08-19 Bonding pads structure of the package

Publications (2)

Publication Number Publication Date
TWI263349B TWI263349B (en) 2006-10-01
TW200709445A true TW200709445A (en) 2007-03-01

Family

ID=37966346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94128449A TWI263349B (en) 2005-08-19 2005-08-19 Bonding pads structure of the package

Country Status (1)

Country Link
TW (1) TWI263349B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM408126U (en) 2010-12-10 2011-07-21 Chunghwa Picture Tubes Ltd Conductive pad structure, chip package structure and active device array substrate
CN113823637B (en) * 2020-06-19 2024-05-10 元太科技工业股份有限公司 Electronic device

Also Published As

Publication number Publication date
TWI263349B (en) 2006-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees