GB2367946A - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- GB2367946A GB2367946A GB0107406A GB0107406A GB2367946A GB 2367946 A GB2367946 A GB 2367946A GB 0107406 A GB0107406 A GB 0107406A GB 0107406 A GB0107406 A GB 0107406A GB 2367946 A GB2367946 A GB 2367946A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat dissipation
- base plate
- dissipation fins
- heat sink
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Abstract
A plate 10 having fins 11 is joined to a baseplate 14 having recessed grooves 15 and holding protrusions 17 by a pressing operation. Protrusions on the finned plate are located within the recesses on the baseplate by means of pressing members 18a and and holding protrusions 17a are bent by pressing members 18b to further secure the two parts together.
Description
2367946 HEAT SINK FOR ELECTRONIC PARTS AND MANUFACTURE THEREOF The present
invention relates to a heat sink for electronic parts and more 5 particularly relates to a heat sink for electronic parts made of Transistor, IC, LSI, Diode or Thyristor to cause heat during practical operation, the heat being conducted and dissipated from the heat sink fins.
Conventional heat sink made of aluminum has been disclosed in the 10 Japanese Patent Publication No. 3-40506. Reference is made with FIG.1 to explain such conventional heat sink, A substrate 1 made of aluminum and heat dissipation fins 2 formed by bending aluminum band sheets into the rectangular corrugated plate are soldered to prepare a heat sink. In the process of manufacturing heat sink, two vertically protruded edge frames 3, 3 15 provided in parallel with each other at each edge of the substrate 1 respectively are formed on the substrate 1 with a predetermined distance. The heat dissipation fins are placed between said oppositely faced protruded edge frames 3, 3. As shown in FIG.1, the heat dissipation fins extend to a full width between the protruded edge frames 3, 3 provided on the substrate 1 20 in parallel with each other, and a portion of the protruded edge frame 3 where the heat dissipation fins 2 and said protruded edge frame 3 come into contact with each other is pressed by means of a mold to stretch out said portion toward inside the substrate 1. Reference numeral 3a indicates the portion stretched out inside the substrate 1 in FIGA. The portions 3a, 3a secure the 25 heat dissipation fins 2 to the substrate 1. Next, the substrate 1 and the heat dissipation fins 2 are soldered together.
It has been pointed out in the conventional method that the heat dissipation fins 2 and the substrate 1 are to be soldered because if the heat dissipation fins 2 are secured to the substrate 1 only by means of the 5 aforementioned portions 3a,3a, the heat dissipation fins 2 will not perfectly contact the substrate 1 and the heat generated in the substrate 1 is not perfectly conducted to the heat dissipation fins 2.
It is, therefore, required in the conventional 10 manufacturing method of heat sink to solder the heat dissipation fins 2 to the substrate 1. However, in order to proceed the soldering process some soldering instalments are inevitably required. This is a problem in conventional method.
15 Further, as bending the aluminium band sheet into a rectangular corrugated sheet makes the heat dissipation fins, plate thickness of the heat dissipation fins is limited to be thinner taking into consideration of easy handling. Accordingly, if the heat dissipation fins made 20 of thinner plate should collide other materials such as electronic parts or housings or the like, the fins are easily distorted.
The present invention has been made with the foregoing background in mind. It would be desirable to be able to
3 offer an easy processing method and yet most durable heat sinks for electronic parts and manufacture thereof.
According the one aspect of the present invention there is provided a heat sink for electronic parts 5 comprising a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance, a metal base plate provided with a plurality of bottom expanded recesses on the flat surface with a predetermined distance,. pressing a portion corresponding to the bottom expanded 10 recesses provided on the flat surface between the fins to press down protrusions provided on the back side of the metal flat plate to press into the bottom expanded recesses to fix the heat dissipation fins and the base plate securely.
15 According to a further aspect of the present invention there is provided a heat sink for electronic parts comprising a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance, a metal base plate provided with a plurality of bottom expanded 20 recesses on the flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold both ends of the heat dissipation fins, pressing the portion corresponding to the bottom expanded recesses of the metal flat plate between fins and to press the 25 protrusions provided on the back side of said flat plate 4 to press into said bottom expanded recesses and to press the holding protrusions provided on the edges of the base plate toward the side of the heat dissipation fins to fix said heat dissipation fins and the base plate securely.
5 According to a still further aspect of the present invention there is provided a manufacturing process of a heat sink for electronic parts comprising a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance and a metal base plate provided with 10 a plurality of bottom expanded recesses on the flat surface with a predetermined distance are prepared, and pressing a portion corresponding to the bottom expanded recesses of the flat plate between the fins to press down protrusions provided on the back side of the flat surface plate to 15 press into the bottom expanded recesses to fix the heat dissipation - fins and the base plate securely.
According to a still further aspect of the present invention there is provided a manufacturing process of a heat sink for electronic parts comprising a plurality of 20 heat dissipation fins provided on a metal flat plate with a predetermined distance, a metal base plate provided with a plurality of bottom expanded recesses provided on the metal flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold at both 25 ends of the plate, pressing the portions corresponding to 4.-f 5 the bottom expanded recesses of the flat plate between fins and to press down the protrusions provided on the back side of said flat plate into said bottom expanded recesses and to press the holding protrusions provided on the base plate 5 toward the side of the fins to fix the heat dissipation fins and the base plate securely.
By way of examples only, the aspects of the invention will be described in greater detail with reference to the accompanying drawings of which:
10 Fig. 1 is a perspective view of the conventional aluminium heat sink.
Fig. 2 indicates a heat sink for electronic parts disclosed in claim 1 according to the present invention.
Fig. 3 illustrates a manufacturing process for the 15 heat sink for the electronic parts disclosed in claim 3 according to the present invention.
FIGA indicates a heat sink for the electronic parts disclosed in claim 2 according to the present invention.
FIG.5 illustrates a manufacturing process for the heat sink for the electronic parts disclosed in claim 4 according to the present invention.
5 FIG.6 indicates another example of the preferred embodiments for the heat sink for the electronic parts disclosed in claim 2 according to the present invention.
FIG.7 indicates a cross-section partly cut the heat sink for the electronic parts disclosed in claim 2 according to the present invention.
Now an example of the preferred embodiments of the heat sink disclosed in claim I according to the present invention is explained with reference to 15 the accompanying drawing FIG.2A, 2B and 2C.
FIG.2A indicates a perspective view of the heat sink according to the present invention. FIG.2B indicates a perspective view of the base plate.
FIG.2C indicates a perspective view of the heat sink for the electronic parts I fix comprising the heat dissipation fins are pressed by the mold to the heat 20 dissipation fins to the base plate. The heat sink according to the present invention is prepared by extruding a metal of good heat conduction such as aluminum or the like. The heat sink comprises heat dissipation fins 12 provided with a plurality of fins 11 formed on the flat metal plate 10 with a predetermined distance and a base plate 16 provided with a plurality of -25 bottom-expanded recesses 15 formed on the flat plate 14 with a predetermined distance. As shown in FIG.2C, the portions corresponding to the bottom-expanded recesses 15 on the flat surface 14 between the fins 11 are pressed down by means of the mold 18 to press down protrusions 13 (refer to FIG.3B2) provided on the back side of said flat metal plate 10 into said bottom-expanded recesses 15 to fix said plurality of heat dissipation fins 12 5 and the base plate together. The bottom-expanded recesses 15 are made like dovetail grooves in the embodiments of the present invention. It is of course possible to form a recessed hole of dovetail groove. The recessed hole of dovetail groove configuration is not made by means of press extrusion but other extrusion method is applied. Reference numeral 18a indicates 10 protrusions to press and distort the flat metal plate 10 provided on the mold 18.
As aforementioned, the heat sink according to the present invention is made by pressing down the protrusions 18a provided in the mold 18 to press the corresponding portions to the bottom-expanded recesses 15 of the flat 15 metal plate 10 between the fins 11 to press down said protrusions 13 into the bottom-expanded recesses 15 to fix the heat dissipation fins 12 to the base plate 16. The soldering installation is not required. Thus, manufacturing cost is reduced.
The heat sink for electronic parts disclosed in claim 2 of the present 20 invention is explained with reference to the drawings FIG.4A, 4B and 4C. FIGAA is a perspective view of the heat sink. FIGAB is a perspective view of the base plate. FIGAC is a perspective view of the heat sink for electronic parts prepared by pressing the heat sink to the base plate by means of the mold. The heat sink for electronic parts comprises a heat sink provided with 25 a plurality of heat dissipation fins 12 formed on the surface of the flat metal plate 10 with a predetermined distance and the base plate 16 provided with "'7- Cg the protrusions 17, 17 to hold the both ends of said heat dissipation fins 12 on the surface of the flat plate 14 with a predetermined distance to hold together with the plurality of bottom-expanded recesses 15. The corresponding portion to the bottom-expanded recesses 15 on the flat plate 10 between the 5 fins 11 is pressed down by means of the mold 18 to press the protrusions 13 provided on the back side of the flat metal plate 10 into said recesses 15 (refer to FIG.5B2). The holding protrusions 17, 17 formed on the edge plate 16 are pressed and distorted toward the side of the heat dissipation fins 12 to fix said heat dissipation fians 12 and the base plate 16 tightly to prepare heat sink 10 for electronic parts according to the present invention.
Reference numeral 18b indicates a press protrusion to press and distort the holding protrusions 17. It is possible to construct the heat dissipation fins 12 and the base plate 16 simply and perfectly fixed together without soldering. Both edges of the heat dissipation fins 12 are held firmly by being 15 held with the protrusions 17, 17. The heat dissipation fins 12 and the base plate 16 are fixed tightly. A durable construction is obtained.
In this embodiment, two protrusions 17, 17 are formed to hold the both ends of the heat dissipation fins 12 facing with each other.
It goes without saying that holding another both ends of the heat 20 dissipation fins 12 by additional protrusions 17, 17 provided crossing at right angle to the edge side protrusions 17, 17 can offer more durable structure of heat dissipation fins (not shown in figure).
The manufacturing process of the heat dissipation fins disclosed in claim 3 according to the present invention is explained with reference to the 25 accompany drawing FIG.3A1, 3A2, 3B1 and 3B2. Firstly, the heat sink is prepared by extruding a metal of good heat transmission such as aluminu m or the like. The heat sink comprises heat dissipation fins 12 provided with a plurality of fins 11 formed on the plate 10 with a predetermined distance and a base plate 16 provided with a plurality of bottom-expanded recesses 15 formed on the flat plate 14 with a predetermined distance. As shown in 5 front view of FIG.3A1 and right side view of FIG.3A2, a plurality of heat dissipation fins 12 are provided on the base plate 16. Next, as shown in front view of FIG.3B1 and right side view of FIG.3B2, the corresponding portion of the flat plate 10 to a plurality of bottomexpanded recesses 15 between the fins 11 are pressed down by means of the mold 18 to press insert the 10 protrusions 13 provided on the back side of the flat plate 10 into the bottom-expanded recesses 16 to fix said heat dissipation fins 12 and said base plate 15 securely.
In accordance with this manufacturing process of the heat sink for electronic parts, said heat dissipation fins 12 and the base plate 16 are 15 perfectly fixed without soldering. The manufacturing process is simple but securely fixed construction is obtained. The manufacturing cost is reduced.
The manufacturing process of the heat sink for electronic parts disclosed in claim 4 is explained with reference to FIG.5A1 and 5A2. At first, the heat dissipation fins 12 provided with a plurality of fins 11 on the flat plate 10 with 20 a predetermined distance and the base plate 16 provided with a plurality of the bottom expanded recesses 15 formed on the plate surface 14 with a predetermined distance and further provided with the holding protrusions 17, 17 to hold the edges of said heat dissipation fins 12 are prepared by extruding a metal of good heat conduction such as aluminum. Next, as shown in front 25 view of FIG.5A1 and right side view of FIG.5A2, the corresponding portions on the flat plate 10 between the fins 11 to the bottom-expanded recesses 15 ar ( C:> are pressed down by means of the mold 18 to press insert said protrusions provided on the back side of said flat plate 10 into the bottom-expanded recesses 15 and at the same time the holding protrusions 17, 17 provided on the base plate 16 to press and distort said protrusions 17, 17 toward the side 5 of the heat dissipation fins 12.
