TWM250533U - Flow channel structure of collector of liquid-cooling heat dissipating device - Google Patents

Flow channel structure of collector of liquid-cooling heat dissipating device Download PDF

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Publication number
TWM250533U
TWM250533U TW093202181U TW93202181U TWM250533U TW M250533 U TWM250533 U TW M250533U TW 093202181 U TW093202181 U TW 093202181U TW 93202181 U TW93202181 U TW 93202181U TW M250533 U TWM250533 U TW M250533U
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TW
Taiwan
Prior art keywords
liquid
collector
heat
sheet
partition
Prior art date
Application number
TW093202181U
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Chinese (zh)
Inventor
Rung-Feng Huang
Jr-Jian Huang
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW093202181U priority Critical patent/TWM250533U/en
Priority to US10/851,060 priority patent/US20050178531A1/en
Publication of TWM250533U publication Critical patent/TWM250533U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M250533 捌、新型說明·· 【新型所屬之技術領域】 本創作係關於一種液冷式银:埶担里 ^ 八政熱裝置之集熱器流道結 構,尤指一種適用於電腦裝置之饬人々I&从 流道結構 罝之液冷式散熱裝置之集熱器 【先前技術】 10 其内部之主要發熱電子元件係為 為有效將其所產生之熱量散出, 於一般電腦裝置中, 其中央處理單元(CPU),而 則必須組設有一散熱裝置 請參閱圖1係習知水冷式散熱裝置之立體圖,其主要 包括有一集熱單元91、一水餡Q9 ^ ^ 水相92、以及一散熱單元93, 八中之集熱皁元91係用以收隹μ、+、士 收果上述中央處理单元(CPU)等 發熱電子元件所產生之埶量祐 15 — …、里並經由熱官94將熱量帶至散 熱單元93加以散出,而匕雜Q9 ^ θ 而夂相92則疋用以儲存整體散熱裝 置所使用之液體介質。 口月參,圖2係習知集熱單元之立體分解圖,其中顯示 押一集熱器片911、—塾片912、及-上蓋913,且於集熱 W 。上凹"又有/夜體流道910,然而,此液體流道910 單抓道順向流動之設計,亦即液體於該液體流 道910内流動時,液體與液體流道91〇之接觸面積僅限於 液體机迢910之兩側壁,且因此液體僅能吸收液體流道 兩彳土之”、、里而無法得到一較大面積之吸熱效果。此外, 20 M250533 液體於液體流道91〇内係處於不斷流動之狀態,因此於某 特定位置觀之’該特定位置之液體並無法停留太久時間 以有效吸收集熱器片911之熱量,故前述習知集熱單元 仍舊無法有效達成集熱之目的與效果,並非十分理想。 5 【新型内容】 %本創作之主要目的係在提供一種液冷式散熱裝置之集 熱器流道結構,俾能提昇集熱器片之集熱效果,並藉以提 高整體散熱裝置之使用效益。 1〇 為達成上述目的,本創作之液冷式散熱裝置之集熱器 流道結構主要包括有一集熱器片、以及一上蓋,其中之上 蓋係密封罩蓋於集熱器片上並與集熱器片之間形成一密閉 谷至,且上蓋並開設有二開口其係分別連通外界與密閉容 室之間。 ^ 15 本創作之特色在於上述之密閉容室内並設有至少一分 隔片,且此至少一分隔片係將密閉容室分隔成至少二分隔 區,相鄰之二分隔區並彼此於相同側連通而形成一迷宮通 道,且每一分隔區内設有複數個平行鰭片、以及複數個平 行流道,前述逑宮通道之前端、以及後端並分別對應且連 20 通至上蓋之二開口。 由上述可知,藉由複數個平行鰭片、以及複數個平行 流道之設計,可增加散熱裝置内之液體與流道之接觸面 積,並可藉以增加液體所吸收之熱量。此外,藉由分隔區 所形成之迷宮通道、以及分隔區内之平行鰭片與平行流道M250533 新型, New Type Description ... [Technical Field to which the New Type belongs] This creation is about a liquid-cooled silver: 埶 Ba Li ^ The collector flow path structure of the Bazheng Thermal Device, especially a person suitable for a computer device. I & a collector of liquid-cooled heat sink with a runner structure [prior art] 10 The main heat-generating electronic components inside are designed to effectively dissipate the heat generated by it, in a general computer device, in the center The processing unit (CPU) must be equipped with a heat sink. Please refer to FIG. 1 for a perspective view of a conventional water-cooled heat sink, which mainly includes a heat collecting unit 91, a water filling Q9 ^ ^ water phase 92, and a heat sink. Units 93 and 89 of the heat-collecting soap element 91 are used to collect the heat generated by the heating electronic components such as the above-mentioned central processing unit (CPU), such as μ, +, and the fruit. The heat is dissipated to the heat-dissipating unit 93, and the Q9 ^ θ and the phase 92 are used to store the liquid medium used by