JP3076748U - Electronic component radiator - Google Patents

Abstract

[PROBLEMS] To reduce the number of components of a radiator of an electronic component, simplify the structure, reduce the manufacturing cost, and configure the fins to be relatively strong. . A plurality of fins (11) are formed on a top surface of a metal flat plate (10) at predetermined intervals, and the flat plate (1) is formed.
A plurality of rows of through grooves 1 in a direction intersecting the fins 11
2, a metal base plate 16 formed on a flat surface 14 with a ridge 15 on which a through groove 12 formed in the flat plate 10 of the heat radiation fin 13 is fitted. The radiation fins 1 are provided on the ridges 15 of the plate 16.
The electronic device is characterized in that the through-grooves 12 formed in the flat plate 10 of the third embodiment are fitted, and a portion protruding from the through-grooves 12 is pressed and crushed by a press metal fitting to thereby fix and fix it. Parts radiator.

Description

[Detailed description of the invention]

[0001]

TECHNICAL FIELD OF THE INVENTION

 According to the present invention, a heat-dissipating electronic component such as a transistor, an IC, an LSI, a diode, a thyristor, and the like is mounted, and the heat generated by these electronic components is conducted and transmitted from a radiation fin. Related to the vessel.

[0002]

[Prior art]

 As a conventional radiator for electronic components, there has been one disclosed in, for example, Japanese Utility Model Publication No. 4-50989. This will be described with reference to the accompanying drawings. As shown in FIG. A groove 3 is formed on the upper end surface of the ridge 2 (see (a-2) and (b-2) in FIG. 3), and the radiating fin 4 (see FIG. 3 (a-1), (b-1)), the mounting groove 5 provided on the mounting plate 6 is fitted, and the mounting groove 6 is provided on the base plate 1 on the edge of the groove 5 of the mounting plate 6. The radiating fins 4 are fixed to the base plate 1 by the pressing ridges 8 formed by the pressure deformation of the ridges 2 and the mounting grooves 5 provided on the mounting plate 6 of the radiating fins 4. is there. (A-1) is a front view before fitting the groove 5 of the mounting plate 6 of the radiating fin 4 to the ridge 2 provided on the base plate 1, and FIG. FIG. 3 (b-1) is a front view in which the groove 5 of the mounting plate 6 of the radiation fin 4 is fitted to the ridge 2 provided on the base plate 1, and FIG. It is a vertical right side view.

[0003]

[Problems to be solved by the invention]

 In a conventional heat radiator for electronic components, the heat radiation fins 4 are formed by bending a metal band-like thin plate into a rectangular waveform, so that the thickness of the heat radiation fins 4 cannot be increased. . Therefore, when the radiation fin 4 hits another electronic component or box, there is a problem that the fin is immediately deformed. An object of the present invention is to provide a radiator for electronic components which eliminates such problems.

[0004]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention will be described with reference to FIGS. 1 and 2. A plurality of fins 11 are formed at a predetermined interval on an upper surface of a metal flat plate 10 and the flat plate 10 A radiating fin 13 formed with a plurality of rows of through-grooves 12 in a direction intersecting the fins 11, and a ridge on which a through-groove 12 formed in the flat plate 10 of the radiating fin 13 fits on a plane 14. The base plate 16 is formed of a metal base plate 16. The through-grooves 12 formed in the flat plate 10 of the radiating fins 13 are fitted into the ridges 15 of the base plate 16. A radiator for an electronic component, characterized in that the protruding portion is pressed and crushed by a press fitting 17 so that the ridge 15 and the through groove 12 are sandwiched and fixed. The radiating fins 13 formed as described above are formed by extruding an aluminum material, for example, so that the radiating fins 13 are more radiated than the radiating fins formed by bending an aluminum band-like thin plate into a rectangular waveform as in the related art. Since the fin material is thick, the heat dissipating fin 13 does not easily deform even if it hits another electronic component or box.

[0005]

[Embodiment of the invention]

 Hereinafter, embodiments of a radiator of an electronic component according to the present invention will be described in detail with reference to the drawings. 1 (a) is a perspective view of a radiation fin, FIG. 1 (b) is a perspective view of a base plate, and FIG. 1 (c) is a perspective view of a radiator of an electronic component completed by assembling and fixing the radiation fin to the base plate. It is.

