USD749713S1 - Heat exchanger - Google Patents

Heat exchanger Download PDF

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Publication number
USD749713S1
USD749713S1 US29/498,081 US201429498081F USD749713S US D749713 S1 USD749713 S1 US D749713S1 US 201429498081 F US201429498081 F US 201429498081F US D749713 S USD749713 S US D749713S
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US
United States
Prior art keywords
heat exchanger
ornamental
exchanger
heat
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/498,081
Inventor
Bahman Guyuron
Fred Bahr
Brad A. Pulver
Jamie Horvath
Glen M. Guyuron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INNOVATIVE MEDICAL EQUIPMENT LLC
Original Assignee
INNOVATIVE MEDICAL EQUIPMENT LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by INNOVATIVE MEDICAL EQUIPMENT LLC filed Critical INNOVATIVE MEDICAL EQUIPMENT LLC
Priority to US29/498,081 priority Critical patent/USD749713S1/en
Application granted granted Critical
Publication of USD749713S1 publication Critical patent/USD749713S1/en
Assigned to INNOVATIVE MEDICAL EQUIPMENT, LLC reassignment INNOVATIVE MEDICAL EQUIPMENT, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUYURON, BAHMAN, GUYURON, GLEN M., HORVATH, JAMIE, PULVER, BRAD A.
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Description

FIG. 1 is a perspective view of a heat exchanger showing our new design.
FIG. 2 is a top view thereof.
FIG. 3 is a bottom view thereof.
FIG. 4 is a rear view thereof.
FIG. 5 is a front view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a right side view thereof.
FIG. 8 is a perspective view of another embodiment of the heat exchanger.
FIG. 9 is a top view thereof.
FIG. 10 is a bottom view thereof.
FIG. 11 is a rear view thereof.
FIG. 12 is a front view thereof.
FIG. 13 is a left side view thereof; and,
FIG. 14 is a right side view thereof.
The broken line shown in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat exchanger, as shown and described.
US29/498,081 2014-07-31 2014-07-31 Heat exchanger Active USD749713S1 (en)

Priority Applications (1)

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US29/498,081 USD749713S1 (en) 2014-07-31 2014-07-31 Heat exchanger

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US29/498,081 USD749713S1 (en) 2014-07-31 2014-07-31 Heat exchanger

Publications (1)

Publication Number Publication Date
USD749713S1 true USD749713S1 (en) 2016-02-16

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US29/498,081 Active USD749713S1 (en) 2014-07-31 2014-07-31 Heat exchanger

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD915570S1 (en) * 2018-04-27 2021-04-06 Stelpro Design Inc. Heater

Citations (53)

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US2039593A (en) 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US4227068A (en) * 1976-02-20 1980-10-07 Societe Prl Convector heater
US4712158A (en) 1985-03-28 1987-12-08 Fujitsu Limited Cooling system for electronic circuit components
US5057968A (en) 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
US5070606A (en) 1988-07-25 1991-12-10 Minnesota Mining And Manufacturing Company Method for producing a sheet member containing at least one enclosed channel
US5285347A (en) 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5329993A (en) 1992-01-14 1994-07-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger and clamping plate
US5457342A (en) * 1994-03-30 1995-10-10 Herbst, Ii; Gerhardt G. Integrated circuit cooling apparatus
US5502967A (en) * 1991-03-28 1996-04-02 The Pilot Ink Co., Ltd. Color variation inducing device
US5590532A (en) * 1994-02-04 1997-01-07 Bunn-O-Matic Corporation Solid state liquid temperature processor
US5628769A (en) * 1994-09-30 1997-05-13 Saringer Research, Inc. Method and devices for producing somatosensory stimulation using temperature
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US5829516A (en) 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5859763A (en) 1995-12-23 1999-01-12 Electronics And Telecommunications Research Institute Multi chip module cooling apparatus
US5983995A (en) 1996-09-02 1999-11-16 Diamond Electric Mfg. Co., Ltd. Radiator
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
US6154363A (en) * 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement
US6189213B1 (en) 1996-11-15 2001-02-20 Furukawa Electric Co., Ltd. Method for manufacturing cooling unit comprising heat pipes and cooling unit
EP1175135A1 (en) 2000-07-21 2002-01-23 Mitsubishi Materials Corporation Liquid-cooled heat sink and manufacturing method thereof
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US6438964B1 (en) * 2001-09-10 2002-08-27 Percy Giblin Thermoelectric heat pump appliance with carbon foam heat sink
US20030044130A1 (en) * 2001-08-29 2003-03-06 Crane Stanford W. High performance optoelectronic packaging assembly
US20030183839A1 (en) * 2002-03-26 2003-10-02 Masayoshi Yamashita Thermoelectric module
US6725682B2 (en) 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US20040194942A1 (en) 2000-12-22 2004-10-07 Hitachi, Ltd Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof thereof
US6808013B2 (en) 2002-03-13 2004-10-26 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device with working liquid received in circulatory route
US6826923B2 (en) 2002-04-25 2004-12-07 Matsushita Electric Industrial Co., Ltd. Cooling device for semiconductor elements
US20050121065A1 (en) * 2003-12-09 2005-06-09 Otey Robert W. Thermoelectric module with directly bonded heat exchanger
US6923362B2 (en) 2002-09-30 2005-08-02 The Curators Of University Of Missouri Integral channels in metal components and fabrication thereof
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US20060137358A1 (en) * 2004-12-28 2006-06-29 Steve Feher Variable temperature cushion and heat pump
USD536773S1 (en) * 2005-03-04 2007-02-13 Housely Industries Limited Panel heater
US7178586B2 (en) 2001-07-13 2007-02-20 Lytron, Inc. Flattened tube cold plate for liquid cooling electrical components
US7298617B2 (en) 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US20080098750A1 (en) * 2006-10-27 2008-05-01 Busier Mark J Thermoelectric cooling/heating device
US7746641B2 (en) * 2007-04-30 2010-06-29 Yuan-Hsin Sun Radiation device for computer or electric appliances
USD621016S1 (en) * 2008-11-26 2010-08-03 Climaster Global Company, S.L. Radiator for heating
US20100281884A1 (en) * 2009-01-22 2010-11-11 John Myron Rawski Thermoelectric Management Unit
US7850061B2 (en) 2004-12-21 2010-12-14 Commissariat A L'energie Atomique Method for making a component including fluid flow channels
US20110032679A1 (en) * 2009-08-07 2011-02-10 Baek Joong-Hyun Semiconductor module
US20110271994A1 (en) * 2010-05-05 2011-11-10 Marlow Industries, Inc. Hot Side Heat Exchanger Design And Materials
US20120312029A1 (en) * 2009-12-16 2012-12-13 Brehm Holger Thermoelectric heat exchanger
US8359871B2 (en) * 2009-02-11 2013-01-29 Marlow Industries, Inc. Temperature control device
US20130061605A1 (en) * 2011-08-31 2013-03-14 L. Pierre de Rochemont Fully integrated thermoelectric devices and their application to aerospace de-icing systems
US8441794B2 (en) 2008-06-20 2013-05-14 Sapa Profiles (Shanghai) Ltd. Liquid cooler and method of its manufacture
US20130239589A1 (en) * 2012-03-16 2013-09-19 Nuventix, Inc. Peltier Cooler Equipped With Synthetic Jet Ejectors
US20140051155A1 (en) * 2010-12-03 2014-02-20 Biofire Diagnostics, Inc. Thermal cycler apparatus and related methods
US20140075960A1 (en) * 2012-09-19 2014-03-20 Chung Shan Institute Of Science And Technology, Armaments Bureau, M. N. D Cooling Device For Electronic Components
US20140208772A1 (en) * 2011-07-08 2014-07-31 Technische Universität Wien Cooling/heating device
US20140216060A1 (en) * 2008-01-28 2014-08-07 Micro Q Technologies Thermo-electric heat pump systems
US20140251579A1 (en) * 2013-03-05 2014-09-11 Wescast Industries, Inc. Heat recovery system and heat exchanger
US20150107270A1 (en) * 2013-10-17 2015-04-23 Hyundai Motor Company Heating and cooling cup holder
US20150221846A1 (en) * 2012-09-12 2015-08-06 Kelk Ltd. Peltier module for laser diode