The heat dissipation fins 12 and the base plate 16 are fixed as aforementioned. The heat sink for electronic parts according to the present invention is prepared without soldering. The heat dissipation fins 12 and the base plate 16 are fixed together. A durable construction is obtained.
10 If holding protrusions 17, 17 are pressed to distort toward the side of the heat dissipation fins 12, the fins 11 are strongly supported and the heat dissipation fins 12 are tightly held to the base plate 16.
FIG.6A, 6B and 6C indicate another example of the preferred embodiments of the present invention. FIG.6A is a perspective view of the 15 heat dissipation fins 12. FIG.613 is a perspective view of the base plate 16.
FIG.6C is a perspective view of the heat sink for electronic parts prepared by pressing the heat dissipation fins 12 toward the base plate 16. FIG.7 is a partly vertical cross-section of the heat sink shown in FIG.6. In this embodiment, the heat sink is pressed at the portions corresponding to said 20 bottom expanded recesses 15 of the flat plate 10 between fins 11, 11 by means of the mold 18 to press down the protrusions provided on the back side of the flat plate 10 into the bottom expanded recesses 15 and the holding protrusions 17, 17 provided on the base plate 16 are slightly bent toward the side of the heat dissipation fins 12. The portion 17a is pressed down to cover 25 the edges of the flat plate 10 of the heat dissipation fins 12. As shown in FIG.6C, the press mold 18 is devised to press down the portion 17a between the fins 11 of the holding protrusion 17 to cover the flat plate 10 of the heat dissipation fins 12 (e.g. dividing the press protrusion 18b of the mold 18).
EFFECT OF THE INVENTION As aforementioned, claim 1 (heat sink) and claim 3 (manufacturing 5 method of the heat sink) present a heat sink by pressing the portion corresponding to the bottom-expanded recesses of the flat plate between the fins by means of the mold to press the protrusions provided on the back side of the flat plate toward the base plate to press down the protrusions into the bottom-expanded recesses. The perfectly fixed construction of the heat 10 dissipation fins and the base plate is obtained. The manufacturing process is done without soldering installation. The manufacturing cost is greatly reduced, As aforementioned, claim 2 (heat sink) and claim 4 (manufacturing method of the heat sink) present a heat sink by fixing the heat dissipation 15 fins and the base plate without soldering. The heat dissipation fins are fixed at its ends to the base plate with the holding protrusions. Construction of the heat dissipation fins with the base plate is firm.
Claims (6)
1. A heat sink for electronic parts comprising:
a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance, 5 a metal base plate provided with a plurality of bottom-expanded recesses on the flat surface with a predetermined distance, pressing a portion corresponding to the bottom-expanded recesses provided on the flat surface between the fins to press down protrusions provided on the back side of the metal flat plate to press into the 10 bottom-expanded recesses to fix the heat dissipation fins and the base plate securely.
2. A heat sink for electronic parts comprising:
a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance, 15 a metal base plate provided with a plurality of bottom-expanded recesses on the flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold both ends of the heat dissipation fi'ns.
pressing the portion corresponding to the bottom-expanded recesses of 20 the metal flat plate between fins and to press the protrusions provided on the back side of said flat plate to press into said bottom- expanded recesses and to press the holding protrusions provided on the edges of the base plate toward the side of the heat dissipation fins to fix said heat dissipation fins and the base plate securely.
25
3. A manufacturing process of a heat sink for electronic parts comprising:
a plurality of heat dissipation fins provided on a metal flat plate with a predetermined distance and a metal base plate provided with a plurality of bottom-expanded recesses on the flat surface with a predetermined distance are prepared, and pressing a portion corresponding to the bottom-expanded recesses of the 5 flat plate between the fains to press down protrusions provided on the back side of the flat surface plate to press into the bottom-expanded recesses to fix the heat dissipation fins and the base plate securely.
