M270410 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種散歸置，_侧於—種可將電子元件產生之敎 量迅速散失之散熱裝置。 … 【先前技術】 一酼者電子産業迅速發展，電子元件如中央處理器等運算速度不 向，功能也不斷增強，其產生之熱量也隨之劇增，如何將電子元件產生之 =，速散失贿«正常運作…直係f界在研究之問題。爲有效散失 在運行過程中產生之熱量，可在中央處理器等表面加褒一散 =傳送0、政熱，使其工作于正常溫度範圍内，從而確保資料之處理、保 2昇《ϋ賴效果，通隸賴器與風祕配使用，並採用風管 、、i盘ϋ 風^可將風扇運行產生之氣流導向散熱器’從*可使全部氣 ς^’’、、錢仃熱父換’充分風扇纽之氣流來提昇散熱器之散熱效 ΐ就理器等運算速度越來越快、產生之熱量也越來越多， 之有效散熱面積相應增加以增強散熱性能。而傳統散熱器 曰科^提供—種有效散熱面積較大而體積較小之散熱裝置，係進一步提 升對電子元件散熱效果急需解決之問題。 【新型内容】 置 本到作之目的在於提供一種有效散熱面積較大、且結構緊湊之散熱裝 之散熱裝]2之進一步目的在於提供一種可將電子元件産生之熱量迅速散失 乍政熱裝置包括與電子元件接觸之一吸熱板、一散熱器及一風 M270410 对概雜，射雜純置軌括表面設 2片月文熱框體，該散熱框體與吸熱板形成-中空管道以容置1 之通道 ^ ύ 〇 '、 : ^ ^ -側’風扇運行產生之氣流流經散熱器 其：=:=::= 一且 本創作政Μ置巾散熱鋪触熱板配合形成_ =二使風扇運行產生之氣流全部流過散熱器，充分利 二= ΪΠΐ!熱=上^可增加散熱裝置之有效散熱面積，從 乂耠幵。料，摘作雜裝置巾採賴 具有良好之熱傳導性，故可有效提昇散熱裝置性能。 熱s 【實施方式】 勺杯第—騎不爲本創作散錄置1之—具體實施例。散熱裝置1 c括-吸熱板H)、-散熱器3G、—散熱框體5G、複數熱管7G及—風扇80。 吸熱板10係由熱傳導率高之材料如銅、鱗製成板狀，其一側與中央 處理器接觸（圖中未示）以吸收中央處理紅作時所產生之熱量；其另」 側上設有概溝槽12，㈣容置熱管％之紐段。 、 散熱器3〇包括相互平行之複數散熱片32，且每-散熱片％之頂端及 底端分別設有-折邊，使相鄰散熱片32之間形成預設間距，從而在散熱片 32之間減複數通道（圖中未標號）。每一散熱片％底端分別設有一缺口， 且複數散^ 32之缺口相互連通形成與上述通道撼直之_通路％。此 外，根據實際需要，可將散熱器製成其他形狀，如針柱狀散熱器、由折疊 式鰭片組成之散熱器等。 、—散熱框體5G呈U ，其包括三個侧板52，且在每一侧板52之外部設 有稷數相互平行之H片54，綱卩54及侧板52係通過—體細如紹擠等 =式製成。鰭片54沿散熱框體5G縱向延伸，且在散熱框體5()橫向上設有 複數凹槽56肋容置熱管7〇之冷凝段。在摘狀具體實補中，熱管 M270410 70呈U型’且，、有兩侧板52上設有凹槽％，根據實際需要，也可在每一 侧板52上分別設置凹槽56卩容置熱管％之冷凝段。 时、、且斜’通過知接等方式將散熱器3〇置於吸熱板1〇上部，並使散熱 裔3〇上之通路34與吸熱板1G上之溝槽u相配合以容置熱㈣之蒸發段。 此外，也可將散熱器30與吸熱板1〇 一體製成。散熱框體5〇與吸熱板1〇 相互H成巾工官道肋谷置散熱器％，且散熱器3G通過管道兩端之 通口與外掀通。散熱器30頂部與散熱框體％内表面接觸。通過焊接等 方式將熱管7G之蒸發段、冷赌分·紐吸熱板1()、散熱框體％上， 並將一者碱-體。風扇8〇 @定於散熱㈣％或散熱器％ —端，風扇⑽ 運行産生之氣流全部通過散熱H 3G上之通道，從而提昇散熱器％之散熱 性能。 本創作散Μ置1在使科，吸熱板1G與巾央處㈣翻，並將中央 處理器産生之熱量吸收。吸熱板10吸收之熱量一部分通過熱管7〇之蒸發 &傳導至散熱框體5G上，並通過散熱框體5〇上之則54將熱量散失，由 於熱f 7G依靠其内玉作介質之相變化來傳遞熱量，故可將從吸熱板1〇吸 收之熱量迅速傳導至散熱框體5〇上，從而提昇散熱裝置j之散熱性能。吸 熱板ίο吸收之熱量另一部分通過散熱器30之折邊傳導至散熱片32。散熱 框體50與吸熱板1〇配合形成一中空管道用以容置散熱器3〇，該中空管道 與風官之作用相似，可使風扇8〇運行産生之氣流全部流過散熱器3〇，使散 熱器30與風扇80産生之氣流充分進行熱交換，從而加快熱量散失。此外， 散熱框體50上之鰭片54可增加散熱裝置丨之有效散熱面積，從而進一步 提昇散熱性能。 知上所述’本創作符合新型專利要件，爰依法提出專利申請。惟，以 上所述者僅為本創作之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本 創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係本創作散熱裝置一具體實施例之立體分解示意圖。 M270410 第二圖係第一圖組裝後之示意圖。 【主要元件符號說明】 散熱裝置 1 吸熱板 10 溝槽 12 散熱器 30 散熱片 32 通路 34 散熱框體 50 側面 52 錯片 54 凹槽 56 熱管 70 風扇 80 9M270410 VIII. New type description: [Technical field to which the new type belongs] This creation is about-a kind of scattered placement, _ is focused on-a kind of heat dissipation device that can quickly dissipate the amount of electronic components. … [Previous technology] The electronics industry has developed rapidly, the computing speed of electronic components such as central processing units is not the same, and the functions have been continuously enhanced. The heat generated by them has also increased sharply. How can electronic components be generated? Bribe «normal operation ... directly related to the problem the f-world is studying. In order to effectively dissipate the heat generated during operation, you can add a scatter on the surface of the central processing unit = transfer of 0, political heat, and make it work in the normal temperature range, so as to ensure the processing of data and guarantee 2 liters. The effect is that the device is used in combination with the wind, and the air pipe, i disk is used. The wind ^ can direct the air flow generated by the fan to the radiator. Change the airflow of the fan to improve the heat dissipation efficiency of the radiator. The computing speed such as the processor is getting faster