201118022 六、發明說明： 【發明所屬之技術領域】 本發明係與物件之運送方法額，特別是Μ於，種可 使電子S件於運送過財免於損毀之運送方法。 【先前技街】 隨著電子科技的進步，電子元件越來越精密，尤其是 聽反應外界環境的電子式感鮮，時常會在運送途中受 » 浙力撞擊而損毁。為了解決此一問題U分業者係 在一個拖盤(Tray)上設置若干獨立容室，然後分別於各容室 内置入-電子元件來運送，此等方式由於電子元件無法與 谷至之形狀完全密合，也就是說當電子元件容置於托盤的 谷至後一者間會有空隙，因此電子元件仍會在運送過程中 與谷室壁面碰撞而損毁。另外有部分業者則是將電子元件 黏貼於膠帶上來運送，但是當運送完成而要將電子元件拔 鲁離膠帶時’常會因施工者之用力不當而將之損毀。 【發明内容】 本I月之主要目的即是在提供一種改良的電子元件運 送法’其可電子元件於運送過程中被毁損的機率降至最低。 為達成前述之目的，本發明所提供的電子元件運'_ 係包含下述步驟：首先係取用-盤體(Tray)，在軸體^少 佈設-開口容室，或者多個並排而且頂端開口且相互獨二 之容室；繼之，將待運送的電子元件置放於該容室内接 3 201118022 著是將不會與該電子元件反應之液體引入並填滿該容室； 最後再封閉該容室，例如取用一上蓋覆蓋於該容室開口端 用以封閉該容室。藉此，無論是何種形狀的電子元件，當 被置放於容室後其運動空間會受到填滿於容室内之液體所 限制’因此即不會發生運送過程中因碰撞而損毀之情形。 本發明之另一特徵是在提供一種運送電子元件之托 盤，該托盤包含有一盤體，具有至少具有一頂端開口之容 至，用以容置電子元件，以及一可開啟及閉合之第一通孔。 一上蓋覆蓋於該盤體上端，其上設有一可開啟及閉合之第 二通孔。以及填滿於該容室且不會與該電子元件反應之液 體。 本發明之再一特徵則是在提供一種運送電子元件之托 盤，該托盤包含有一盤體，具有一呈開口狀之上端，至少 —容室用以容置電子元件，以及一可開啟及閉合之第一通 孔與第二通孔。一上蓋係覆蓋於該盤體上端。填滿於該容 室且不會與該電子元件反應之液體。 【實施方式】 以下兹舉一實施例並配合圖式對本發明做進一步的說 明，其中： 第一圖為本發明一較佳實施例所取用的盤體之斷面示 意圖； 第二圖為本發明一較佳實施例將電子元件置入盤體容、 室内之示意圖； 201118022 第二圖為本發明一較佳實施例將一上蓋蓋合於盤體頂 端之示意圖； 第四圖為本發明一較佳實施例將第三圖所示已容置有 電子元件之盤體置入於一液體槽中之示意圖 ;以及 第五圖為本發明一較佳實施例將第四圖各容室已填滿 液體之盤體自液體槽取出之示意圖。 、 請參閱各圖式’第一圖是顯示本發明運送法所取用之 • 盤體10’其藉由隔牆12形成多數頂端開口的獨立容室20, 各谷至20的底壁14設有一下通孔16。 第二圖係顯示將多數的電子元件3〇分別置入各容室 20内，第二圖係顯示當將電子元件川置入容室後取 2 一上蓋40蓋合於盤體10上端，用以封閉各容室20,上 蓋40設有多數分別對應各容室2〇之上通孔42。 第四圖係用來說明如何將液體填滿各容室2〇，於本實 施例是將前述各容室2〇ei置有電子元件3〇之盤體1〇放置 • 於一_ 50内，然後以適當的設備，例如Pump，引入不 會與該電子元件反應之液體6G，例如去離子水(d i201118022 VI. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to a method of transporting articles, and in particular, a method of transporting electronic components that are transported to avoid damage. [Previous Technology Street] With the advancement of electronic technology, electronic components are becoming more and more sophisticated, especially in response to the electronic environment of the external environment, which is often damaged by the impact of Zhejiang. In order to solve this problem, the U-separator sets up a plurality of independent chambers on a Tray, and then carries the electronic components in the respective chambers for transportation. These methods are completely incapable of being completely shaped with the valleys. Close contact, that is to say, when there is a gap between the electronic component and the valley of the tray, the electronic component will still collide with the wall of the valley during transportation and be damaged. In addition, some operators attach electronic components to the tape to transport them, but when the shipment is completed and the electronic components are removed from the tape, it is often damaged by the improper use of the constructor. SUMMARY OF THE INVENTION The main purpose of this month is to provide an improved electronic component transport method that minimizes the chances of electronic components being destroyed during shipping. In order to achieve the foregoing object, the electronic component provided by the present invention comprises the following steps: firstly, a tray is used, and the shaft body is arranged in a small amount - an open chamber, or a plurality of side by side and a top end. Opening and mutually exclusive chambers; then, placing the electronic components to be transported in the chamber 3 201118022 is to introduce and fill the chamber with liquid that does not react with the electronic components; The chamber, for example, is covered with an upper cover to cover the open end of the chamber for closing the chamber. Thereby, regardless of the shape of the electronic component, when it is placed in the chamber, its movement space is limited by the liquid filled in the chamber. Therefore, it is not damaged by the collision during transportation. Another feature of the present invention is to provide a tray for transporting electronic components, the tray comprising a tray having at least one top opening for receiving electronic components and a first opening for opening and closing hole. An upper cover covers the upper end of the disk body, and a second through hole that can be opened and closed is disposed thereon. And a liquid that fills the chamber and does not react with the electronic component. Still another feature of the present invention is to provide a tray for transporting electronic components, the tray comprising a tray having an open upper end, at least - a chamber for accommodating