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習知為解決相關電氣元件之散熱問題，一般皆於電氣 元件上裝設一散熱器，以及時有效地排出熱量，而確保電 氣兀件於適當溫度下正常運行。惟，散熱器散熱效果之良 窥’與其材料、結構、製造方法及製造技術等皆密切相 關。 以一般常見之散熱器而言，其鰭片高度h與鰭片間距d =比值/(h/d )越大，則散熱效果越佳。此類散熱器之製 造方法係先於一方向上擠製（extruding)，再沿垂直於 Ϊ f向之另一方向上剖溝（sawing )，以形成陣列方式凸 η 配t鰭片：,採用此類方式製造之散熱器，除了後段機 二口,程序！瑣外，更因模具、擠製技術及材料上之限 亚無法獲付令人滿意之縛片高度h與鰭片間距d之比 值，故散熱效果有限。It is known that in order to solve the heat dissipation problem of related electrical components, a heat sink is generally installed on the electrical components, and the heat is effectively discharged in a timely manner, so as to ensure that the electrical components operate normally at an appropriate temperature. However, a good glimpse of the heat dissipation effect of a radiator is closely related to its material, structure, manufacturing method, and manufacturing technology. For a common radiator, the larger the fin height h and the fin distance d = ratio / (h / d), the better the heat dissipation effect. The manufacturing method of this type of radiator is to extrude in one direction first, and then cut a groove in the other direction perpendicular to the direction of 向 f to form an array of convex η and t fins: In addition to the second stage of the radiator, the program is made! In addition, due to the limitation of the mold, extrusion technology and materials, Asia cannot obtain a satisfactory ratio of the height h of the fins to the distance d between the fins, so the heat dissipation effect is limited.
4681 03 五、發明說明（2) 為解決上述散熱器之問題，乃有如第一圖所示之分離 式散熱器因應產生，該散熱器10係由一鋁材基體20及複數 片插設於基體20上之鰭片30所組成。該基體20為平板狀且 具有特定厚度，其上並開設有複數個以陣列方式排配之收 容孔201。該鰭片30略呈柵狀，其下方一體延伸出複數個 導熱部301，用以插置於基體20上之收容孔201中，而將鰭 片30裝設於基體20上。當該鰭片30插設於基體20上後，利 用適當治具沖擊鰭片30連接部302之上表面303，即可使連 接部302之下表面與基體20之頂面緊密貼合，而減少鰭片 30與基體2 0間之空隙產生，增進散熱器10之整體散-熱效 果0 由於該散熱器1 0之基體20與鰭片30皆由沖壓製成，故 相關製造加工程序較習用擠製加上剖溝者為易，且在鰭片 高度與鰭>1間距之比值上，亦優於習用者。然而，由於散 熱效果上之考量，該基體2 〇必須具有相當之厚度，因此在 沖麗基體20以形成相關收容孔2〇1時，該收容孔201之大 小’以及收容孔2 01間之距離等，均須適當地加大，以避 免基體2 0產生扭曲變形情況。此等散熱效果及沖壓製程上 之限制，顯不利於該與收容孔2〇 1配合之鰭片30的厚度， 以及鰭片高度與鰭片間距之比值等設計，進而影響散熱器 10之整體散熱效果。再者，該散熱器10之鰭片30與基體20 間雖進一步利用適當治具沖擊，以減少兩者間之空隙產 生’但實際效果仍不盡理想。 另外，亦有如第二圖所示之另類散熱器設計。該散熱4681 03 V. Description of the invention (2) In order to solve the problem of the above-mentioned heat sink, a separate heat sink as shown in the first figure is generated. The heat sink 10 is an aluminum base 20 and a plurality of pieces are inserted in the base. 20 is composed of fins 30. The base body 20 is flat and has a specific thickness, and a plurality of receiving holes 201 arranged in an array are formed on the base body 20. The fins 30 are slightly grid-shaped, and a plurality of heat-conducting portions 301 are integrally extended below the fins 30 to be inserted into the receiving holes 201 on the base 20, and the fins 30 are mounted on the base 20. After the fin 30 is inserted on the base body 20, the upper surface 303 of the connecting portion 302 of the fin 30 is impacted with a suitable jig, so that the lower surface of the connecting portion 302 can be closely attached to the top surface of the base body 20, thereby reducing The gap between the fins 30 and the base body 20 is generated, which improves the overall heat-dissipation effect of the heat sink 10. Since the base body 20 and the fins 30 of the heat sink 10 are made of stamping, the related manufacturing process is more common than conventional ones. It is easy to add the system and cut the groove, and it is also better than the user in the ratio of the fin height to the fin > 1 pitch. However, due to the consideration of the heat dissipation effect, the base body 20 must have a considerable thickness. Therefore, when the base body 20 is punched to form the related receiving hole 201, the size of the receiving hole 201 ′ and the distance between the receiving holes 201 And so on, must be appropriately enlarged to avoid distortion of the base body 20. These heat dissipation effects and limitations on the stamping process are not conducive to the design of the thickness of the fins 30 and the ratio of the height of the fins to the spacing of the fins, which will affect the overall heat dissipation of the heat sink 10 effect. Furthermore, although the impact between the fins 30 and the base 20 of the heat sink 10 is further improved by using an appropriate jig to reduce the generation of the gap therebetween, the actual effect is still not satisfactory. In addition, there are alternative heat sink designs as shown in the second figure. The cooling
1Λ二維條碼\八1121HW_LEE. ptd 第5頁 46 8103 五、發明說明（3) 器110之，鰭片130下方—體延伸出複數個導熱部1301，且該 導熱部1 3 0 1係與柵狀散熱部丨3 〇 3交錯設置。利用適當治具 沖擊鰭片130連接部13〇2之上表面1 304，即可使連接部 1 3 0 2之下表面與基體120之頂面，以及導熱部1301與基體 1 2 0之收容孔1 2 0 1間皆緊密貼合，而減少鰭片1 3 〇與基體 1 20間之空隙產生’增進散熱器丨丨〇之整體散熱效果。然 而’此類散熱器仍存在著相同缺陷，實際散熱效果仍不符 使用需求。 【發明目的】 - 本發明之目的在於提供一種散熱效果良好且製造簡易 之散熱器及其製造方法。 .1Λ two-dimensional bar code \ eight 1121HW_LEE. Ptd page 5 46 8103 V. Description of the invention (3) Among the device 110, a plurality of heat conducting portions 1301 extend below the body of the fin 130, and the heat conducting portion 1 3 0 1 is connected to the grid The heat dissipating parts 丨 3 〇3 are staggered. By using an appropriate jig to impact the upper surface 1 304 of the connecting portion 130 of the fin 130, the lower surface of the connecting portion 1302 and the top surface of the base 120, and the receiving holes of the heat conducting portion 1301 and the base 120 1 2 0 1 are closely attached, and the gap between the fins 1 3 0 and the base body 12 is reduced, thereby increasing the overall heat dissipation effect of the heat sink. However, the same kind of heat sink still has the same defects, and the actual heat dissipation effect still does not meet the demand for use. [Objective of the Invention]-The object of the present invention is to provide a heat sink with good heat dissipation effect and easy manufacturing, and a manufacturing method thereof. .