and faster, and the heat generated is increasing. The effective heat dissipation area is increased accordingly to enhance the heat dissipation performance. The traditional radiator provides a heat dissipation device with a large effective heat dissipation area and a small volume, which is a problem that needs to be solved to further improve the heat dissipation effect of electronic components. [New content] The purpose of this book is to provide a heat dissipation device with a large effective heat dissipation area and a compact structure] 2 A further object is to provide a heat dissipation device that can quickly dissipate the heat generated by electronic components. One heat-absorbing plate, one heat-sink, and one-wind M270410 pair that are in contact with the electronic components. The purely placed rails include two moon-shaped thermal frames on the surface. The heat-dissipating frame and the heat-absorbing plate form a hollow pipe to accommodate them. 1 channel ^ ύ 〇 ',: ^ ^-side' The air flow generated by the fan runs through the radiator. It is: =: = :: = One and this creative policy is placed on the heat-dissipating floor of the heat sink to form _ = 二 使The airflow generated by the fan runs all through the radiator. Full benefit = ΪΠΐ! Heat = up ^ can increase the effective heat dissipation area of the heat dissipation device, so that It is suitable for miscellaneous devices. It has good thermal conductivity, so it can effectively improve the performance of heat sinks. Hot s [Implementation] The specific example of the spoon cup first-riding is not stored in this creative collection 1-. The heat radiating device 1 c includes a heat absorbing plate H), a heat sink 3G, a heat radiating frame 5G, a plurality of heat pipes 7G, and a fan 80. The heat absorption plate 10 is made of a material with high thermal conductivity such as copper and scale. One side of the heat absorption plate 10 is in contact with the central processing unit (not shown) to absorb the heat generated during the central processing of the red crop; the other side is It is provided with an approximate groove 12 to accommodate the knuckle section of the heat pipe. The heat sink 30 includes a plurality of heat sinks 32 parallel to each other, and the top and bottom ends of each-heat sink% are respectively provided with a -folding edge, so that a predetermined distance is formed between adjacent heat sinks 32, so that the heat sink 32 Subtract complex number channels (not labeled in the figure). A notch is provided at the bottom end of each heat sink, and the notches of plural scattered ^ 32 communicate with each other to form a _path% that is straight to the above-mentioned channel. In addition, according to actual needs, the radiator can be made into other shapes, such as a pin-shaped radiator, a radiator composed of folding fins, and the like. -The heat dissipation frame 5G is U, which includes three side plates 52, and the number of H pieces 54 parallel to each other is provided on the outside of each side plate 52. The frame 54 and the side plate 52 are passed through as detailed as Shaw extrusion is equal to formula. The fins 54 extend longitudinally along the heat dissipation frame 5G, and a plurality of grooves 56 ribs are provided in the lateral direction of the heat dissipation frame 5 () to accommodate the condensation section of the heat pipe 70. In the actual implementation of the picking, the heat pipe M270410 70 