TWI289041B - Notebook heat-dissipating device - Google Patents

Notebook heat-dissipating device Download PDF

Info

Publication number
TWI289041B
TWI289041B TW94137297A TW94137297A TWI289041B TW I289041 B TWI289041 B TW I289041B TW 94137297 A TW94137297 A TW 94137297A TW 94137297 A TW94137297 A TW 94137297A TW I289041 B TWI289041 B TW I289041B
Authority
TW
Taiwan
Prior art keywords
module
上 方
heat
方 上
layer
Prior art date
Application number
TW94137297A
Other languages
Chinese (zh)
Other versions
TW200718339A (en
Inventor
Yuan-Shing Suen
Original Assignee
Yuan-Shing Suen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuan-Shing Suen filed Critical Yuan-Shing Suen
Priority to TW94137297A priority Critical patent/TWI289041B/en
Publication of TW200718339A publication Critical patent/TW200718339A/en
Application granted granted Critical
Publication of TWI289041B publication Critical patent/TWI289041B/en

Links

Abstract

This invention provides a notebook heat-dissipating device mainly comprising a heat-absorbing module, a heat-conducting module, a bridge module, a cooling chip, a heat-sink module, an upper cooling module, a lower cooling module, heat-pipes, lateral pipes, and cooling pipes. The heat-absorbing module is located at the heat-dissipating area of a notebook. The heat-pipe can conduct the heat from the hot surfaces of the heat-absorbing module and the cooling chip to the heat-conducting module and the bridge module, the heat can be dissipated by the lower cooling module. Then the cooling chip connects with the cooling pipe to bring a cold source to the upper cooling module, so the lower cooling module, the bridge module, the heat-conducting module, and the heat-absorbing module can be cooled, so a notebook can be effectively and quickly cooled.

Description

1289041 IX. Description of the Invention: [Technical Fields of the Invention] The heat dissipation of the wafer component and the heat dissipation type of the notebook computer The present invention relates to an excellent heat dissipation effect by the supercatheter and the cooling device. [Prior Art]