[發明特徵】 本發明係關於一種散熱器及其製造方法，其中該散熱 器包括一第一基體、一第二基體及複數鰭片。第一基體上 開設有複數個自頂面貫穿至底面且以陣列方式排配之第一 收容孔’第二基體係疊合於第一基體之底面，且其於對應 第一基體第一收容孔之位置，相應開設有複數個自頂面貫 穿至底面之第二收容孔。該第一基體與第二基體之尺寸規 格相同，故可採用相同之材料與模具沖壓製成。該轉片略 呈拇狀’其上方為複數個散熱部，而下方則一體延伸出複 數個與散熱部對應設置之導熱部，用於插置於第—基體之 第一收容孔與第一基體之第一收容孔中，該散熱部與導熱 部間係以一連接部加以連結。該導熱部之長度大於第一某 體與第二基體疊合後之整體厚度，故其末端係突伸出第二[Inventive Features] The present invention relates to a heat sink and a manufacturing method thereof, wherein the heat sink includes a first base body, a second base body, and a plurality of fins. The first base body is provided with a plurality of first receiving holes that pass from the top surface to the bottom surface and are arranged in an array. The second base system is superposed on the bottom surface of the first base body and corresponds to the first receiving hole of the first base body. At this position, a plurality of second receiving holes are formed correspondingly from the top surface to the bottom surface. The first base body and the second base body have the same size and specifications, so they can be made by stamping with the same material and die. The turning piece is slightly thumb-shaped. The upper part is a plurality of heat dissipation parts, and the lower part integrally extends a plurality of heat conducting parts corresponding to the heat dissipation parts for inserting into the first receiving hole and the first base body of the first base body. In the first receiving hole, the heat dissipating portion and the heat conducting portion are connected by a connecting portion. The length of the heat-conducting part is larger than the overall thickness of the first body and the second base body after being superimposed, so its end protrudes from the second part.
1:\二維條碼\六1121而_1££.卩1(1 第6頁 4 6 81 0 3 五、發明說明（4) 基體之底面外。 【圖式簡單說明】 第一圖係習知散熱器之立體分解視圖。 第二圖係另一習知散熱器之立體分解視圖。 第三圖係本發明散熱器之立體分解視圖。 第四圖係沿第三圖中IV — IV線所做之剖視圖，其上方 並另外顯示一治具。 【主要元件符號說明】 散熱器 .210 第一基體 220 第二基體 221 第一收容孔 2 2 0 1 第二收容孔 2211 .鰭片 230 導熱部 2 3 0 1 連接部 230 2 散熱部 2 30 3 上表面 23 04 治具 40 沖頭 401 【較佳實施例說明】 請參閱第三圖，係本發明散熱器之立體分解視圖，該 散熱器210包括第一基體220、第二基體221及複數鰭片 2 3 0。第一基體2 2 0上開設有複數個自頂面貫穿至底面且以 陣列方式排配之第一收容孔2 2 0 1，第二基體221係疊合於 第一基體220之底面，且其於對應第一基體2 2 0第一收容孔 2 2 0 1之位置，相應開設有複數個自頂面貫穿至底面之第二 收容孔2211。該第一基體220與第二基體221之尺寸規格相 同，故可採用相同之材料與模具沖壓製成，且兩者疊合後 之整體厚度即等於前述習知散熱器基體之厚度，亦即，該1: \ Two-dimensional bar code \ Six 1121 and _1 ££. 卩 1 (1 Page 6 4 6 81 0 3 V. Description of the invention (4) Outside of the bottom surface of the substrate. [Simplified description of the drawing] The first picture is a study A three-dimensional exploded view of a known radiator. A second image is an exploded view of another conventional radiator. A third image is an exploded view of the radiator of the present invention. The fourth image is taken along line IV-IV of the third image. A cross-sectional view is made, and a jig is displayed above it. [Description of main component symbols] Radiator. 210 First base body 220 Second base body 221 First receiving hole 2 2 0 1 Second receiving hole 2211. Fin 230 heat conducting portion 2 3 0 1 connecting part 230 2 heat dissipating part 2 30 3 upper surface 23 04 jig 40 punch 401 [preferred embodiment description] Please refer to the third figure, which is a three-dimensional exploded view of the radiator of the present invention, the radiator 210 The first base body 220, the second base body 221, and a plurality of fins 2 3 0. The first base body 2 2 0 is provided with a plurality of first receiving holes 2 2 0 1 which are arranged in an array from the top surface to the bottom surface. The second substrate 221 is superimposed on the bottom surface of the first substrate 220 and corresponds to the first substrate 2 2 0 A position of a receiving hole 2 201 is correspondingly provided with a plurality of second receiving holes 2211 penetrating from the top surface to the bottom surface. The dimensions and specifications of the first base 220 and the second base 221 are the same, so the same materials and The die is stamped, and the overall thickness of the two is equal to the thickness of the conventional radiator base, that is, the