Patent Citations (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2039593A (en) 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US4227068A (en) * 1976-02-20 1980-10-07 Societe Prl Convector heater
US4712158A (en) 1985-03-28 1987-12-08 Fujitsu Limited Cooling system for electronic circuit components
US5070606A (en) 1988-07-25 1991-12-10 Minnesota Mining And Manufacturing Company Method for producing a sheet member containing at least one enclosed channel
US5057968A (en) 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
US5285347A (en) 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5502967A (en) * 1991-03-28 1996-04-02 The Pilot Ink Co., Ltd. Color variation inducing device
US5329993A (en) 1992-01-14 1994-07-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger and clamping plate
US5829516A (en) 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5590532A (en) * 1994-02-04 1997-01-07 Bunn-O-Matic Corporation Solid state liquid temperature processor
US5457342A (en) * 1994-03-30 1995-10-10 Herbst, Ii; Gerhardt G. Integrated circuit cooling apparatus
US5628769A (en) * 1994-09-30 1997-05-13 Saringer Research, Inc. Method and devices for producing somatosensory stimulation using temperature
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US5859763A (en) 1995-12-23 1999-01-12 Electronics And Telecommunications Research Institute Multi chip module cooling apparatus
US5983995A (en) 1996-09-02 1999-11-16 Diamond Electric Mfg. Co., Ltd. Radiator
US6189213B1 (en) 1996-11-15 2001-02-20 Furukawa Electric Co., Ltd. Method for manufacturing cooling unit comprising heat pipes and cooling unit
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
US6154363A (en) * 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement
EP1175135A1 (en) 2000-07-21 2002-01-23 Mitsubishi Materials Corporation Liquid-cooled heat sink and manufacturing method thereof
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US20040194942A1 (en) 2000-12-22 2004-10-07 Hitachi, Ltd Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof thereof
US7178586B2 (en) 2001-07-13 2007-02-20 Lytron, Inc. Flattened tube cold plate for liquid cooling electrical components
US6725682B2 (en) 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US20030044130A1 (en) * 2001-08-29 2003-03-06 Crane Stanford W. High performance optoelectronic packaging assembly
US6438964B1 (en) * 2001-09-10 2002-08-27 Percy Giblin Thermoelectric heat pump appliance with carbon foam heat sink
US6808013B2 (en) 2002-03-13 2004-10-26 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device with working liquid received in circulatory route
US20030183839A1 (en) * 2002-03-26 2003-10-02 Masayoshi Yamashita Thermoelectric module
US6826923B2 (en) 2002-04-25 2004-12-07 Matsushita Electric Industrial Co., Ltd. Cooling device for semiconductor elements
US6923362B2 (en) 2002-09-30 2005-08-02 The Curators Of University Of Missouri Integral channels in metal components and fabrication thereof
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US20050121065A1 (en) * 2003-12-09 2005-06-09 Otey Robert W. Thermoelectric module with directly bonded heat exchanger
US7850061B2 (en) 2004-12-21 2010-12-14 Commissariat A L'energie Atomique Method for making a component including fluid flow channels
US20060137358A1 (en) * 2004-12-28 2006-06-29 Steve Feher Variable temperature cushion and heat pump
USD536773S1 (en) * 2005-03-04 2007-02-13 Housely Industries Limited Panel heater
US7298617B2 (en) 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US20080098750A1 (en) * 2006-10-27 2008-05-01 Busier Mark J Thermoelectric cooling/heating device
US7746641B2 (en) * 2007-04-30 2010-06-29 Yuan-Hsin Sun Radiation device for computer or electric appliances
US20140216060A1 (en) * 2008-01-28 2014-08-07 Micro Q Technologies Thermo-electric heat pump systems
US8441794B2 (en) 2008-06-20 2013-05-14 Sapa Profiles (Shanghai) Ltd. Liquid cooler and method of its manufacture
USD621016S1 (en) * 2008-11-26 2010-08-03 Climaster Global Company, S.L. Radiator for heating
US20100281884A1 (en) * 2009-01-22 2010-11-11 John Myron Rawski Thermoelectric Management Unit
US8359871B2 (en) * 2009-02-11 2013-01-29 Marlow Industries, Inc. Temperature control device
US20110032679A1 (en) * 2009-08-07 2011-02-10 Baek Joong-Hyun Semiconductor module
US20120312029A1 (en) * 2009-12-16 2012-12-13 Brehm Holger Thermoelectric heat exchanger
US20110271994A1 (en) * 2010-05-05 2011-11-10 Marlow Industries, Inc. Hot Side Heat Exchanger Design And Materials
US20140051155A1 (en) * 2010-12-03 2014-02-20 Biofire Diagnostics, Inc. Thermal cycler apparatus and related methods
US20140208772A1 (en) * 2011-07-08 2014-07-31 Technische Universität Wien Cooling/heating device
US20130061605A1 (en) * 2011-08-31 2013-03-14 L. Pierre de Rochemont Fully integrated thermoelectric devices and their application to aerospace de-icing systems
US20130239589A1 (en) * 2012-03-16 2013-09-19 Nuventix, Inc. Peltier Cooler Equipped With Synthetic Jet Ejectors
US20150221846A1 (en) * 2012-09-12 2015-08-06 Kelk Ltd. Peltier module for laser diode
US20140075960A1 (en) * 2012-09-19 2014-03-20 Chung Shan Institute Of Science And Technology, Armaments Bureau, M. N. D Cooling Device For Electronic Components
US20140251579A1 (en) * 2013-03-05 2014-09-11 Wescast Industries, Inc. Heat recovery system and heat exchanger
US20150107270A1 (en) * 2013-10-17 2015-04-23 Hyundai Motor Company Heating and cooling cup holder