the overall heat-dissipating device. Mouth ginseng, Fig. 2 is an exploded perspective view of a conventional heat collecting unit, which shows a heat collector sheet 911, a cymbal sheet 912, and an upper cover 913, which are collected at the heat collection W. Concave " There is a / night body flow channel 910, however, the liquid flow channel 910 is designed to flow in a single direction, that is, the liquid is in contact with the liquid flow channel 91 when the liquid flows in the liquid flow channel 910. The area is limited to the two side walls of the liquid machine 910, and therefore the liquid can only absorb the two sides of the liquid flow path, and cannot get a large area of heat absorption effect. In addition, 20 M250533 liquid in the liquid flow path 91. The internal system is in a state of continuous flow, so the liquid at that specific position cannot stay for too long to effectively absorb the heat of the heat collector sheet 911 at the specific position. Therefore, the conventional heat collection unit still cannot effectively achieve the collection. The purpose and effect of heat are not very ideal. 5 [New content]% The main purpose of this creation is to provide a liquid-cooled heat sink with a collector flow channel structure, which can improve the heat collection effect of the collector sheet. In order to improve the use efficiency of the overall heat dissipation device. 10 In order to achieve the above purpose, the flow path structure of the collector of the liquid-cooled heat dissipation device of this creation mainly includes a heat collector sheet, and an upper cover, The middle cover is a sealing cover on the heat collector sheet and forms a closed valley between the heat collector sheet and the upper cover. The upper cover is provided with two openings which are connected between the outside and the closed container. ^ 15 of this creation It is characterized in that at least one partition is provided in the above-mentioned closed chamber, and the at least one partition divides the closed chamber into at least two partitions, and the adjacent two partitions communicate with each other on the same side to form a maze passage. And each partition area is provided with a plurality of parallel fins and a plurality of parallel flow channels, the front end and the rear end of the aforesaid palace passage are respectively corresponding and connected to the two openings of the upper cover. From the above, it can be known that The design of a plurality of parallel fins and a plurality of parallel flow channels can increase the contact area between the liquid and the flow channels in the heat sink, and can increase the heat absorbed by the liquid. In addition, a maze formed by the partition Channels, and parallel fins and parallel channels in the partition

可使政熱裝置内之液體於流道内流動時,因受到 干擾而減緩复洎诘,认甘 ^ ^ J ^ ^ ^ ;某一特定位置觀之,該特定位置之 有較多之時間以吸收熱量,亦即液體可藉以增加 μΓΓ之熱量。故可知本創作確實可有效提昇集熱器片 ......效果’並可藉以提高整體散熱裝置之使用效益。 /上述之集熱器片並可包括有一上表面,且至少一分隔 片係凸α於上表面上’同時複數個平行籍片亦可直接凸設 於上表面上,如此之設計於製造加工上極為容易。 10【實施方式】 為此讓貴審查委員能更瞭解本創作之技術内容,特 舉二較佳具體實施例說明如下。 睛同時參閱圖3係本創作第一較佳實施例之立體分解 S及圖4係圖3之剖面圖,其中顯示有一集熱器片1、以及 15 一上蓋2,且其中之上蓋2係密封罩蓋於集熱器片1上,上蓋 2並與集熱器片1之間形成一密閉容室10,同時上蓋2並開設 有二開口 21,22,此二開口 21,22則係分別連通外界與密閉容 室10之間。 此外’上述之集熱器片1於本實施例中係使用一銅片, 2〇其並包括有一上表面11,且於此上表面11上凸設有三個分 隔片3其並位於密閉容室10内,此三個分隔片3並將密閉容 室10分隔成四個分隔區41〜44,其中二二相鄰之二分隔區 41〜44並彼此於相同側連通而形成一迷宮通道4。 7 M250533 另外,於每一分隔區41〜44内並設有複數個平行轉片 31、以及複數個平行流道4u〜441,其中之複數個平行鰭月 31係同樣凸設於集熱器片丨之上表面丨丨上,而迷宮通道4之 前端4(H、以及後端4〇2則係分別對應並連通至上蓋2之二開 5 口 21,22。 开 藉由上述結構所形成之散熱裝置,其内部之散熱用之 液體可藉由上蓋2之二開口 21,22而流入或流出密閉容室 1〇,且液體流入時可於複數個平行流道411〜441内流動,並 可與複數個平行鰭片3 1接觸以吸收熱量,而由於複數個平 10行鰭片3 1具有較多之面積,因此可增加液體於平行流道 411〜441内流動時之接觸面積,而可藉以增加液體所吸收之 熱量。 此外,液體於複數個平行流道4丨丨〜44丨内流動時,受到 複數個平行鰭片31以及分隔片3之影響,使得液體於複數個 15平行流道411〜441内流動時,會受到干擾而減緩其流速,就 某特疋位置觀之,該特定位置處之液體可具有較多之時 間以吸收集熱器片丨之熱量,亦即散熱裝置内1液體可藉以 私加其所吸收之熱量。故藉由上述之結構可確實有效提昇 集熱器片1之集熱效果,並可藉以提高整體散熱裝置之使用 20 效益。 π另外,上述之分隔片3與平行鰭片31係直接凸設於集熱 器片1之上表面丨丨上,如此之設計對於製造加工而言極為容 易0 M250533 請參閱圖5係本創作第二較佳實施例之立體圖,其主要 結構皆與上述第一較佳實施例相同,唯差別在於本實施例 之集熱器片5更包括有一下表面5〇,且此下表面別形成有一 集熱區51,此集熱區51係呈向下凸起狀並可對應鄰接於一 5發熱電子元件(圖未示)而加以吸熱。 上述設計主要在於一般發熱電子元件其周圍可能組設 有其他局度較高之電子元件,當集熱器片5組設於發熱電子 元件上時,集熱器片5有可能干涉前述之電子元件,故藉由 上述凸起之集熱區51之設計,可使集熱區51確實對應鄰接 10於發熱電子元件上,並同時促使集熱器片5具有一較高之高 度而避免干涉前述發熱電子元件周圍之其他電子元件。 上述實施例僅係為了方便說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 於上述實施例。 15 【圖式簡單說明】 圖1係習知水冷式散熱裝置之立體圖。 圖2係習知集熱單元之立體分解圖。 圖3係本創作第一較佳實施例之立體分解圖。 20 圖4係圖3之剖面圖。 圖5係本創作第二較佳實施例之立體圖。 【圖號說明】 1集熱器片 10密閉容室 11上表面 M250533 2 上蓋 31 平行鰭片 402後端 5 集熱器片 21,22 開口 4 迷宮通道 41〜44分隔區 50 下表面 3 分隔片 401前端 411〜441平行流道 51 集熱區When the liquid in the political heating device flows in the flow path, it will slow down and recover due to interference. Recognize ^ ^ J ^ ^ ^ In terms of a specific position, there is more time for the specific position to absorb. Heat, which means that the liquid can increase the heat of μΓΓ. Therefore, it can be known that this creation can indeed effectively improve the effect of the heat collector sheet ... and can improve the use efficiency of the overall heat dissipation device. / The above-mentioned heat collector sheet may include an upper surface, and at least one separator sheet is convex α on the upper surface. At the same time, a plurality of parallel sheets can also be directly convex on the upper surface. This design is designed for manufacturing and processing. Extremely easy. 10 [Implementation] In order to allow your review committee to better understand the technical content of this creation, the second preferred embodiment is described below. At the same time, referring to FIG. 3 is a three-dimensional exploded view S of the first preferred embodiment of the creation and FIG. 4 is a cross-sectional view of FIG. 3, which shows a collector piece 1, and 15 an upper cover 2, and the upper cover 2 is sealed. The cover is placed on the heat collector sheet 1, and the upper cover 2 forms a closed container 10 with the heat collector sheet 1. At the same time, the upper cover 2 is provided with two openings 21 and 22, and the two openings 21 and 22 are connected respectively. Between the outside world and the closed container 10. In addition, the above-mentioned heat collector sheet 1 is a copper sheet in this embodiment, and it includes an upper surface 11, and three partition sheets 3 are protruded on the upper surface 11 and are located in a closed container. In 10, the three partitions 3 divide the sealed container 10 into four partitions 41 to 44. Two adjacent partitions 41 to 44 communicate with each other on the same side to form a labyrinth channel 4. 