I :\二維條碼\六1121挪_1^. ptd 第7頁 46Bt 03 五、發明說明（5) 第二基體220或第二基體221之厚度恰為習知散熱器基體之 一半，故在沖壓時可得到較小孔徑及孔間距之第一收容孔 2201與第二收容孔2211。而相應地，該插設於第一收容孔 2201及第二收容孔2211内之鰭片230即可薄形化、高密度 化，進而昇鰭片向度與鰭#間距之比值，增進整體散熱 效杲β 请一併參閱第四圖，其係沿第三圖中jy線所做之 剖視圖。§亥鰭片2 3 0略呈柵狀，其上方為複數個散熱部 2 3 0 3 ’而下方則.一體延伸出複數個與散熱部2 3 〇 3對應設置 之導熱部2301 ’用於插置於第一基體220之第一收容孔 2201與第二基體221之第二收容孔2211中，該散熱部2303 與導熱部2 3 0 1間係以一連接部2 3 〇 2加以連結。該導熱部 2301之長度大於第一基體220與第二基體221疊合後之整體 厚度，故其末端係突伸出第二基體221之底面外。 組裝時’先疊合該第一基體220與第二基體221，並使 第一基體220之第一收容孔2201對正第二基體221之第二收 容孔2211。然後’將該鰭片230之導熱部2301插入第一收 容孔2201與第二收容孔2211内，並使鰭月230連接部2302 之下表面緊貼第一基體220之頂面，此時該鰭片230之導熱 部2301末端係突伸出第二基體221之底面外。之後，將該 鰭片230與第一基體220及第二基體221之整體組合置於一 適當形狀之平台（圖未示）上，利用治具4 0之沖頭4 0 1沖擊 鰭片230連接部2302之上表面2304，即可使鰭片230連接部 23 0 2之下表面與第一基體220之頂面緊密貼合，而減少鰭I: \ Two-dimensional barcode \ 六 1121mobile_1 ^. Ptd Page 7 46Bt 03 V. Description of the invention (5) The thickness of the second base body 220 or the second base body 221 is just half of the thickness of the conventional heat sink base. The first accommodating hole 2201 and the second accommodating hole 2211 with smaller apertures and hole spacings can be obtained during punching. Correspondingly, the fins 230 inserted in the first accommodating holes 2201 and the second accommodating holes 2211 can be thinned and high-density, thereby increasing the ratio of the fin orientation to the fin # pitch and improving overall heat dissipation. Effect 杲 β Please refer to the fourth figure together, which is a sectional view taken along line jy in the third figure. § The fin 2 30 is slightly grid-shaped, with a plurality of heat sinks 2 3 0 3 ′ above and a bottom. A plurality of heat conduction parts 2301 ′ corresponding to the heat sink 2 3 03 are integrally extended for insertion The first heat-receiving portion 2303 and the heat-conducting portion 2 301 are connected in the first accommodating hole 2201 of the first base body 220 and the second accommodating hole 2211 of the second base body 221 by a connecting portion 2 3 02. The length of the heat-conducting portion 2301 is greater than the overall thickness of the first base body 220 and the second base body 221 after being superimposed, so that the ends thereof protrude beyond the bottom surface of the second base body 221. When assembling, first the first base body 220 and the second base body 221 are stacked, and the first receiving hole 2201 of the first base body 220 is aligned with the second receiving hole 2211 of the second base body 221. Then, 'the heat conducting portion 2301 of the fin 230 is inserted into the first receiving hole 2201 and the second receiving hole 2211, and the lower surface of the fin moon 230 connecting portion 2302 is closely contacted with the top surface of the first base 220. At this time, the fin The end of the heat conducting portion 2301 of the sheet 230 protrudes beyond the bottom surface of the second base body 221. After that, the overall combination of the fin 230 with the first base 220 and the second base 221 is placed on a platform (not shown) with an appropriate shape, and the fins 230 are impacted by a 40 1 punch 40. The upper surface 2304 of the portion 2302 can make the lower surface of the connecting portion 230 of the fin 230 closely adhere to the top surface of the first base 220, thereby reducing the fins.