is U-shaped, and there are grooves on the two side plates 52. According to actual needs, grooves 56 can also be provided on each side plate 52. Set the condensation section of the heat pipe%. Timely, and obliquely, the heat sink 30 is placed on the upper part of the heat absorbing plate 10 by means of known connection, and the passage 34 on the heat radiating member 30 is matched with the groove u on the heat absorbing plate 1G to accommodate heat Of evaporation section. In addition, the heat sink 30 and the heat absorption plate 10 may be integrally manufactured. The heat dissipation frame 50 and the heat absorbing plate 10 mutually form a heat sink, and the radiator 3G is opened to the outside through the openings at both ends of the pipe. The top of the heat sink 30 is in contact with the inner surface of the heat dissipation frame. The evaporation section of the heat pipe 7G, the cold betting points and buttons 1 (), and the heat dissipation frame% are welded by welding or the like, and one of them is alkali-body. The fan 80 is set at the heat sink ㈣% or the heat sink% end. The airflow generated by the fan ⑽ operation all passes through the channels on the heat sink H 3G, thereby improving the heat dissipation performance of the heat sink%. In this work, set M to 1 and flip the heat sink 1G and the center of the towel, and absorb the heat generated by the central processing unit. A part of the heat absorbed by the heat absorption plate 10 is transmitted to the heat dissipation frame 5G through the evaporation of the heat pipe 70, and is dissipated through the rule 54 on the heat dissipation frame 50. Because the heat f 7G depends on the phase of the internal jade as the medium Change to transfer heat, so the heat absorbed from the heat absorption plate 10 can be quickly transferred to the heat dissipation frame 50, thereby improving the heat dissipation performance of the heat dissipation device j. The other part of the heat absorbed by the heat absorption plate is conducted to the heat sink 32 through the folded edge of the heat sink 30. The heat dissipation frame 50 cooperates with the heat absorption plate 10 to form a hollow pipe for accommodating the heat sink 30. The hollow pipe has a role similar to that of the wind officer, and can make all the airflow generated by the fan 80 run through the heat sink 30. The heat exchange between the radiator 30 and the air flow generated by the fan 80 is fully performed, so that the heat dissipation is accelerated. In addition, the fins 54 on the heat dissipation frame 50 can increase the effective heat dissipation area of the heat dissipation device, thereby further improving the heat dissipation performance. Knowing that the above-mentioned creation complies with the requirements for a new type of patent, a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with the skills of this case and equivalent modifications or changes based on the spirit of this creation should be covered by the following patent applications. [Brief description of the drawings] The first figure is a three-dimensional exploded view of a specific embodiment of the heat dissipation device of the present invention. M270410 The second picture is a schematic diagram after the first picture is assembled. [Description of main component symbols] Heat sink 1 Heat sink 10 Groove 12 Heat sink 30 Heat sink 32 Passage 34 Heat sink frame 50 Side 52 Wrong piece 54 Groove 56 Heat pipe 70 Fan 80 9