DE60304780D1 - Substratstruktur für eine elektronische Anordnung und elektronische Anordnung - Google Patents
Substratstruktur für eine elektronische Anordnung und elektronische AnordnungInfo
- Publication number
- DE60304780D1 DE60304780D1 DE60304780T DE60304780T DE60304780D1 DE 60304780 D1 DE60304780 D1 DE 60304780D1 DE 60304780 T DE60304780 T DE 60304780T DE 60304780 T DE60304780 T DE 60304780T DE 60304780 D1 DE60304780 D1 DE 60304780D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic device
- substrate structure
- substrate
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02516—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02609—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by physical means, e.g. sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- H10N30/708—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002254790A JP3947443B2 (ja) | 2002-08-30 | 2002-08-30 | 電子デバイス用基板および電子デバイス |
JP2002254790 | 2002-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60304780D1 true DE60304780D1 (de) | 2006-06-01 |
DE60304780T2 DE60304780T2 (de) | 2006-09-14 |
Family
ID=31712265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003604780 Expired - Lifetime DE60304780T2 (de) | 2002-08-30 | 2003-09-01 | Substratstruktur für eine elektronische Anordnung und elektronische Anordnung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6855996B2 (de) |
EP (1) | EP1396889B1 (de) |
JP (1) | JP3947443B2 (de) |
KR (1) | KR100607738B1 (de) |
CN (1) | CN1312728C (de) |
DE (1) | DE60304780T2 (de) |
TW (1) | TWI229373B (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004297359A (ja) * | 2003-03-26 | 2004-10-21 | Seiko Epson Corp | 表面弾性波素子、周波数フィルタ、発振器、電子回路、及び電子機器 |
US7411339B2 (en) * | 2003-11-28 | 2008-08-12 | Seiko Epson Corporation | Manufacturing method of actuator device and liquid jet apparatus provided with actuator device formed by manufacturing method of the same |
JP4737375B2 (ja) * | 2004-03-11 | 2011-07-27 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法 |
JP2006019935A (ja) | 2004-06-30 | 2006-01-19 | Toshiba Corp | 薄膜圧電共振器及びその製造方法 |
JP2006253172A (ja) * | 2005-03-08 | 2006-09-21 | Toshiba Corp | 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法 |
WO2006098101A1 (ja) * | 2005-03-16 | 2006-09-21 | Nec Corporation | 金属材料、金属材料を用いた半導体集積回路用配線および被覆膜 |
JP2007036914A (ja) * | 2005-07-29 | 2007-02-08 | Doshisha | 薄膜共振器 |
KR100655437B1 (ko) * | 2005-08-09 | 2006-12-08 | 삼성전자주식회사 | 반도체 웨이퍼 및 그 제조방법 |
JP4756461B2 (ja) * | 2005-10-12 | 2011-08-24 | 宇部興産株式会社 | 窒化アルミニウム薄膜およびそれを用いた圧電薄膜共振子 |
EP1945561B1 (de) * | 2005-10-14 | 2018-10-24 | STMicroelectronics Srl | Substratscheibenmontage für ein integriertes bauelement, herstellungsverfahren dafür und verwandtes integriertes bauelement |
JP4849445B2 (ja) * | 2006-03-06 | 2012-01-11 | 学校法人同志社 | 薄膜共振器 |
US20080179762A1 (en) * | 2007-01-25 | 2008-07-31 | Au Optronics Corporation | Layered structure with laser-induced aggregation silicon nano-dots in a silicon-rich dielectric layer, and applications of the same |
JP4537434B2 (ja) * | 2007-08-31 | 2010-09-01 | 株式会社日立製作所 | 酸化亜鉛薄膜、及びそれを用いた透明導電膜、及び表示素子 |
JP5475272B2 (ja) * | 2008-03-21 | 2014-04-16 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
JP5451280B2 (ja) * | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