According to the prior knowledge, the components of the notebook computer are far smaller than the desktop computer, and the parts are small and precise. The manufacturer’s high temperature will affect the temperature of the notebook. The longevity, especially for the central processing of the upper device heat sink and the cooling fan, must be effectively operated and dissipated to be able to accurately record the normal operation, however, today's global computer industry is pushing the notebook-type electric job Product, in the operation (transfer) speed is more and more hiding, its towel central processing speed has been introduced super 2. 8Gf 'will even surpass & Xia's computing speed and & bit of the central processor, silk _ potential, thus urging the factory to invest in research and development. (4) The design of the lower-level business is changed. (4) The central processing unit is scattered: ^There is a part of the heat-dissipating _ _ 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片...the efficiency has a breakthrough in speed, affecting the speed of notebook computer operation. In view of this, Yangfa Daily is based on the above-mentioned drawbacks, and is still actively working hard, researching and improving, and accumulating years of manufacturing and production experience, which is enough to solve the above-mentioned drawbacks. [Description of the Invention] 1289041 ^ That is, the notebook computer heat sink of the present invention mainly provides an improved heat dissipation effect, so that the notebook computer can dissipate heat quickly and maintain normal operation. The notebook computer heat dissipating device of the present invention mainly provides a condensing and adsorbing member which can condense water and gas and remove condensed water, so that the water gas is excluded, and the cold source is supplied for effective convection. The invention relates to a notebook computer heat sink device, which mainly comprises: a heat absorbing module installed in a heat sink of a notebook computer; a heat transfer module, a bridge module is overlapped above, and a uniform cold chip is above the bridge mold. And a cold source module; a uniform cold wafer, one side for the cooling surface can generate a cold source, the other side for the heating surface can generate heat, the cooling surface and the cold source module fit, the heating surface and the bridge mold fit; The upper heat-dissipating group has a plurality of heat sinks, and the fan blows away the cold air, and a lower heat-dissipating module is connected below; '-τ is a thief group, which has a complex m-side#, and blows away the hot air by the fan; < The official is introduced into the heat transfer module by the heat absorption module, and then introduced into the lower heat dissipation module; several side tubes are introduced into the lower heat dissipation module by the bridge mold; several cold officials are guided by the cold block to the upper heat dissipation module; According to this, the heat source of the heat absorbing module and the heating surface of the cooling chip is conducted to the heat transfer module and the bridge mold by the heat pipe, and the heat dissipation module is cooled to the lower heat dissipation module, and 1289041 is used to conduct the cold source to the cold tube by the cold tube. Square heat dissipation module The thermal module, the bridge module, the heat transfer module, and the heat absorption module are cooled to achieve effective and rapid heat dissipation. In order to enable the reviewing committee, the content, features and objects of the present invention are further understood and § 同 ' 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The following is a detailed description of the present invention. First, a notebook computer heat sink device, as shown in FIGS. 1 to 6, mainly includes a heat absorbing module i 〇, a heat transfer module 2 〇, and a bridge module 30. a uniform cold chip 40, a cold source module 50, an upper heat dissipation module 60, a lower heat dissipation module 7〇, a plurality of heat pipes 1 1 , a plurality of side officials 31 and a plurality of cold tubes 51, the heat absorption module 1〇 Installed in the heat sink of the notebook computer, as in this embodiment is a central processing unit (CPU) of a notebook computer, the heat absorbing module 1 is provided with three jacks i 2, and the adjacent side of the heat absorbing module 10 is The heat transfer module 2〇, the heat transfer module 2〇 is also provided with three jacks 21, and a heat transfer module 20 is overlapped with a bridge mold 3〇, the bridge mold 30 is in the shape of an arch bridge, and the bridge mold 3 is uniformly cold above. The wafer 4〇 (as shown in FIGS. 1 to 5) and a cold source module 5 〇, the cooled wafer 4 is connected The source, the cooling surface 41 thereon can generate a cold source, and the heating surface 42 2 generates high-temperature heat energy, the cooling surface 41 and the cold source module 5 〇 fit, the heating surface 4 2 and the bridge mold 3 0-fit, the cold-formed wafer 4 〇 integrally forms a block with freezing and low temperature, which can quickly reduce the temperature of the cold-source module 5 ,, and quickly achieve the cooling and heat-dissipating effect, and each side of the bridge mold 3 has a plug Hole 3 2, cold source 1289041 The core block 5〇 is provided with three jacks 52, the adjacent side of the cold source module 5 is an upper heat dissipation module 6 〇; the upper heat dissipation module has a plurality of fins (fin fins) The upper part is provided with a fan 80, and the fan 8 〇 is blown downward, blowing away the cold air of the upper heat dissipation module 6 ,, and the lower heat dissipation module 6 is connected with a lower heat dissipation module 70 below the lower heat dissipation module 6 _ group 7 〇 has a plurality of heat sinks (fins), feather 8 〇 can take hot air, upper heat dissipation module 6 〇 has three jacks 6 1 lower heat release module 70 has five jacks 71 for The heat pipe 11 and the side panel 31 are inserted, and the three heat pipes 11 are introduced into the heat transfer 2 bundle 2 〇' by the heat absorption module 10 and then introduced into the lower heat dissipation module 7 〇, the two sides The tube 31 is bridged by 0; the person is in the lower heat dissipation module 7 〇, and the three cold tubes 51 are inserted into the upper heat dissipation module 60 by the cold source mold 5, and the cold source module 5 is covered with a cover body 90 (can be a transparent material), the left side channel 91 and the right flow channel 9 2 are formed on both sides of the cover body 90; the heat pipe 11 and the cold pipe 51 are lined with copper, Ming or other metal tubes. Special metal powder that can be transferred to A-speed: high-temperature heat pipes such as: (4) Metal