TWM250533U - Flow channel structure of collector of liquid-cooling heat dissipating device - Google Patents

Flow channel structure of collector of liquid-cooling heat dissipating device Download PDF

Info

Publication number
TWM250533U
TWM250533U TW93202181U TW93202181U TWM250533U TW M250533 U TWM250533 U TW M250533U TW 93202181 U TW93202181 U TW 93202181U TW 93202181 U TW93202181 U TW 93202181U TW M250533 U TWM250533 U TW M250533U
Authority
TW
Taiwan
Prior art keywords
collector
liquid
flow channel
heat dissipating
channel structure
Prior art date
Application number
TW93202181U
Inventor
Rung-Feng Huang
Jr-Jian Huang
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW93202181U priority Critical patent/TWM250533U/en
Publication of TWM250533U publication Critical patent/TWM250533U/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW93202181U 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device TWM250533U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93202181U TWM250533U (en) 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW93202181U TWM250533U (en) 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device
US10/851,060 US20050178531A1 (en) 2004-02-16 2004-05-24 Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus

Publications (1)

Publication Number Publication Date
TWM250533U true TWM250533U (en) 2004-11-11

Family

ID=34571583

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93202181U TWM250533U (en) 2004-02-16 2004-02-16 Flow channel structure of collector of liquid-cooling heat dissipating device

Country Status (2)

Country Link
US (1) US20050178531A1 (en)
TW (1) TWM250533U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407072B (en) * 2010-11-12 2013-09-01 Asia Vital Components Co Ltd

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM288699U (en) * 2005-08-17 2006-03-11 Man Zai Ind Co Ltd Circulation type water-cooling base
DE102005058782A1 (en) * 2005-12-09 2007-08-30 Danfoss Silicon Power Gmbh Cooling device for semiconductor devices
JP4011600B2 (en) * 2006-01-30 2007-11-21 シャープ株式会社 Heat sink, electronic devices, and the tuner device
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN201449171U (en) * 2009-05-05 2010-05-05 蔡应麟 Tubular energy saver
US20110232866A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Integral cold plate and honeycomb facesheet assembly
CN101825402A (en) * 2010-04-15 2010-09-08 镇江市东亚电子散热器有限公司 Method for enhancing heat radiation effect of water-cooling radiator and water-cooling radiator

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6173758B1 (en) * 1999-08-02 2001-01-16 General Motors Corporation Pin fin heat sink and pin fin arrangement therein
US6668915B1 (en) * 1999-09-28 2003-12-30 Peter Albert Materna Optimized fins for convective heat transfer
JP2002098454A (en) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp Liquid-cooled heat sink and its manufacturing method
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
TW200503608A (en) * 2003-07-15 2005-01-16 Ind Tech Res Inst Cooling plate having vortices generator
US20050128705A1 (en) * 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407072B (en) * 2010-11-12 2013-09-01 Asia Vital Components Co Ltd

Also Published As

Publication number Publication date
US20050178531A1 (en) 2005-08-18

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees