SG10201504271YA - Power module - Google Patents
Power moduleInfo
- Publication number
- SG10201504271YA SG10201504271YA SG10201504271YA SG10201504271YA SG10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA SG 10201504271Y A SG10201504271Y A SG 10201504271YA
- Authority
- SG
- Singapore
- Prior art keywords
- power module
- module
- power
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1035—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10174—Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
US15/165,863 US9871463B2 (en) | 2015-05-29 | 2016-05-26 | Power module |
EP16171741.8A EP3107120B1 (en) | 2015-05-29 | 2016-05-27 | Power semiconductor module |
CN201610364955.4A CN106206483B (en) | 2015-05-29 | 2016-05-27 | Power module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201504271YA true SG10201504271YA (en) | 2016-12-29 |
Family
ID=57399304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201504271YA SG10201504271YA (en) | 2015-05-29 | 2015-05-29 | Power module |
Country Status (4)
Country | Link |
---|---|
US (1) | US9871463B2 (en) |
EP (1) | EP3107120B1 (en) |
CN (1) | CN106206483B (en) |
SG (1) | SG10201504271YA (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI550391B (en) * | 2015-10-23 | 2016-09-21 | 台達電子工業股份有限公司 | Integrated power module package structure |
DE102017101185B4 (en) * | 2017-01-23 | 2020-07-16 | Infineon Technologies Ag | A semiconductor module comprising transistor chips, diode chips and driver chips, arranged in a common plane, method for its production and integrated power module |
CN108346645A (en) * | 2017-01-24 | 2018-07-31 | 比亚迪股份有限公司 | A kind of power module and its manufacturing method |
EP3355349B1 (en) * | 2017-01-26 | 2022-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Efficient heat removal from component carrier with embedded diode |
JP6809294B2 (en) * | 2017-03-02 | 2021-01-06 | 三菱電機株式会社 | Power module |
US10411609B2 (en) * | 2017-12-22 | 2019-09-10 | Panasonic Intellectual Property Management Co., Ltd. | Substrate mounted inverter device |
EP3557614A1 (en) * | 2018-04-17 | 2019-10-23 | Siemens Aktiengesellschaft | Power module with a power electronic component on a substrate plate and power electronic circuit with such a power module |
US11183460B2 (en) * | 2018-09-17 | 2021-11-23 | Texas Instruments Incorporated | Embedded die packaging with integrated ceramic substrate |
FR3087614B1 (en) * | 2018-10-19 | 2020-10-09 | Sagemcom Energy & Telecom Sas | ELECTRICAL BOARD INCLUDING A RECOVERY BRIDGE |
SG10201809987YA (en) * | 2018-11-09 | 2020-06-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and packaging process |
US20200161206A1 (en) * | 2018-11-20 | 2020-05-21 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor manufacturing process |
CN109461720A (en) * | 2018-12-12 | 2019-03-12 | 湖北方晶电子科技有限责任公司 | A kind of power semiconductor patch encapsulating structure |
US20200194347A1 (en) * | 2018-12-18 | 2020-06-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Semiconductor package and method of making the same |
CN111599697A (en) * | 2020-05-28 | 2020-08-28 | 矽磐微电子(重庆)有限公司 | Semiconductor module packaging method and semiconductor module |
US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
DE102022113636A1 (en) | 2022-05-31 | 2023-11-30 | Rolls-Royce Deutschland Ltd & Co Kg | Electrical module |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10355925B4 (en) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and method of its manufacture |
DE102004019443B3 (en) * | 2004-04-19 | 2005-08-11 | Siemens Ag | Power module has passive semiconductor chip arranged above active semiconductor chip on second film in close contact with surfaces of planar conducting tracks and first film of insulating material with planar conducting tracks |
US7880283B2 (en) | 2006-04-25 | 2011-02-01 | International Rectifier Corporation | High reliability power module |
US8138587B2 (en) * | 2008-09-30 | 2012-03-20 | Infineon Technologies Ag | Device including two mounting surfaces |
CN102405524A (en) * | 2009-02-20 | 2012-04-04 | 国家半导体公司 | Integrated circuit micro-module |
DE102009002993B4 (en) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Power semiconductor module with spaced circuit carriers |
JPWO2010147202A1 (en) * | 2009-06-19 | 2012-12-06 | 株式会社安川電機 | Power converter |
US8120158B2 (en) * | 2009-11-10 | 2012-02-21 | Infineon Technologies Ag | Laminate electronic device |
JP5423874B2 (en) * | 2010-03-18 | 2014-02-19 | 日本電気株式会社 | Semiconductor element-embedded substrate and manufacturing method thereof |
JP5062302B2 (en) * | 2010-06-29 | 2012-10-31 | 株式会社デンソー | Mounting structure of wiring board with built-in electronic components to cooler and mounting method thereof |
US9064869B2 (en) | 2013-08-23 | 2015-06-23 | Infineon Technologies Ag | Semiconductor module and a method for fabrication thereof by extended embedding technologies |
SG10201400390YA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int L Singapore Pte Ltd | Package structure |
SG10201400396WA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and stacked package module with the same |
SG10201401622RA (en) * | 2014-04-17 | 2015-11-27 | Delta Electronics Int’L Singapore Pte Ltd | Package structure |
SG10201501021PA (en) * | 2015-02-10 | 2016-09-29 | Delta Electronics Int L Singapore Pte Ltd | Package structure |
SG10201504273UA (en) * | 2015-05-29 | 2016-12-29 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
SG10201508520PA (en) * | 2015-10-14 | 2017-05-30 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
-
2015
- 2015-05-29 SG SG10201504271YA patent/SG10201504271YA/en unknown
-
2016
- 2016-05-26 US US15/165,863 patent/US9871463B2/en active Active
- 2016-05-27 CN CN201610364955.4A patent/CN106206483B/en active Active
- 2016-05-27 EP EP16171741.8A patent/EP3107120B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3107120C0 (en) | 2023-08-30 |
US9871463B2 (en) | 2018-01-16 |
US20160352246A1 (en) | 2016-12-01 |
CN106206483A (en) | 2016-12-07 |
CN106206483B (en) | 2018-12-14 |
EP3107120A1 (en) | 2016-12-21 |
EP3107120B1 (en) | 2023-08-30 |
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