4. A manufacturing process of a heat sink for electronic parts comprising a plurality of heat dissipation fins provided on a metal flat plate with a 10 predetermined distance, a metal base plate provided with a plurality of bottom-expanded recesses provided on the metal flat surface with a predetermined distance, and the base plate provided with a holding protrusions to hold at both ends of the plate, 15 pressing the portions corresponding to the bottom-expanded recesses of the flat plate between fins and to press clown the protrusions provided on the back side of said flat plate into said bottom-expanded recesses and to press the holding protrusions provided on the base plate toward the side of the fins tofix the heat dissipation fans and the base plate securely.
20
5.A heat sink for electronic parts substantially as described with reference to and as illustrated by Figs.2 to 7 of the accompanying drawings.
6.A manufacturing process of a heat sink for electronic parts substantially as described with reference to Figs 2 to 7 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000311437A JP2002118211A (en) | 2000-10-12 | 2000-10-12 | Radiator of electronic component and manufacturing method of the radiator |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0107406D0 GB0107406D0 (en) | 2001-05-16 |
| GB2367946A true GB2367946A (en) | 2002-04-17 |
| GB2367946B GB2367946B (en) | 2004-12-01 |
Family
ID=18791199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0107406A Expired - Fee Related GB2367946B (en) | 2000-10-12 | 2001-03-23 | Heat sink for electronic parts and manufacture thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20020043359A1 (en) |
| JP (1) | JP2002118211A (en) |
| GB (1) | GB2367946B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102934535A (en) * | 2010-06-07 | 2013-02-13 | 三菱电机株式会社 | Heat sink, and method for producing same |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6202303B1 (en) * | 1999-04-08 | 2001-03-20 | Intel Corporation | Method for producing high efficiency heat sinks |
| TW535489B (en) * | 2002-05-31 | 2003-06-01 | Peng Jian | Composite working method of heat conduction device and the product thereof |
| US7497013B2 (en) * | 2005-04-15 | 2009-03-03 | R-Theta Thermal Solutions Inc. | Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates |
| FR2898668B1 (en) * | 2006-03-15 | 2008-06-27 | Ferraz Date Ind Soc Par Action | HEAT EXCHANGER FOR COOLING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
| JP2011054778A (en) * | 2009-09-02 | 2011-03-17 | Furukawa-Sky Aluminum Corp | Heat exchanger using comb-type radiation unit |
| US20110220338A1 (en) * | 2010-03-11 | 2011-09-15 | Kun-Jung Chang | Led heat sink and method of manufacturing same |
| US9591788B2 (en) * | 2011-04-13 | 2017-03-07 | Siemens Aktiengesellschaft | Coupling system between a waste-heat generator and a waste-heat receiver |
| CN102522381B (en) * | 2011-12-22 | 2015-09-30 | 东莞汉旭五金塑胶科技有限公司 | A kind of Radiator and its preparation method |
| JP5722394B2 (en) * | 2013-07-11 | 2015-05-20 | 株式会社タクボ精機製作所 | Heat exchanger |
| TW201606256A (en) * | 2014-08-12 | 2016-02-16 | Shuan Da Prec Industry Co Ltd | Heat sink tightening and fixating structure and its method |
| CN111829285B (en) * | 2020-06-01 | 2022-11-25 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with extend function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0800890A1 (en) * | 1996-04-08 | 1997-10-15 | Tousui Ltd | Heat sink |
| DE19845374A1 (en) * | 1998-10-02 | 2000-04-20 | Swg Metallverarbeitung Und Mon | Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles |
-
2000
- 2000-10-12 JP JP2000311437A patent/JP2002118211A/en active Pending
-
2001
- 2001-03-21 US US09/814,291 patent/US20020043359A1/en not_active Abandoned
- 2001-03-23 GB GB0107406A patent/GB2367946B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0800890A1 (en) * | 1996-04-08 | 1997-10-15 | Tousui Ltd | Heat sink |
| DE19845374A1 (en) * | 1998-10-02 | 2000-04-20 | Swg Metallverarbeitung Und Mon | Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102934535A (en) * | 2010-06-07 | 2013-02-13 | 三菱电机株式会社 | Heat sink, and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0107406D0 (en) | 2001-05-16 |
| GB2367946B (en) | 2004-12-01 |
| JP2002118211A (en) | 2002-04-19 |
| US20020043359A1 (en) | 2002-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20070323 |