powders such as hot powder, such as: money), when the molecules receive heat, it will produce a high degree of condensation and recirculation of the body. And the heat source is quickly fluctuated in the way of the ancient special = fresh ship _ ordinary gold secret or scattered heat transfer rate is more than several times; 俾 by the heat pipe 1 1 (cold pipe 5 i ) with (cold) characteristics ' The ..., the source, and the ... on the heat absorbing module 1 can be quickly transferred to the heat transfer module 2 ;; by the above structural combination, the notebook computer heat sink 1289041 is set, when the invention is used The heat source of the central processing unit (CPU) 1 of the notebook computer, the heat source is transmitted from the heat absorbing module 1 to the three heat pipes 11 and the three heat pipes 11 The heat source is conducted to the heat transfer module 20 and the bridge mold 3, while the heat generating surface 4 of the cooled wafer 40 conducts the heat source to the bridge mold 3 传热 and the heat transfer mode = 20, which is composed of three heat pipes The two sides of the tube 3 i conduct heat to the lower heat dissipation module 7 Q 'lower heat dissipation module 70 for heat dissipation; and the cold surface 41 of the cooled wafer 40 generates a cold source to the cold source module 50 cold source module 5 0 conducts the cold source to the upper heat dissipation module 60 by three cold tubes 51, 7 〇, three heat pipes 1 丄, the side tubes 3 1 , the bridge mold 30, the heat transfer module 2 〇 and the heat absorption Module 丄〇, the central processing is 1 cooling to 'effectively and quickly dissipate heat; the fan 80 blows to the upper heat-dissipating module 6 〇, so that the cooling air is cooled down to the lower heat-dissipating module 7 〇, for cooling and cooling action, and the cover The body 9 is formed into a machine path on both sides, so that the airflow enters from the left flow channel 91 and flows out from the right flow channel 92. The notebook computer heat sink of the present invention, the second embodiment is as shown in FIG. The heat dissipation module 6 is provided with an embedding space 6 2 6 3 on both sides, and the left embedding space 6 2 is inserted into a left condensation adsorption member 1〇〇, the left The coagulation member 1〇0 is provided with a multi-layer plate 1〇1, and an outer layer of the multi-layer plate 101 is provided with an L-shaped protective wall 1〇2, and a lower end of the protective wall 1〇2 is provided with a plurality of vertical strips 1〇3, and the lower heat-dissipating module 7 0 is right. There is a space for intrusion (not shown, located below the embedded space 6.3), the upper heat-dissipating mold, and the embedded space 6 3 on the right side of the 6 与 and the space below the lower heat-dissipating module are embedded into the right condensing adsorption member 11〇 The right condensing adsorption member 1 1 cookware 1289041 is combined with a vertical plate 1 i 3 / 1 plate 1 1 2, and the outer layer of the layer ▲ layer has a cylindrical spiral coffee, the outline, the left The condensing adsorption member i 〇〇 and the right condensing suction material 11Q all have a plurality of layers of ruthenium, which are adsorbed by the pores of the Wei hair, and are used for condensing water and gas, and are used for removing the condensed water gas; when the fan is blown to the upper heat dissipation module 6 0, when the cold air is down to the lower thermal core group, 7 〇, so that the air flow enters from the embedded space 6 2 on the left side, through the multi-layer plate 101 of the left condensation adsorption member 10Q, to the left side of the cover 90 / 'il road 9 1 Then, the cover 9 〇 the right flow path 92, enters the opening i141 of the right condensing adsorption member 10, and enters the upper multi-layer plate. The worker is discharged through the port 115, and the lower lip block ii 2 is directly discharged by the airflow of the lower thermal module 70, and can be appropriately cooled, and the water is condensed to remove water. To prevent the moisture from entering the notebook computer; the notebook computer heat sink device of the present invention, the third embodiment is shown in Figure 8, which is to change the left condensation adsorption member 1 〇〇 and the right condensation adsorption member of the second embodiment. 1 1〇, the multi-layer plate of the left condensation adsorbing member 1 2 第三 of the third embodiment is divided into an inner multi-layer plate 121 and an outer multi-layer plate 1 2 2 'in the middle combined with an L-shaped retaining wall 12 3 , the retaining wall 12 3 is near The rear end has a port 12 4 , the port 12 4 extends through the retaining wall 12 3 , and the outer side of the multi-layer plate 12 2 has a tubular body 12 5 . The front end of the tubular body 12 5 is an opening 12 51 , and the rear end is closed, and the outer layer is 12 2, the lower end is provided with 1289041, and there are a plurality of vertical strips 126; the right condensation adsorbing member 13 has a multi-layered plate 丄3丄 of the upper layer, a multi-layered plate 133 of the lower layer, and a plurality of outer slabs 133 of the outer layer, all of which are combined Vertical plate 1 3 4, upper layer multi-layer plate 丄 3 i has a tube The front end of the cylinder 13 5 is an opening 13 51, the bottom of the inner surface has a through opening 136, and the opening 136 passes through the vertical plate 13 4 . The front end of the lower layer of the multi-layer plate 13 2 is closed, and the rear end is an opening; To the upper heat dissipation module 6 〇, when the cooling air is directed downward to the lower heat dissipation module 70, the air flow is entered from the left side embedded space 62, and the multi-layer plate 121 inside the left condensation adsorption member 120 is passed through the port 12 4 to The outer multi-layer plate 12 2, to the left side flow path 91 of the cover body 90, and then to the right side flow path 92 of the cover body 90, enters the opening 13 51 of the right condensation adsorption member 130, and enters the upper layer of the multi-layer plate 131. The opening 13 6 is discharged to the outer multi-layer plate 13 3 , and the lower layer multi-layer plate 13 2 is directly discharged by the airflow of the lower heat-dissipating module 7 , and is discharged from the rear end, and can be appropriately cooled and condensed. In order to eliminate water vapor, to prevent moisture from entering the notebook computer; in summary, the novelty and practicality of the notebook computer cooling device of the present invention are unquestionable, and therefore, the auditing committee member, Yi Bingguo Strive to create the original intention, grant the patent in this case, then apply Please be lucky! 1289041 [Simple description of the diagram] Φ

BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of the present invention. The second drawing is a schematic side plan view of the present invention. The third figure is a horizontal cross-sectional view of the fan and cold source module of the present invention. The fourth figure is a horizontal cross-sectional view of the upper heat dissipation module and the cold source module of the present invention. The fifth figure is a vertical cross-sectional view of the cold source module of the present invention. Cooling wafer, bridge mold, heat transfer module The sixth figure is a horizontal cross-sectional view of the lower heat dissipation module, bridge mold and heat transfer module of the present invention. Figure 7 is a perspective exploded view of a second embodiment of the present invention. Figure 8 is a perspective exploded view of a third embodiment of the present invention. [Main component symbol description] 1 central processor 10 heat absorbing module 1 1 heat pipe 1 2 jack 2 0 heat transfer module 2 1 jack 3 0 bridge mode 3 1 side tube 3 2 jack 4 0 cold chip 4 1 refrigeration Face 4 2 heating surface 5 0 cold source module 5 1 cold tube 5 2 jack 6 0 above heat dissipation module 6 1 jack 6 2 embedded space 1289041

6 3 embedded space 7 1 jack 9 0 cover 9 2 right flow channel 1 0 1 multi-layer plate 1 0 3 vertical bar 1 1 1 multi-layer plate 1 1 3 vertical plate 1 1 4 1 opening 1 2 0 left condensation adsorption member 1 2 2 outer multi-layer plate 1 2 4 port 1 2 5 1 opening 1 3 0 right condensation adsorber 1 3 2 lower layer multi-layer plate 1 3 4 vertical plate 1 3 5 1 opening 7 0 lower heat dissipation module 8 0 fan 9 1 left flow channel 1 0 0 left condensation adsorption member 1 0 2 protection wall 1 10 right condensation adsorption member 1 12 lower layer multilayer plate 1 1 4 cylinder 1 1 5 port 1 2 1 multi-layer plate 1 2 3 wall 1 2 5 tube Body 1 2 6 vertical strip 1 31 upper layer multi-layer plate 1 3 3 outer multi-layer plate 1 3 5 cylinder 1 3 6 port

Claims (1)