EP2252077B1 (de) | 2009-05-11 | 2012-07-11 | STMicroelectronics Srl | Anordnung eines kapazitiven mikroelektromechanischen Akustikwandlers und Verpackung dafür |
US9012253B2 (en) | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
WO2013061572A1 (ja) * | 2011-10-28 | 2013-05-02 | キヤノンアネルバ株式会社 | 成膜方法、真空処理装置、半導体発光素子の製造方法、半導体発光素子、照明装置 |
JP5817673B2 (ja) * | 2011-11-18 | 2015-11-18 | 株式会社村田製作所 | 圧電薄膜共振子及び圧電薄膜の製造方法 |
CN103426968A (zh) * | 2012-05-14 | 2013-12-04 | 杜邦太阳能有限公司 | 增强导电氧化物层雾度的方法及透明导电氧化物透明基底 |
US8623747B1 (en) * | 2012-12-17 | 2014-01-07 | Translucent, Inc. | Silicon, aluminum oxide, aluminum nitride template for optoelectronic and power devices |
US9904776B2 (en) | 2016-02-10 | 2018-02-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fingerprint sensor pixel array and methods of forming same |
CN109478591B (zh) * | 2016-06-19 | 2023-07-25 | Iqe公司 | 用于RF滤波器应用的外延AlN/稀土氧化物结构 |
US10263136B1 (en) * | 2016-10-25 | 2019-04-16 | Triad National Security, Llc | Direct band gap group IV semiconductors and methods of preparing the same |
IT201700103489A1 (it) | 2017-09-15 | 2019-03-15 | St Microelectronics Srl | Metodo di fabbricazione di una membrana filtrante sottile, dispositivo trasduttore acustico includente la membrana filtrante, metodo di assemblaggio del dispositivo trasduttore acustico e sistema elettronico |
US11678581B2 (en) * | 2017-09-22 | 2023-06-13 | Tdk Corporation | Piezoelectric thin film element |
GB2571529B (en) | 2018-02-28 | 2021-04-14 | Novosound Ltd | Formation of piezoelectric devices |
JP7167626B2 (ja) * | 2018-03-09 | 2022-11-09 | 株式会社リコー | アクチュエータ、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置 |
TWI751352B (zh) * | 2018-07-05 | 2022-01-01 | 法商索泰克公司 | 集成射頻元件用底材及其製作方法 |
JP7115257B2 (ja) * | 2018-11-29 | 2022-08-09 | Tdk株式会社 | 圧電薄膜素子 |
JP7425960B2 (ja) * | 2019-10-29 | 2024-02-01 | Tdk株式会社 | 圧電薄膜素子 |
KR20220055526A (ko) * | 2020-10-26 | 2022-05-04 | 삼성디스플레이 주식회사 | 반도체 구조물을 포함하는 적층 구조물 및 이의 제조 방법 |
WO2023218690A1 (ja) * | 2022-05-12 | 2023-11-16 | 株式会社村田製作所 | Mems素子および圧電音響デバイス |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2924574B2 (ja) * | 1993-05-31 | 1999-07-26 | 富士ゼロックス株式会社 | 配向性強誘電体薄膜素子 |
JP3223233B2 (ja) | 1994-08-17 | 2001-10-29 | ティーディーケイ株式会社 | 酸化物薄膜、電子デバイス用基板および酸化物薄膜の形成方法 |
JP3357227B2 (ja) * | 1995-07-21 | 2002-12-16 | 日立建機株式会社 | 圧電素子およびその製造方法 |
KR100214765B1 (ko) * | 1996-03-21 | 1999-08-02 | 노영민 | 기판상에 (200)방향으로 우선 배향된 백금 박막 형성방법, 그 방법에 의하여 형성된 백금박막을 구비한 기판 및 전자소자 |
JP3813740B2 (ja) * | 1997-07-11 | 2006-08-23 | Tdk株式会社 | 電子デバイス用基板 |
JP3504851B2 (ja) * | 1998-02-20 | 2004-03-08 | 旭化成株式会社 | 化合物半導体膜の製造方法 |
JP2000022205A (ja) * | 1998-07-03 | 2000-01-21 | Tdk Corp | 半導体発光素子 |
JP4404995B2 (ja) * | 1999-07-26 | 2010-01-27 | 独立行政法人産業技術総合研究所 | A面サファイア基板を用いたZnO系化合物半導体発光素子およびその製法 |
US6329305B1 (en) * | 2000-02-11 | 2001-12-11 | Agere Systems Guardian Corp. | Method for producing devices having piezoelectric films |
JP4016583B2 (ja) * | 2000-08-31 | 2007-12-05 | 株式会社村田製作所 | 圧電薄膜共振子、フィルタおよび電子機器 |
JP2002076023A (ja) * | 2000-09-01 | 2002-03-15 | Nec Corp | 半導体装置 |
CN1154155C (zh) * | 2001-01-12 | 2004-06-16 | 中国科学院半导体研究所 | Ⅲ族氮化物单/多层异质应变薄膜的制作方法 |
JP2002222746A (ja) * | 2001-01-23 | 2002-08-09 | Matsushita Electric Ind Co Ltd | 窒化物半導体ウェーハ及びその製造方法 |
TW541723B (en) * | 2001-04-27 | 2003-07-11 | Shinetsu Handotai Kk | Method for manufacturing light-emitting element |
