TW491510U - Heat sink module - Google Patents

Heat sink module

Info

Publication number
TW491510U
TW491510U TW89204978U TW89204978U TW491510U TW 491510 U TW491510 U TW 491510U TW 89204978 U TW89204978 U TW 89204978U TW 89204978 U TW89204978 U TW 89204978U TW 491510 U TW491510 U TW 491510U
Authority
TW
Taiwan
Prior art keywords
heat sink
sink module
module
heat
sink
Prior art date
Application number
TW89204978U
Other languages
Chinese (zh)
Inventor
A-Shing Guo
Yung-Guang Shiu
Yi-Nan Liou
Feng-Yu Jiang
Original Assignee
Foxconn Prec Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Prec Components Co Ltd filed Critical Foxconn Prec Components Co Ltd
Priority to TW89204978U priority Critical patent/TW491510U/en
Publication of TW491510U publication Critical patent/TW491510U/en

Links

TW89204978U 2000-03-29 2000-03-29 Heat sink module TW491510U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89204978U TW491510U (en) 2000-03-29 2000-03-29 Heat sink module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89204978U TW491510U (en) 2000-03-29 2000-03-29 Heat sink module

Publications (1)

Publication Number Publication Date
TW491510U true TW491510U (en) 2002-06-11

Family

ID=21665849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89204978U TW491510U (en) 2000-03-29 2000-03-29 Heat sink module

Country Status (1)

Country Link
TW (1) TW491510U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633831B (en) * 2017-09-29 2018-08-21 威剛科技股份有限公司 Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633831B (en) * 2017-09-29 2018-08-21 威剛科技股份有限公司 Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function
US10152097B1 (en) 2017-09-29 2018-12-11 Adata Technology Co., Ltd. Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004