TWI247872B - Flat-plate heat pipe containing parallel microchannels - Google Patents

Abstract

Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected by the microchannels and flows into the lower section, and further flows back to the wick evaporator by capillary action, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to form at least one of the sections to reduce friction in the liquid flow path.

Description

1247872 V. Description of invention (1)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat dissipation of a heat source having two heat fluxes, and more particularly to a flat-plate heat pipe, which can be used for heat dissipation of an electronic wafer in a computer or a cooling object to be used in a computer application. . 〃 【Prior technology】

The latest generation of PC central processing units has generated more than one hundred dollars of heat to maintain the temperature at the licensed temperature to prevent its performance from degrading or damaging, requiring an efficient cooling method. U.S. Patent Nos. 5, 88, 5 24 discloses that a plate-type heat spreads the heat generated by the semiconductor wafer, as shown in FIG. The working fluid (not shown) is circulated in the #二间1 0 5 of the metal container 10 ,, and the heat sink fins 10 1 are placed on the heat transfer of the metal container 1 〇 。. The central processing unit is in contact with the metal container 1 by a heat conducting medium 102. A two-phase vaporizable liquid is filled in the working fluid of the space 1 0 5 as i I 1 . A metal capillary structure 1 0 3 covers the inner space of the container, and is a circulation circuit of the fluid. The working fluid is in the space 1 〇 5

The structure is 1 0 3 square, and the direction is indicated by the arrow in FIG. The working fluid is first adsorbed to the capillary knot, and the bottom of the autumn will 'condense when the heat from the central processor is evaporated into a steaming heat and then condense on the top of the capillary structure 103, releasing the condensation heat through the body. 〇1攸 is scattered above. The capillary structure 1 〇 3 absorbs the condensate at the top, and the field acts to the bottom of the capillary structure 103 to complete the cycle. The heat pipe Huaminguo Shenyi Patent No. 092104359 discloses another flat type as shown in Figure 2. The internal space of the sealed metal container 1 〇 1 1 can be divided into two areas, such as the call I, for the circulation of the working fluid, and the circulation path b of the working fluid. Capillary structure 2 〇 3 left side including the first group of upper areas parallel

Page 7 1247872 V. INSTRUCTIONS (2) Microchannels 2 0 1 and the second group of parallel microchannels 2 〇 2 in the lower zone; the right side includes the third group of parallel microchannels 201 in the upper zone and the Four sets of parallel microchannels 20 2 . The first set of parallel microchannels 201 and the second set of parallel microchannels 202 are separated by a partition 205. Since the parallel micro flow path groups 20 1 and 202 on the left and right sides operate in the same principle, only the two parallel micro flow paths on the left side will be described below. A working fluid (not shown) is adsorbed in the capillary structure 2 〇 3 . The capillary structure 2 0 3 may be sintered from a metal powder or may be composed of a single layer or a plurality of metal meshes or metal cloths. Work in capillary structure 2 〇 3 when the heat pipe is in contact with a central processor or other heat generating device

The liquid evaporates by heat and releases the vapor upwards, as indicated by the arrows. Part of the steam condenses on the upper inner wall surface of the space 105, and part of the steam enters the first group of parallel microchannels 201 to condense. The condensed liquid collects at the corner of the parallel microchannel 2〇 1 and is then driven by the vapor flow and the capillary force, flows through the transport passage 2〇4, and enters the second set of parallel microchannels 2〇2 below. The transmission channel 204 is located at a common end of the two sets of parallel microchannels 2 0 1 and 2 0 2 to connect the two. The capillary structure 2 0 3 is located at the other end of the parallel microchannel 2 〇 2 and has a thickness not less than the height of the parallel microchannel 2 0 2 . When the working liquid in the capillary structure 2 〇 3 evaporates, a liquid vapor interface is formed inside the capillary structure 2 〇 3 . The liquid-vapor interface causes a capillary tension to cause the working fluid in the parallel microchannel 2〇 2 to be pulled into the capillary

The structure 2 0 3 ' thus completes a complete cycle · liquid-vapor-cooling-liquid" as shown by the arrow in FIG. The above embodiments can be placed horizontally or vertically. SUMMARY OF THE INVENTION The present invention is an extension of the Patent Application No. 92 1 0435 9 of the Republic of China.

