GB2367946B - Heat sink for electronic parts and manufacture thereof - Google Patents

Heat sink for electronic parts and manufacture thereof

Info

Publication number
GB2367946B
GB2367946B GB0107406A GB0107406A GB2367946B GB 2367946 B GB2367946 B GB 2367946B GB 0107406 A GB0107406 A GB 0107406A GB 0107406 A GB0107406 A GB 0107406A GB 2367946 B GB2367946 B GB 2367946B
Authority
GB
United Kingdom
Prior art keywords
manufacture
heat sink
electronic parts
electronic
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0107406A
Other versions
GB2367946A (en
GB0107406D0 (en
Inventor
Kazuo Mizutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mizutani Electric Ind Co Ltd
Original Assignee
Mizutani Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mizutani Electric Ind Co Ltd filed Critical Mizutani Electric Ind Co Ltd
Publication of GB0107406D0 publication Critical patent/GB0107406D0/en
Publication of GB2367946A publication Critical patent/GB2367946A/en
Application granted granted Critical
Publication of GB2367946B publication Critical patent/GB2367946B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0107406A 2000-10-12 2001-03-23 Heat sink for electronic parts and manufacture thereof Expired - Fee Related GB2367946B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000311437A JP2002118211A (en) 2000-10-12 2000-10-12 Radiator of electronic component and manufacturing method of the radiator

Publications (3)

Publication Number Publication Date
GB0107406D0 GB0107406D0 (en) 2001-05-16
GB2367946A GB2367946A (en) 2002-04-17
GB2367946B true GB2367946B (en) 2004-12-01

Family

ID=18791199

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0107406A Expired - Fee Related GB2367946B (en) 2000-10-12 2001-03-23 Heat sink for electronic parts and manufacture thereof

Country Status (3)

Country Link
US (1) US20020043359A1 (en)
JP (1) JP2002118211A (en)
GB (1) GB2367946B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561790B (en) * 2014-08-12 2016-12-11

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202303B1 (en) * 1999-04-08 2001-03-20 Intel Corporation Method for producing high efficiency heat sinks
TW535489B (en) * 2002-05-31 2003-06-01 Peng Jian Composite working method of heat conduction device and the product thereof
US7497013B2 (en) 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
FR2898668B1 (en) * 2006-03-15 2008-06-27 Ferraz Date Ind Soc Par Action HEAT EXCHANGER FOR COOLING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
JP2011054778A (en) * 2009-09-02 2011-03-17 Furukawa-Sky Aluminum Corp Heat exchanger using comb-type radiation unit
US20110220338A1 (en) * 2010-03-11 2011-09-15 Kun-Jung Chang Led heat sink and method of manufacturing same
US9915482B2 (en) * 2010-06-07 2018-03-13 Mitsubishi Electric Corporation Heat sink, and method for producing same
US9591788B2 (en) * 2011-04-13 2017-03-07 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
CN102522381B (en) * 2011-12-22 2015-09-30 东莞汉旭五金塑胶科技有限公司 A kind of Radiator and its preparation method
JP5722394B2 (en) * 2013-07-11 2015-05-20 株式会社タクボ精機製作所 Heat exchanger
CN111829285B (en) * 2020-06-01 2022-11-25 佛山市伟卓铝业有限公司 Aluminum alloy heat abstractor with extend function

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0800890A1 (en) * 1996-04-08 1997-10-15 Tousui Ltd Heat sink
DE19845374A1 (en) * 1998-10-02 2000-04-20 Swg Metallverarbeitung Und Mon Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0800890A1 (en) * 1996-04-08 1997-10-15 Tousui Ltd Heat sink
DE19845374A1 (en) * 1998-10-02 2000-04-20 Swg Metallverarbeitung Und Mon Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561790B (en) * 2014-08-12 2016-12-11

Also Published As

Publication number Publication date
GB2367946A (en) 2002-04-17
JP2002118211A (en) 2002-04-19
GB0107406D0 (en) 2001-05-16
US20020043359A1 (en) 2002-04-18

Similar Documents

Publication Publication Date Title
TW438215U (en) Heat sinks in an electronic production
TW491376U (en) Heat sink
TW510642U (en) Heat dissipating
GB2385464B (en) Heat sink material
GB0106547D0 (en) Heat sinks
EP1349210A4 (en) Heat sink and electronic device with heat sink
EP1391926A4 (en) Heat sink and its manufacturing method
GB2367946B (en) Heat sink for electronic parts and manufacture thereof
TW484794U (en) Heat sink
TW547699U (en) Heat sink device
TW587901U (en) Heat dissipation structure for electronic component
TW560832U (en) Heat sink fastener
EP1357771A4 (en) Electronic parts
GB0124220D0 (en) Thermal circuit
AU2001266121A1 (en) Printed circuit heat sink and methods for making same
TW444934U (en) Stack-to-encase type heat sink structure for integrated circuit
TW560833U (en) Heat sink
CA96562S (en) Heat sink
TW474558U (en) Heat sink structure
TW491512U (en) Heat sink
TW508064U (en) Heat sink combination for electronic device
TW474553U (en) Heat sink fastener
TW505379U (en) Heat sink
TW536129U (en) Heat sink
TW504132U (en) Heat sink

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070323