1289041 X. Patent application scope: 1 A notebook computer heat sink mainly includes: - the heat absorbing module is installed in the heat sink of the heat source of the note; - the heat transfer module is lapped above - the bridge mold, the upper part of the bridge mold is Consistent cold wafer and a cold source module; -Cooling wafer'---the surface of the cooling surface can generate a cold source, and the other side is the heating surface to generate heat & the cold surface and cold block fit, the heating surface and the bridge模 上方 上方 ^ ^ 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方 上方The heat pipe is guided by the heat absorption view and then introduced into the lower heat dissipation module; several side officials are introduced into the lower heat dissipation module by the bridge mold; and several cold pipes are introduced from the cold source module to the upper heat dissipation module. According to this, the heat source of the heat absorbing module and the heating surface of the cooling chip is transmitted from the heat pipe to the heat transfer module and the bridge mold, and is radiated to the lower heat dissipation module, and then the cold film is used to conduct the heat source by the cold tube. Upper heat module Of the lower heat dissipation module, the bridge die, the heat transfer module, a cooling module is endothermic, to achieve effective heat dissipation quickly. 2. The notebook computer heat sink according to claim 1, wherein the heat absorption module, the heat transfer module and the lower heat dissipation module are respectively provided with three jacks for the heat pipe to pass through, and one side of each of the bridge molds is provided. The jack and the lower side of the 1289041 heat dissipation module are respectively provided with one side holes, the jack of the bridge mold and the side hole of the lower heat dissipation module, and the heat pipe is inserted. 3. For the notebook computer heat dissipation as described in claim 1, the salt-cooled source module and the upper heat-dissipating module each have three jacks for the cold pipe to penetrate. 4' The notebook computer heat sink according to the first aspect of the patent application, wherein the upper heat dissipation module is provided with an embedded space on each side, and the left side of the space is inserted into a left condensation adsorption member, and the lower heat dissipation The right side of the module is provided with the following embedding space. The embedding space on the right side of the upper heat dissipating module and the space below the lower heat dissipating module are required to enter the space, and the left and right condensing adsorbing members are multi-layered with capillary holes for adsorption. The plate is used to condense moisture and remove condensed water. 5. The notebook computer heat dissipating device according to claim 4, wherein an outer L-shaped slab of the left condensing adsorbing member is provided with an L-shaped protective wall, and a plurality of vertical strips are arranged at a lower end of the protective wall. _ 6. The notebook computer heat sink according to claim 4, wherein the right condensing adsorption member has a multi-layer slab of the upper layer and a multi-layer slab of the lower layer are combined with a vertical plate, and the outer layer of the multi-layer slab has a tube The front end of the cylinder body is an opening, the bottom of the inner surface has a through opening, and the through hole passes through the vertical plate, and the front end of the lower layer is closed, and the rear end is an opening. 7. The notebook computer heat sink device according to claim 4, wherein the outer cover of the cold source module has a cover body, and a flow raft is formed on both sides of the cover body to respectively reach an embedding space on the left side of the upper heat dissipation module. With the embedded space on the right side, the cold air is convected by the embedded space on the left side through the left flow path to the embedded space on the right side 15 1289041 '. 8. The notebook computer heat sink according to item 4 of the patent application garden, wherein the multi-layer plate of the left condensation adsorbing member is divided into a multi-layer plate on the inner side and a multi-layer plate on the outer side, and the first layer is combined with a one-side retaining wall. There is a through port near the rear end of the retaining wall, and the through port penetrates the retaining wall. The outer side of the multi-layered plate has a cylindrical body whose opening is closed, the rear end is closed, and the outer side of the multi-layered plate has a plurality of vertical strips. 9. For the notes mentioned in Item 4 of the patent application (4) Brain heat-dissipating agricultural device, wherein the right condensing adsorption member has a lower layer of the upper layer of the multi-layer plate: the layer plate and the outer layer of the multi-layer plate are combined on a vertical plate layer = There is a cylinder inside the plate, the front end of the cylinder is an opening, and the bottom of the inner surface is the bottom of the inner wall. The inner surface of the lower layer is closed. The front end of the multi-layered plate is closed.
TW94137297A 2005-10-25 2005-10-25 Notebook heat-dissipating device TWI289041B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94137297A TWI289041B (en) 2005-10-25 2005-10-25 Notebook heat-dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94137297A TWI289041B (en) 2005-10-25 2005-10-25 Notebook heat-dissipating device

Publications (2)

Publication Number Publication Date
TW200718339A TW200718339A (en) 2007-05-01
TWI289041B true TWI289041B (en) 2007-10-21

Family

ID=39228534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94137297A TWI289041B (en) 2005-10-25 2005-10-25 Notebook heat-dissipating device

Country Status (1)

Country Link
TW (1) TWI289041B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101358699B (en) 2007-08-01 2011-08-24 富士迈半导体精密工业(上海)有限公司 Outdoor lamp

Also Published As

Publication number Publication date
TW200718339A (en) 2007-05-01

Similar Documents

Publication Publication Date Title
US7134288B2 (en) System, method, and apparatus for providing a thermal bypass in electronic equipment
CN1979380B (en) Embedded heat pipe in a hybrid cooling system
US7573714B2 (en) Method and apparatus for dissipating heat in a computer system
US7304847B2 (en) Heat sink
Yuan et al. Thermal analysis of high power LED array packaging with microchannel cooler
TWI251656B (en) Boiling chamber cooling device
US7283360B2 (en) Enhanced flow channel for component cooling in computer systems
US20050217829A1 (en) Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7775262B2 (en) Loop-type heat exchange device
US20070242438A1 (en) Low-Profile Thermosyphon-Based Cooling System for Computers and Other Electronic Devices
JP2004116864A (en) Electronic apparatus comprising cooling mechanism
US6591898B1 (en) Integrated heat sink system for a closed electronics container
US20100124012A1 (en) Blade server
JP2007310716A (en) Electronic apparatus
CN100573416C (en) Computer system and heat radiation module thereof
US7240722B2 (en) Heat dissipation device
CN205793890U (en) Refrigerant type heat abstractor
TWM246694U (en) Heat dissipation device
DE112007000768T5 (en) Integrated module for the liquid-air line
US20060076122A1 (en) Heat collector
US7038911B2 (en) Push-pull dual fan fansink
US8813834B2 (en) Quick temperature-equlizing heat-dissipating device
US20070107876A1 (en) Heat sink with heat pipes
KR101114813B1 (en) Heat dissipation apparatus
WO2009114148A1 (en) Thermal bus or junction for the removal of heat from electronic components