Page 8 1247872 V. INSTRUCTIONS (3) = ϋ 7^ Incorporate void channels, parallel microchannels or a combination of the two into the 敎: inside: in the circulation path of the fluid to reduce the friction of the working fluid The purpose of the touch step is to establish an effective heat pipe heat dissipation mechanism. The part of the cycle path of the machine is a gap channel, a parallel micro flow channel or your mouth, and the frictional resistance of the working liquid can be reduced. And the fine action can more effectively drive the working fluid. [Embodiment] The principle of the #A 4^ 疋 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙 空隙Part I. The first embodiment of the cup door 2:: The internal space 105 of the sealed metal container 1 〇 0 can be divided into the circulation path of the body 1 such as gas / % working fluid circulation, work flow leveling The material is soaked, and the tiger is not designed. The design of the two groups in the lower part of Fig. 2 is replaced by a gap β. The gap B acts as a liquid passage, which returns to the two chess forces and the capillary structure 2 0 3 The capillary force belt provided by the gap 8, the, the field, the, and the "structure 2 0 3 In this embodiment, the micro-channel between the parallel gap and β 2 〇ι except by transmission channel 2〇4 μ "R Φ ★ a ^ Γ separated from each other, thus the gap benign. The moving liquid will not be dragged by the reverse flow of the steam in the microchannel 201. The capillary structure can be increased by a continuous fold above 2°3^5| 1 〇〇6> (Fig. 4) 'Connecting the capillary Structure 2 〇3盥Metal 00 The inner upper wall surface. The guiding piece 207Β can directly guide the part of the water to the capillary structure 2 03, and can also be used as::: condensing, resisting the internal space of the metal container when the vacuum is evacuated: ' ^ 』 Other folds

Page 9 1247872

Shapes, such as v-shape, spiral shape, s-shape, etc., are not described here. Fig. 5 discloses a square continuous folding guide piece made of a metal mesh or the like. 'Other alternative shape, such as ¥ shape, spiral shape' (four), the more invented invention (four) two embodiments. In this embodiment, an extended micro-flow channel group 2〇1]6 above the hair, and field structure 203 is used. Figure 7 discloses a third embodiment of the invention. In the figure, % shows the cross-section of the opposite half of the object after the cut surface. In this embodiment, the first set of parallel microchannels and the =k channel 204 are integrally formed on the top of the metal container 1 ,, and the shaped and butyl structure 20 1C. The parallel microchannels 2〇11 and the transmission channels 2〇4 can be cast or fabricated on the metal container wall. Figure 8 discloses a fourth embodiment of the present invention. The object shown in the figure is also the opposite half of the object after the symmetry plane of the original object, and the front surface represents the cross section of the middle symmetry plane of the complete object. Similar to the fourth embodiment of Fig. 7, the = group of parallel microchannels and the transfer passage 204 may also be integrally formed at the bottom of the metal container 100 to form the bottom structure 2?2C. The parallel microchannels 2〇21 and the transfer channels 204 can be cast or fabricated on the metal container wall. Figure 9 discloses a fifth embodiment of the invention. This embodiment discloses that in each of the above embodiments, the capillary structure, 〇 3 can be replaced with a pin-array block 203B. The gap between the columns absorbs the working liquid by capillary force. The open inter-column gap above facilitates the discharge of boiling steam bubbles that may be generated under high heat dissipation f. The purpose of this trick is to improve the capillary knot

Page 10 1247872 V. Description of the invention (5) " ------- - The dry-drying limit of the working fluid in the structure 203. Fig. 1 shows a sixth embodiment of the present invention. This embodiment is a variant of the two embodiments of Figures 2 and 3 > and this embodiment is placed vertically. The first set of parallel microchannels 2〇1 in the upper half of the figure is replaced by a gap A. At this time, part of the vapor released from the capillary structure 20 3 will condense directly on the inner surface of the capillary structure 203 or condense into the first group of parallel microchannels 2〇i in the lower half, and the condensate is vaporized by gravity and gravity. Drive down and into the bottom liquid pool (not shown). The working fluid is pulled back into the capillary structure 203 by the capillary forces of the capillary structure 2〇3 and the first set of parallel microchannels 2 〇 2 . The other part of the steam released by the capillary structure 2 〇3 will enter the gap a, and the part will be spliced to the inner upper wall of the metal container 1 〇 。. A part of this condensate will flow downward into the first set of parallel microchannels 2 〇1 in the lower half, and the other part will be driven upward by the steam flow, through the transmission channel 2 〇 4, and then into the upper half Two sets of parallel microchannels 02. The second set of parallel microchannels 2〇2 serves as a passage for the condensed liquid, wherein the liquid is brought back into the capillary structure 2 〇 3 by gravity and the capillary force provided by the capillary structure 2 〇 3 and the parallel microchannels 202. Figure 11 discloses a seventh embodiment of the present invention. This embodiment is also a variant of the two embodiments of Figures 2 and 3. The second set of parallel microchannels 20 in the upper half of Fig. 11 is replaced by a gap β. The other part of the vapor released by the capillary structure 2 〇3 will enter the first set of parallel microchannels 2 〇1 in the upper half, and a part of the condensate will flow downward into the first set of parallel microchannels in the lower half. 2 〇1, the other part will be driven upward by the steam flow, first enter the upper transmission channel 2 04, then into the upper half of the gap ,, and finally back to the capillary structure 2〇3. The void Β acts as a liquid channel in which the liquid is gravity and capillary

Page 11 1247872 V. INSTRUCTION DESCRIPTION (6) • The capillary force provided by the structure 203 and the void B is brought back into the capillary structure 203. Figure 12 discloses an eighth embodiment of the present invention. This embodiment is also a variant of the two embodiments of Figures 2 and 3. The first set of parallel microchannels 20 1 in the upper half of Fig. 25 is replaced by a gap A, and the second set of parallel microchannels 2 〇 2 of the upper half is replaced by a gap β. The void B serves as a liquid passage in which the liquid is brought back into the capillary structure 2 〇 3 by gravity and the capillary force provided by the capillary structure 203 and the void 〇 Figure 13 shows a ninth embodiment of the present invention. This embodiment is a simplified version of the embodiment of Fig. 2 in which only a single set of parallel microchannels 2 〇 1 and a single set of parallel microchannels 2 0 2 are used. The circulation mechanism is exactly the same as that of Figure 2. Figure 14 discloses a tenth embodiment of the present invention. This embodiment is a variant of the embodiment in Fig. 3. The first set of parallel microchannels 2 〇 i in Fig. 13 is replaced by a gap A. After the vapor released from the capillary structure 2 0 3 enters the void A, part of the vapor condenses on the inner upper wall surface of the metal container 100. This condensate is carried upward by the vapor stream, passes through the transfer channel 2 0 4, and enters the second set of parallel microchannels 2 〇 2 . The liquid in the second set of parallel microchannels 2 0 2 is brought back into the capillary structure 2〇3 by the gravity and the capillary force provided by the capillary structure 20 3 and the parallel microchannels 02. Figure 15 shows the tenth of the present invention. An embodiment. This embodiment is a variant of the embodiment of Figure J3. The second set of parallel microchannels 2〇2 in Fig. 13 is replaced by a gap B. The void B acts as a liquid passage in which the liquid is brought back into the capillary structure 2 〇3 by gravity and the capillary force provided by the capillary structure 203 and the void B. Figure 16 discloses a twelfth embodiment of the present invention. This embodiment is a variant of the embodiment of Figure j3. The first set of parallel microchannels 2 〇 1 in Fig. 13 is replaced by one

Page 12 1247872 V. Description of the invention (7) The gap A, and the second set of parallel microchannels 2〇2 are replaced by a gap B. After the steam released from the fine structure 2 0 3 enters the void a, part of the steam condenses on the inner upper wall surface of the metal container 1 〇 0. This condensate is carried upward by the vapor stream, passes through the transfer passage 204, and enters the gap b. The void b acts as a liquid passage in which the liquid is brought back into the capillary structure 203 by the gravity and the capillary force provided by the capillary structure 2 〇 3 and the void b. Figure 17 shows a thirteenth embodiment of the invention. This embodiment can be used as a variant of all the aforementioned embodiments. Figure 7 shows that the second capillary structure 2〇46 can be placed in the transfer channel 204 to make the liquid flow smoother. The capillary force of the capillary structure 2〇4β is greater than the capillary force of the transmission channel 2〇4 in all the foregoing embodiments, so that the working liquid can be grasped to prevent steam from entering the second group of parallel microchannels 2〇2, and the liquid flow is smoother. . The main six ft statements of each of the 'knowing cases' are two sets of parallel microchannels 2 01 and 20 2 with the r group of parallel microchannels in the microchannel section of the water channel:; ΓΓ二la: eter) Or "the product is smaller than the first group of parallel micro can be other shapes, such as square or trapezoidal, etc. 7 flat as a gas triangle" can also be metal, can also be non-metallic 仃嘁 machine group 2 〇 ι And (9) 2 ~ Kai Meng y 蜀, such as - 矽 or when two groups of parallel micro-channels 2 〇 1 and 2 will 2 > special groups 201 and 202 can be made separately, in the presence of 'parallel micro-flow method available Casting or extrusion molding: or = can be made in one piece, square cut, or other processing. Etching a metal plate, cutting the circle 1 8 reveals no π 7X % w Le X (2), the length of the lower section is the same Capillary structure 2〇3C. & Example. This embodiment uses one. This long capillary structure 20 3C

1247872 V. INSTRUCTIONS (8) ----- 2 As an evaporator, absorb the heat generated by the heat generating device (not shown) below it. The long capillary structure 20 3C is located in the sac area below the parallel microchannel group 2〇1 and acts as a passage for the liquid to flow back to the middle evaporator. Capillary structure; 〇3c can be composed of sintered metal powder, metal mesh or metal cloth. Figure 1 shows an exploded projection view of the embodiment of Figure 18. Two sets of parallel microchannels 201 are respectively placed on the left and right sides of the upper region of the inner space 105 to help collect the condensed liquid. Fig. 20 discloses a fifteenth embodiment of the present invention, in which a v-shaped folded guide piece 207 is disposed between the left and right parallel flow path groups 2〇1 on the capillary structure 20 3C. Figure 21 discloses a sixteenth embodiment of the present invention. In this embodiment, the group of extended parallel microchannels 20 1 B spans over the long capillary structure 2 〇 3 C. The long micro-flow channel 201 B and the long capillary structure 203C are separated by a metal or non-metal separator 20 5 , but a space 300 is reserved for vapor to flow into the parallel microchannel 201B. The partition plate 205 in this embodiment may also be made of a mesh material, so that the partially condensed liquid collected by the 'long parallel micro flow channel 20 1B can directly enter the long capillary structure 2 〇 3 without winding around the nickel transmission channel 204. c. Figure 22 discloses a seventeenth embodiment of the present invention. This embodiment replaces the long parallel microchannel 2 〇 1 β in the previous embodiment with a 〆V-shaped reticle 300 2 2 . The partition plate 205 in the non-embodiment may also be made of a mesh material. Figure 23 discloses an eighteenth embodiment of the present invention. This embodiment shows that the -20 middle long capillary structure 20 3C can be replaced by a folded metal mesh 3 〇 2 . Figure 24 discloses a nineteenth embodiment of the invention. In this embodiment, a metal mesh 3〇4 is added over the folded metal mesh 30 2 to strengthen the capillary force.

Page 14

1247872 V. INSTRUCTIONS (9) Especially for the middle section evaporator section. The present invention is intended to cover a design that is readily apparent to those skilled in the art, and therefore, the scope of the claims should be construed in accordance with the broadest scope of the invention.

Page 15 1247872 Schematic description of the diagram Figure 1. Prior art. Figure 2. Prior art. Figure 3. A first embodiment of the invention. Figure 4. A second embodiment of the invention. Figure 5. A third embodiment of the invention. Figure 6 is a fourth embodiment of the present invention. Figure 7. A fifth embodiment of the invention. Figure 8. A folded vertical guide piece made of sheet metal. Figure 9. A folded vertical guide made of metal mesh. Figure 10 is a sixth embodiment of the present invention. Figure 11 1] A seventh embodiment of the present invention. Figure 1 2. An eighth embodiment of the invention. Figure 1 3. A ninth embodiment of the invention. Figure 1 4. A tenth embodiment of the invention. Figure 1 5. An eleventh embodiment of the invention. Figure 1 6. A twelfth embodiment of the invention. Figure 1 7. A thirteenth embodiment of the invention. Figure 1 8. A fourteenth embodiment of the invention. Figure 1 9. Exploded projection of the embodiment of Figure 18. Figure 2 0. A fifteenth embodiment of the invention. Figure 2 1. A sixteenth embodiment of the invention. Figure 2 2 · A seventeenth embodiment of the invention. Figure 2 3. An eighteenth embodiment of the invention. Figure 2 4. A nineteenth embodiment of the invention.