electronic components, and an openable and closable a first through hole and a second through hole. An upper cover covers the upper end of the tray. A liquid that fills the chamber and does not react with the electronic component. [Embodiment] The present invention will be further described with reference to the embodiments, in which: FIG. 1 is a schematic cross-sectional view of a disk body taken in accordance with a preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a state in which an electronic component is placed on a disk body and a room; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A schematic view of a disk body in which an electronic component is housed in a third embodiment is placed in a liquid bath; and a fifth embodiment of the present invention is filled in a fourth embodiment. Schematic diagram of the liquid-filled disk body taken out of the liquid tank. Please refer to the drawings. The first figure shows the disk body 10' used for the transportation method of the present invention. The partition wall 12 forms a plurality of independent chambers 20 with a top opening, and the bottom walls 14 of each valley to 20 are provided. There is a through hole 16 in the first place. The second figure shows that a plurality of electronic components 3 are respectively placed in the respective chambers 20. The second figure shows that when the electronic components are placed in the chamber, two upper covers 40 are attached to the upper end of the disk body 10, In order to close the chambers 20, the upper cover 40 is provided with a plurality of through holes 42 respectively corresponding to the respective chambers 2〇. The fourth figure is used to explain how to fill the respective chambers with liquids. In this embodiment, the trays 1 of the electronic chambers 3 are placed in the chambers 1〇50. Then introduce a liquid 6G that does not react with the electronic component, such as deionized water (di), with a suitable device, such as Pump.
Water)，純水、酒精或異兩醇(IpA)等，此時，液體將分 ^自上通孔42及下通孔16流進並填滿各容室2()，接著則 疋將上if孔42及下軌16以套塞44封閉舰體留置於各 容室20内。 第五圖疋顯不將各容室2〇已填滿液體 60之盤體10 自槽H 50取出’此時即可施行運送，而當到達目的地後， 將上蓋40取下’ _打開下通孔16排出液體6g，最後再 201118022 進行烘乾之步驟。 述可知本_首_賴作為料電子元件的緩 ’此種運送方式,66备士復田W日4+ Y A _Water), pure water, alcohol or isopropanol (IpA), etc., at this time, the liquid will flow into the upper through hole 42 and the lower through hole 16 and fill each chamber 2 (), and then the upper portion will be The if hole 42 and the lower rail 16 are enclosed by the plug 44 to be placed in the respective chambers 20. The fifth figure shows that the trays 10 of the chambers 2 filled with the liquid 60 are not taken out from the tank H 50. At this time, the transport can be carried out, and when the destination is reached, the upper cover 40 is removed. The through hole 16 discharges the liquid 6g, and finally the drying step is performed in 201118022. It can be seen that this _ first _ 赖 as the electronic component of the slow ‘ this delivery method, 66 士士复田W日 4+ Y A _
衝器(Buffet·；)， 易， 而損致。 【圖式簡單說明】 第一圖為本發明一較佳實施例所取用的盤體之斷面示 意圖； 第二圖為本發明一較佳實施例將電子元件置入盤體容 室内之示意圖； 第二圖為本發明一較佳實施例將一上蓋蓋合於盤體頂 端之示意圖； 第四圖為本發明一較佳實施例將第三圖所示已容置有 電子元件之盤體置入於一液體槽中之示意圖；以及 第五圖為本發明一較佳實施例將第四圖各容室已填滿 液體之盤體自液體槽取出之示意圖。 【主要元件符號說明】 盤體10 隔牆12 底壁14 下通孔16 容室20 電子元件30 上蓋40 通孔42 套塞44 槽體50 液體、60Punch (Buffet·;), easy, and damage. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic cross-sectional view of a disk body taken in accordance with a preferred embodiment of the present invention. The second figure is a schematic view of an electronic component placed in a disk body compartment according to a preferred embodiment of the present invention. The second figure is a schematic view of a top cover of a disk according to a preferred embodiment of the present invention; the fourth figure is a disk of the electronic device shown in the third figure according to a preferred embodiment of the present invention; A schematic view of being placed in a liquid bath; and a fifth view of the fourth embodiment of the present invention, wherein the trays filled with liquid in each of the fourth chambers are taken out from the liquid tank. [Main component symbol description] Disk body 10 Partition wall 12 Bottom wall 14 Lower through hole 16 Room 20 Electronic component 30 Upper cover 40 Through hole 42 Plug 44 Tank 50 Liquid, 60