FR3056018B1 - Module de puissance multi-faces - Google Patents

Module de puissance multi-faces Download PDF

Info

Publication number
FR3056018B1
FR3056018B1 FR1658630A FR1658630A FR3056018B1 FR 3056018 B1 FR3056018 B1 FR 3056018B1 FR 1658630 A FR1658630 A FR 1658630A FR 1658630 A FR1658630 A FR 1658630A FR 3056018 B1 FR3056018 B1 FR 3056018B1
Authority
FR
France
Prior art keywords
power module
faces power
faces
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1658630A
Other languages
English (en)
Other versions
FR3056018A1 (fr
Inventor
Jose Saiz
Selim Dagdag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transport Technologies SAS
Original Assignee
Alstom Transport Technologies SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Transport Technologies SAS filed Critical Alstom Transport Technologies SAS
Priority to FR1658630A priority Critical patent/FR3056018B1/fr
Priority to DE102017119368.5A priority patent/DE102017119368A1/de
Publication of FR3056018A1 publication Critical patent/FR3056018A1/fr
Application granted granted Critical
Publication of FR3056018B1 publication Critical patent/FR3056018B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
FR1658630A 2016-09-15 2016-09-15 Module de puissance multi-faces Active FR3056018B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1658630A FR3056018B1 (fr) 2016-09-15 2016-09-15 Module de puissance multi-faces
DE102017119368.5A DE102017119368A1 (de) 2016-09-15 2017-08-24 Multiface-Leistungsmodul

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1658630 2016-09-15
FR1658630A FR3056018B1 (fr) 2016-09-15 2016-09-15 Module de puissance multi-faces

Publications (2)

Publication Number Publication Date
FR3056018A1 FR3056018A1 (fr) 2018-03-16
FR3056018B1 true FR3056018B1 (fr) 2018-11-23

Family

ID=57750094

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1658630A Active FR3056018B1 (fr) 2016-09-15 2016-09-15 Module de puissance multi-faces

Country Status (2)

Country Link
DE (1) DE102017119368A1 (fr)
FR (1) FR3056018B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019111366B3 (de) * 2019-05-02 2020-05-14 Fachhochschule Kiel Kompaktes Leistungselektronik-Modul mit vergrößerter Kühlfläche

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19846156C1 (de) * 1998-10-07 2000-07-27 Bosch Gmbh Robert Anordnung eines mehrphasigen Umrichters
JP2002098454A (ja) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
JP5289348B2 (ja) 2010-01-22 2013-09-11 三菱電機株式会社 車載用電力変換装置
CN104734533B (zh) * 2013-12-19 2018-01-12 联合汽车电子有限公司 紧凑型逆变器及其制造方法
CN203691257U (zh) * 2013-12-19 2014-07-02 联合汽车电子有限公司 紧凑型逆变器
TWI539894B (zh) * 2014-11-28 2016-06-21 財團法人工業技術研究院 功率模組

Also Published As

Publication number Publication date
FR3056018A1 (fr) 2018-03-16
DE102017119368A1 (de) 2018-03-15

Similar Documents

Publication Publication Date Title
DK3447785T3 (da) Strømfordeler
SG10201504271YA (en) Power module
DK3295552T3 (da) Effektomformer
DE112017005067A5 (de) Hybridmodul
DE112017004522A5 (de) Hybridmodul
ZA201904503B (en) Traction power module
DK3309949T3 (da) Effektomformningsindretning
FR3021173B1 (fr) Convertisseur de puissance multi-niveaux
SG10201504273UA (en) Power module
DK3402947T3 (da) Modultelt
SG10201508520PA (en) Power module
AU201716398S (en) Power module
ES2776454T8 (es) Estación de energía undimotriz
DK3522045T3 (da) Overlappende solcellemodul
DK3370264T3 (da) Solcellemodul
DE112014006823A5 (de) Modulanordnung
FR3019609B1 (fr) Courroie de transmission de puissance.
DK3442090T3 (da) Ionisk elkraftværk
DK3265671T3 (da) Vindkraftsystem
FR3056018B1 (fr) Module de puissance multi-faces
DK3316436T3 (da) Energiomdannelsesapparat
MA45474A (fr) Module photovoltaïque
LU92742B1 (de) Verteiltes energie-wandlungs-system
TWI563901B (en) Power module
FI20165953A (fi) Monitoimivoimala

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20180316

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9