Referring to FIG. 1, the radiator for an electronic component according to the present invention includes a plurality of fins 11 formed at predetermined intervals on an upper surface of a flat plate 10 made of metal such as aluminum. A radiation fin 13 having a plurality of rows of through grooves 12 formed in the face plate 10 in a direction intersecting with the fins 11 and a through groove 12 formed in the plane plate 10 of the radiation fin 13 are fitted on a plane 14. The base plate 16 is made of a metal such as aluminum and the like, and the through groove 12 formed in the flat plate 10 of the heat radiation fin 13 is fitted to the protrusion 15 of the base plate 16. The portion protruding from the through-groove 12 is pressed and crushed by a press fitting so as to be clamped and fixed, thereby providing a radiator for an electronic component.

FIG. 2 shows a process of manufacturing a radiator for an electronic component according to the present invention. FIG. 2 (a-1) shows a ridge 15 formed on the base plate 14 and a flat plate 10 of a radiating fin 13 thereon. In the front view before the formed penetration groove 12 is fitted, the same figure (a-2) is a right side view, and the figure (b-1) is a projection 15 formed on the base plate 16 and the radiation fin 13 FIG. 2A is a front view in which a through groove 12 formed in the flat plate 10 is fitted, and FIG.

The manufacturing process of the radiator of the electronic component according to the present invention will be described. First, as shown in FIGS. 2 (a-1) and 2 (a-2), the base plate 16 formed as described above is formed. The radiating fins 13 formed as described above were disposed on the top, and then formed on the flat plate 10 of the radiating fins 13 as shown in (b-1) and (b-2) of FIG. When the through groove 12 is fitted into the ridge 15 formed on the base plate 16 and the ridge 15 is pressed and crushed by the press fitting 17, the through groove 12 and the ridge 15 are not removed. Then, the radiating fins 13 are assembled and fixed to the base plate 16 to complete the radiator of the electronic component.

[0009]

[Effect of the invention]

 According to the present invention, as described above, a large number of fins are formed at predetermined intervals on the upper surface of a metal flat plate, and a plurality of rows of through grooves are formed in the flat plate in a direction intersecting the fins. And a metal base plate formed on a flat surface with a ridge on which a through groove formed in the flat plate of the radiating fin fits. The radiating fin is formed on the ridge of the base plate. The through-groove formed in the flat plate is fitted, and a portion protruding from the through-groove is pressed and crushed by a press fitting, whereby the ridge and the through-groove are pinched and fixed. As a heat sink for electronic components, the heat radiation fins are thicker than the conventional ones, which are formed by bending a metal band-like thin plate into a rectangular waveform. Features that do not deform A.

[Brief description of the drawings]

1 (a) is a perspective view of a radiation fin, FIG. 1 (b) is a perspective view of a base plate, and FIG. 1 (c) is a perspective view of a radiator of an electronic component completed by assembling and fixing the radiation fin to the base plate. It is a perspective view.

FIG. 2 is a view showing an assembling process of the radiator of the electronic component of the present invention.

FIG. 3 is a view showing a conventional radiator of an electronic component and an assembling process thereof.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 flat plate 11 fin 12 through groove 13 heat radiation fin 14 flat 15 ridge 16 base plate 17 press fitting

Claims (1)

[Utility model registration claims] 1. A plurality of fins (11) are formed at predetermined intervals on the upper surface of a metal flat plate (10), and a plurality of fins (11) are formed on the flat plate (10) in a direction intersecting the fins (11). Radiating fin (13) formed with through groove (12)
A ridge (1) on which a through groove (12) formed in the flat plate (10) of the radiation fin (13) fits on the flat surface (14).
5) formed of a metal base plate (16), a through groove (12) formed in a flat plate (10) of the heat radiation fin (13) in a ridge (15) of the base plate (16). )
And pressing a portion protruding from the through groove (12) with a press fitting (17) to crush it,
A radiator for an electronic component, wherein the ridge (15) and the through groove (12) are sandwiched and fixed.