TW444934U - Stack-to-encase type heat sink structure for integrated circuit - Google Patents

Stack-to-encase type heat sink structure for integrated circuit

Info

Publication number
TW444934U
TW444934U TW89209384U TW89209384U TW444934U TW 444934 U TW444934 U TW 444934U TW 89209384 U TW89209384 U TW 89209384U TW 89209384 U TW89209384 U TW 89209384U TW 444934 U TW444934 U TW 444934U
Authority
TW
Taiwan
Prior art keywords
encase
stack
integrated circuit
heat sink
type heat
Prior art date
Application number
TW89209384U
Other languages
Chinese (zh)
Inventor
Jin-Ru Yang
Original Assignee
Yang Jin Ru
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yang Jin Ru filed Critical Yang Jin Ru
Priority to TW89209384U priority Critical patent/TW444934U/en
Publication of TW444934U publication Critical patent/TW444934U/en

Links

TW89209384U 2000-06-01 2000-06-01 Stack-to-encase type heat sink structure for integrated circuit TW444934U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89209384U TW444934U (en) 2000-06-01 2000-06-01 Stack-to-encase type heat sink structure for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89209384U TW444934U (en) 2000-06-01 2000-06-01 Stack-to-encase type heat sink structure for integrated circuit

Publications (1)

Publication Number Publication Date
TW444934U true TW444934U (en) 2001-07-01

Family

ID=21668659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89209384U TW444934U (en) 2000-06-01 2000-06-01 Stack-to-encase type heat sink structure for integrated circuit

Country Status (1)

Country Link
TW (1) TW444934U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113380732A (en) * 2021-04-22 2021-09-10 湖南迈克森伟电子科技有限公司 Optimization design of novel high-performance heat dissipation base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113380732A (en) * 2021-04-22 2021-09-10 湖南迈克森伟电子科技有限公司 Optimization design of novel high-performance heat dissipation base

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees