TW200709373A - Flip-chip-on-film package structure capable of preventing sealing material from overflowing - Google Patents

Flip-chip-on-film package structure capable of preventing sealing material from overflowing

Info

Publication number
TW200709373A
TW200709373A TW094128291A TW94128291A TW200709373A TW 200709373 A TW200709373 A TW 200709373A TW 094128291 A TW094128291 A TW 094128291A TW 94128291 A TW94128291 A TW 94128291A TW 200709373 A TW200709373 A TW 200709373A
Authority
TW
Taiwan
Prior art keywords
sealing material
flip
chip
overflowing
package structure
Prior art date
Application number
TW094128291A
Other languages
Chinese (zh)
Inventor
Ming-O Huang
Kuang-Hua Liu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW094128291A priority Critical patent/TW200709373A/en
Publication of TW200709373A publication Critical patent/TW200709373A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)

Abstract

The invention discloses a flip-chip-on-film package structure including a substrate, a flip chip, a plurality of bumps, a first sealing material, and a barricade. The substrate has an upper surface and a plurality of leads formed on the upper surface. The flip chip has an active surface and a plurality of pads formed on the active surface, wherein each of the pads is corresponding to one of the leads, respectively. Each of the bumps is used for connecting one of the pads and the corresponding lead. The first sealing material is coated to cover around the flip chip. The barricade is formed on the upper surface of the substrate and surrounds the flip chip. The barricade is used for preventing the first sealing material from overflowing.
TW094128291A 2005-08-19 2005-08-19 Flip-chip-on-film package structure capable of preventing sealing material from overflowing TW200709373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128291A TW200709373A (en) 2005-08-19 2005-08-19 Flip-chip-on-film package structure capable of preventing sealing material from overflowing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128291A TW200709373A (en) 2005-08-19 2005-08-19 Flip-chip-on-film package structure capable of preventing sealing material from overflowing

Publications (1)

Publication Number Publication Date
TW200709373A true TW200709373A (en) 2007-03-01

Family

ID=57911049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128291A TW200709373A (en) 2005-08-19 2005-08-19 Flip-chip-on-film package structure capable of preventing sealing material from overflowing

Country Status (1)

Country Link
TW (1) TW200709373A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8003442B2 (en) 2007-03-19 2011-08-23 Yu-Lin Yen Integrated cirucit package and method for fabrication thereof
CN104795363A (en) * 2014-01-17 2015-07-22 菱生精密工业股份有限公司 Copper-clad substrate with barrier structure and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8003442B2 (en) 2007-03-19 2011-08-23 Yu-Lin Yen Integrated cirucit package and method for fabrication thereof
US8624383B2 (en) 2007-03-19 2014-01-07 Yu-Lin Yen Integrated circuit package and method for fabrication thereof
CN104795363A (en) * 2014-01-17 2015-07-22 菱生精密工业股份有限公司 Copper-clad substrate with barrier structure and manufacturing method thereof

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