7 M250533 In addition, a plurality of parallel rotors 31 and a plurality of parallel runners 4u to 441 are provided in each of the partition areas 41 to 44. Among them, a plurality of parallel fin moons 31 are also convexly arranged on the collector plate.丨 Upper surface 丨 丨, and the front end 4 (H, and rear end 402 of the labyrinth channel 4 correspond to and communicate with the upper cover 2 bis and open 5 mouths 21, 22 respectively. The opening formed by the above structure The heat-dissipating device, the internal heat-dissipating liquid can flow into or out of the closed container 10 through the openings 21 and 22 of the upper cover 2 and the liquid can flow in a plurality of parallel flow channels 411 to 441 when it flows in, and It is in contact with a plurality of parallel fins 31 to absorb heat, and since the plurality of flat 10 rows of fins 31 have a large area, the contact area of the liquid when flowing in the parallel flow channels 411 to 441 can be increased, and In order to increase the heat absorbed by the liquid. In addition, when the liquid flows in the plurality of parallel flow channels 4 丨 丨 ~ 44 丨, it is affected by the plurality of parallel fins 31 and the separator 3, so that the liquid flows in the plurality of 15 parallel flow channels. When flowing in 411 ~ 441, it will be disturbed and slow down. In terms of a particular position, the liquid at that specific position can have more time to absorb the heat of the heat collector sheet, that is, the liquid in the heat sink can be used to privately add the heat it absorbs. Therefore, With the above structure, the heat collecting effect of the heat collector sheet 1 can be effectively effectively improved, and the benefit of the use of the overall heat dissipation device 20 can be improved. In addition, the above-mentioned partition sheet 3 and the parallel fins 31 are directly convexly arranged on the set. On the upper surface of the heat sink 1, such a design is extremely easy for manufacturing and processing. 0 M250533 Please refer to FIG. 5 is a perspective view of the second preferred embodiment of this creation, and its main structure is the same as the first preferred implementation described above. The example is the same, except that the heat collector sheet 5 of this embodiment further includes a lower surface 50, and a heat collecting area 51 is formed on the lower surface. The heat collecting area 51 is downwardly convex and can correspond to it. Adjacent to a 5 heat-generating electronic component (not shown) to absorb heat. The above design is mainly because general heat-generating electronic components may be surrounded by other electronic components with a higher degree of locality. On component The heat collector sheet 5 may interfere with the aforementioned electronic components. Therefore, by designing the raised heat collecting area 51 as described above, the heat collecting area 51 can indeed correspond to the adjacent 10 on the heating electronic component, and at the same time promote the heat collector. The piece 5 has a high height to avoid interference with other electronic components around the aforementioned heating electronic component. The above embodiments are merely examples for the convenience of explanation. The scope of the rights claimed in this creation shall be based on the scope of the patent application. 