-
2002
- 2002-08-30 JP JP2002254790A patent/JP3947443B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-29 US US10/650,764 patent/US6855996B2/en not_active Expired - Lifetime
- 2003-08-29 KR KR20030060108A patent/KR100607738B1/ko not_active IP Right Cessation
- 2003-08-29 TW TW92123907A patent/TWI229373B/zh not_active IP Right Cessation
- 2003-09-01 CN CNB031556671A patent/CN1312728C/zh not_active Expired - Fee Related
- 2003-09-01 EP EP20030019853 patent/EP1396889B1/de not_active Expired - Fee Related
- 2003-09-01 DE DE2003604780 patent/DE60304780T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2004095843A (ja) | 2004-03-25 |
KR100607738B1 (ko) | 2006-08-01 |
CN1487563A (zh) | 2004-04-07 |
EP1396889B1 (de) | 2006-04-26 |
TWI229373B (en) | 2005-03-11 |
CN1312728C (zh) | 2007-04-25 |
US6855996B2 (en) | 2005-02-15 |
EP1396889A3 (de) | 2005-06-08 |
EP1396889A2 (de) | 2004-03-10 |
JP3947443B2 (ja) | 2007-07-18 |
DE60304780T2 (de) | 2006-09-14 |
KR20040020024A (ko) | 2004-03-06 |
US20040099918A1 (en) | 2004-05-27 |
TW200405433A (en) | 2004-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60304780D1 (de) | Substratstruktur für eine elektronische Anordnung und elektronische Anordnung | |
DE60039960D1 (de) | Lcd, elektronische vorrichtung und substrat für lcd | |
DE60330606D1 (de) | Elektronische Überwachungseinrichtung und Flickenaufbau | |
DE602004027511D1 (de) | Datenübertragungssteuergerät und elektronische vorrichtung | |
DE60130856D1 (de) | Treiberschaltung für ein organisches elektrolumineszierendes Element, elektronische Apparatur, und elektrooptische Anordnung | |
TWI318450B (en) | Integrated circuit device and electronic instrument | |
DE602004002529T8 (de) | Flexibler Träger und elektronische Vorrichtung | |
TWI319231B (en) | Integrated circuit device and electronic instrument | |
DE60130065D1 (de) | Elektronisches Bauteil und Halbleitervorrichtung | |
DE60312216D1 (de) | Beleuchtungsvorrichtung und elektronische einrichtung | |
DE60045143D1 (de) | Kühlvorrichtung für elektronisches Bauelement | |
DE502005002727D1 (de) | Gehäuse für eine elektronische Schaltung und Verfahren zum Abdichten des Gehäuses | |
DE602004028765D1 (de) | Tragbare elektronische einrichtungen mit multimodus-anpassschaltungen und betriebsverfahren dafür | |
DE602005022975D1 (de) | Elektronische Steuervorrichtung für Fahrzeuge und Steuerverfahren für Fahrzeuge | |
DE60140143D1 (de) | Halbleiterbauelement und tragbare elektronische vorrichtung | |
DE602004011421D1 (de) | Verdrahtungssubstrat und Elektronikbauteil-Verpackungsstruktur | |
DE602006005728D1 (de) | Eingabegerät und damit ausgestattete elektronische Geräte | |
DE602005006683D1 (de) | Abdichtelement und Dichtungsanordnung für elektronische Schaltung | |
DE602005023938D1 (de) | Elektronische Bauteile-Bestückungsvorrichtung und Methode | |
DE50203269D1 (de) | Elektronische schalteinrichtung und betriebsverfahren | |
DE60336501D1 (de) | Daten-verriegelungs-kreislauf und elektronische vorrichtung | |
DE60311849D1 (de) | Elektronische vorrichtung | |
DE602004022512D1 (de) | Adaptereinrichtung für eine elektronische einrichtung | |
DE602007013002D1 (de) | Substratstruktur und elektronische anordnung | |
DE60219274D1 (de) | Elektronische Vorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |