DE60123179T8 - Flüssigkeitsgekühlter Kühlkörper und zugehöriges Herstellungsverfahren - Google Patents

Flüssigkeitsgekühlter Kühlkörper und zugehöriges Herstellungsverfahren Download PDF

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Publication number
DE60123179T8
DE60123179T8 DE60123179T DE60123179T DE60123179T8 DE 60123179 T8 DE60123179 T8 DE 60123179T8 DE 60123179 T DE60123179 T DE 60123179T DE 60123179 T DE60123179 T DE 60123179T DE 60123179 T8 DE60123179 T8 DE 60123179T8
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DE
Germany
Prior art keywords
manufacturing process
heat sink
cooled heat
liquid cooled
related manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60123179T
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English (en)
Other versions
DE60123179D1 (de
DE60123179T2 (de
Inventor
Takeshi Saitama-shi Negishi
Toshiyuki Saitama-shi Nagase
Yoshiyuki Saitama-shi Nagatomo
Shoichi Saitama-shi Shimamura
Asao Sunto-gun Tokiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of DE60123179D1 publication Critical patent/DE60123179D1/de
Application granted granted Critical
Publication of DE60123179T2 publication Critical patent/DE60123179T2/de
Publication of DE60123179T8 publication Critical patent/DE60123179T8/de
Active legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60123179T 2000-07-21 2001-07-20 Flüssigkeitsgekühlter Kühlkörper und zugehöriges Herstellungsverfahren Active DE60123179T8 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000219971 2000-07-21
JP2000219971 2000-07-21
JP2001027617A JP2002098454A (ja) 2000-07-21 2001-02-05 液冷ヒートシンク及びその製造方法
JP2001027617 2001-02-05

Publications (3)

Publication Number Publication Date
DE60123179D1 DE60123179D1 (de) 2006-11-02
DE60123179T2 DE60123179T2 (de) 2007-09-06
DE60123179T8 true DE60123179T8 (de) 2008-04-03

Family

ID=26596372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60123179T Active DE60123179T8 (de) 2000-07-21 2001-07-20 Flüssigkeitsgekühlter Kühlkörper und zugehöriges Herstellungsverfahren

Country Status (4)

Country Link
US (1) US6563709B2 (de)
EP (1) EP1175135B1 (de)
JP (1) JP2002098454A (de)
DE (1) DE60123179T8 (de)

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Also Published As

Publication number Publication date
EP1175135B1 (de) 2006-09-20
US20020101718A1 (en) 2002-08-01
EP1175135A1 (de) 2002-01-23
JP2002098454A (ja) 2002-04-05
DE60123179D1 (de) 2006-11-02
US6563709B2 (en) 2003-05-13
DE60123179T2 (de) 2007-09-06

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