15 [Simplified description of the drawings] Figure 1 is a perspective view of a conventional water-cooled heat sink. Figure 2 is an exploded perspective view of a conventional heat collection unit. Figure 3 is the first best of this creation. An exploded perspective view of the embodiment. 20 FIG. 4 is a sectional view of FIG. 3. FIG. 5 is a perspective view of a second preferred embodiment of the present invention. [Illustration of drawing number] 1 Collector piece 10 Closed container 11 Upper surface M250533 2 Upper cover 31 Parallel fins 402 Rear end 5 Collector piece 21, 22 Opening 4 Labyrinth passage 41 ~ 44 Partition area 50 Lower surface 3 Partition piece 401 front end 411 ~ 441 parallel flow path 51 heat collecting area

Claims (1)

M250533 玫、申請專利範圍·· ^ 一種液冷式散熱裝置之集熱器流道結構,包括有一 集熱器片、及一上蓋,其中該上蓋係密封罩蓋於該集熱器 ,且該上蓋並開 片上並與該集熱器片之間形成一密閉容室 5設有二開口其係分別連通外界與該密閉容室之間;其特徵 在於: 該密閉容室内並設有至少一分隔片,且該至少一分隔 片係將該密閉容室分隔成至少二分隔區,相鄰之二分隔區 並彼此於相同側連通而形成一迷宮通道,且每一分隔區内 10 0又有複數個平行鰭片、及複數個平行流道,該迷宮通道之 前端、及後端係分別對應並連通至該二開口。 2·如申請專利範圍第1項所述之液冷式散熱裝置之集 二、W抓逼尨構,其中,該集熱器片並包括有一上表面,且 该至少一分隔片係凸設於該上表面上。 15 3· 如中請專刹鉻in镫ο了石α 士、人1...—M250533 Application scope of the patent ... ^ A collector flow channel structure of a liquid-cooled heat sink includes a collector plate and an upper cover, wherein the upper cover is a sealing cover on the collector, and the upper cover A closed container is formed on the parallel sheet and formed between the collector sheet and the heat collector sheet. There are two openings, which are respectively connected between the outside world and the closed container. The feature is that at least one partition sheet is provided in the closed container. And the at least one partition sheet divides the closed chamber into at least two partitions, and the adjacent two partitions communicate with each other on the same side to form a labyrinth passage, and there are a plurality of 100s in each partition. The parallel fins and a plurality of parallel flow channels, the front end and the rear end of the labyrinth channel respectively correspond to and communicate with the two openings. 2. The liquid-cooled heat sink as described in item 1 of the scope of the patent application, the second and the W-grabbing structure, wherein the collector sheet further includes an upper surface, and the at least one partition sheet is convexly disposed on The upper surface. 15 3 · Please apply special brakes to chrome in 镫 ο stone α, person 1 ...— 之液冷式散熱裝置之集Of liquid-cooled heat sinks 1111
TW093202181U 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device TWM250533U (en)

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TW093202181U TWM250533U (en) 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device
US10/851,060 US20050178531A1 (en) 2004-02-16 2004-05-24 Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus

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TWI407072B (en) * 2010-11-12 2013-09-01 Asia Vital Components Co Ltd A heat exchanger with shunt structure

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