Non-Patent Citations (4)

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Title
Andrew, Water Cooling Twin Peltiers, 1 page, Nov. 1, 2010.
Foster, It's Copper Cool'n. Time, 2 pages, <<http://www.unofficial3d.com/stevefoster/copper.htm>>, at least as early as 2007.
Kandlikar and Hayner II, Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices-Thermal Design and Manufacturing Considerations, 2009, p. 921, vol. 30 No. 12, Taylor and Francis Group, LLC.
Nelson,The Evolution of the PC Cooling Water Block, 1 page, <<http://www.overclockers.com/the-evolution-of-the-pc-cooling-waterblock/>>, at least as early as 2012.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD915570S1 (en) * 2018-04-27 2021-04-06 Stelpro Design Inc. Heater

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ERR Erratum

Free format text: IN THE NOTICE OF CERTIFICATE OF CORRECTION APPEARING IN THE OFFICIAL GAZETTE OF JULY 12, 2016, DELETE ALL REFERENCE TO THE CERTIFICATE OF CORRECTION, ISSUED ON JUNE 21, 2016 FOR PATENT NO. D. 749,713. THERE WAS NO CORRECTION TO THE INVENTORSHIP UNDER 1.48 ACKNOWLEDGED BY CORRECTED FILING RECEIPT DURING PENDENCY. THE CERTIFICATE OF CORRECTION WHICH ISSUED ON JUNE 21, 2016 WAS PUBLISHED IN ERROR AND SHOULD NOT HAVE BEEN ISSUED FOR THIS PATENT.