1:\二維條碼\41121服_1^£.?七(1 第8頁 4681 03 五、發明說明（6) 片230與第一基體220間之空隙產生。再者，由於該鰭片 230之導熱部2301末端係突伸出第二基體221之底面外，在 與該平台之共同作用下，位於鰭片23〇導熱部23〇1末端之 材料，將被緊壓進入第一基體22〇之第一收容孔2201與第 二基體221之第二收容孔2211内，而可避免鰭片230之導熱 部2 3 0 1與第一收容孔220 1及第二收容孔2211間產生空隙。 最後’對第二基體221之底面進行磨平及拋光製程，以增 加第二基體221底面之平面度。 可以理解地該位於第二基體上之第二收容孔結構， 亦可為未貫穿板材厚度而僅為凹洞之埜態，以直接.干涉收 容鰭片230導熱部230 1之末端於其中。另外，本創作雖僅 疊合一第一基體220與一第二基體221，然而實際運用上， 亦可在相盱之整體厚度下，曼_舍更多數量而厚度更薄之第 ；;>基體與第二基體，以於沖壓時得到更+孔距及孔間距之 第一收容孔與第二收容孔，而使相應插設之韓片更薄形 4、更高密度化。 综上所述，本發明符合專利要件。惟，以上所揭露者 僅為本發明之較佳實施例，大凡依據本發明精神所均 等變化或修飾，仍屬本發明所包含之範園。 1:\二雄條碼 第9頁1: \ Two-dimensional barcode \ 41121 服 _1 ^ £.? Seven (1 Page 8 4681 03 V. Description of the invention (6) The gap between the sheet 230 and the first base 220 is generated. Moreover, because of the fin 230 The end of the heat-conducting portion 2301 protrudes beyond the bottom surface of the second base body 221. Under the action of the platform, the material located at the end of the heat-conducting portion 2301 of the fin 23 will be pressed into the first base body 22 The first receiving hole 2201 and the second receiving hole 2211 of the second base body 221 can avoid a gap between the heat conducting portion 2 3 0 1 of the fin 230 and the first receiving hole 220 1 and the second receiving hole 2211. Finally 'The bottom surface of the second substrate 221 is ground and polished to increase the flatness of the bottom surface of the second substrate 221. It can be understood that the second receiving hole structure located on the second substrate may also be a structure that does not penetrate through the thickness of the plate. It is only the wild state of the cavity, so that the end of the heat-conducting part 230 1 of the receiving fin 230 is directly interfered therein. In addition, although this creation only overlaps a first substrate 220 and a second substrate 221, in practice, It is also possible to increase the number of thinner and thinner ones under the overall thickness of each other; > The body and the second base body are used to obtain the first receiving hole and the second receiving hole with a more + hole pitch and hole pitch when punching, so that the correspondingly inserted Korean film is thinner and higher in density. As mentioned, the present invention complies with the patent requirements. However, the above disclosure is only a preferred embodiment of the present invention, and any changes or modifications that are equivalent in accordance with the spirit of the present invention still belong to the fan garden included in the present invention. 1: \ 二 雄Barcode 第 9 页