Page 16

Claims (1)

:s as the k-body path, including the upper zone and the lower zone, the upper zone and the lower zone are separated by a knife/blade partition, but a common end of the upper zone and the lower zone is connected by a transmission channel 5' to make the working fluid The upper zone may flow from the upper zone to the lower zone, and the upper zone is in contact with the upper inner wall surface of the metal grain vessel for vapor condensation and heat dissipation. The lower zone is used as a circulation passage for the condensed working fluid; The passage 'connects one end of the upper and lower sections of the working fluid path; and the 6 capillary hair conditioner' is connected to the lower section of the working fluid path, and collects the condensation of the area below the working fluid path by capillary force The liquid, while the condensed liquid described above is waiting to absorb the heat generated by the heat generating device to evaporate. 2. A heat sink device for dissipating heat as a heat generating device, comprising a two-sealed metal container in contact with the heat generating device; a two-phase vaporizable working fluid circulating in the metal container to remove the heat generating device The heat is used as the fluid path, including the upper zone and the lower zone, and the upper zone and the lower zone are separated by a knife partition, but a common end of the upper zone and the lower zone is connected by a transmission channel to make the working fluid available. The upper portion flows into the lower portion, and the upper portion is in contact with the upper inner wall surface of the metal container for vapor condensation and heat dissipation. The lower portion is used as a circulation passage for the condensed working liquid. Page 18 '^4 94 5.11 1247872 VI. Application for patent scope; and with: = pass, connected at one end of the lower zone above the working fluid path; and, a capillary structure, located under the above working fluid path A part of the structure acts as an evaporator, and the rest = the capillary fine force collects the c-channel under the working fluid path, and condenses by hair, waiting to absorb the heat generating device: = and the above 3. A heat sink device with a range of 1 or 2, 1 : bursts out. Integrated circuit chip. ,, T's heating device issued 4 · If you apply for a patent range! The heat sink device of 2 or 2, which is composed of sintered copper powder, sintered nickel powder, and fired, is recognized as a capillary structure. A crucible composed of a stainless steel powder; a heat sink device as claimed in the patent application 丨 or 2, which is one of a group consisting of a metal mesh and a metal cloth. The capillary structure of ^ belongs to the heat sink device of the patent application scope (4), and at least one of the upper region and the lower region belongs to one of the ethnic groups identified by the gap and c.千仃彳政/机道组组7· As in the heat sink device of Patent Application No. 6, the shape of the track group microfluidic wear surface belongs to the group consisting of V #一Λ , , and formed into a square shape, a square shape And the trapezoidal group of the heat sink device of the public range 1 or 2, further includes a guide piece, and the liquid ^=ji=earth side, so that the partially condensed liquid on the inner wall surface of the metal container can be directly flowed back to the evaporator. . 9. A heat sink device of the patent scope j or 2, wherein the working fluid path IHl I Face Page 19 1247872 I. ____ Τ Τ 替换 替换 替换 丨 申请 申请 申请 申请 申请 申请 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上 之上i B7 body surface 1 In the heat sink device of the patent specification, the lower portion of the working fluid path and the above-mentioned transfer passage form a bottom structure with the lower wall of the metal container. ^ I ^ Η • The heat sink device of claim 1, wherein the capillary structure is a column array. The gap between the columns provides capillary force to absorb the working liquid. 12. The heat sink device of claim 8, wherein the guide piece is made of a metal mesh. 13. A heat sink apparatus according to claim 1 or 2, wherein the sealed metal container is rotated in a horizontal direction to a vertical direction. 14. The heat sink device of claim 1 or 2, further comprising a second capillary structure disposed in the above-described transfer passage. Lj. The heat sink device of claim 1 or 2, wherein a parallel microchannel group formed by a folded metal structure belonging to one of a group consisting of a metal mesh and a metal cloth is disposed in the upper portion of the working fluid path. . 1 6. The heat sink device of claim 2, wherein the capillary structure is replaced by a parallel microchannel capillary structure formed of a folded metal structure made of one of a group consisting of a metal mesh and a metal cloth. 1 7. The heat sink device of claim 16 wherein a structure layer of one of a group consisting of a metal mesh and a metal cloth is added over the capillary structure of the folded micro-channel micro-channel to make the structure The folded metal structure forms a closed parallel microchannel. ^ 1 8 · As claimed in the scope 2 of the heat sink device, wherein the partition plate belongs to Μ 5. Η 1247872 VI. Application for patents The materials are made of one of the metal mesh and metal cloth. 1HHI第21页