DE60034663D1 - Programmierbare mikroelektronische struktur sowie verfahren zu ihrer herstellung und programmierung - Google Patents
Programmierbare mikroelektronische struktur sowie verfahren zu ihrer herstellung und programmierungInfo
- Publication number
- DE60034663D1 DE60034663D1 DE60034663T DE60034663T DE60034663D1 DE 60034663 D1 DE60034663 D1 DE 60034663D1 DE 60034663 T DE60034663 T DE 60034663T DE 60034663 T DE60034663 T DE 60034663T DE 60034663 D1 DE60034663 D1 DE 60034663D1
- Authority
- DE
- Germany
- Prior art keywords
- programming
- production
- microelectronic structure
- programmable
- programmable microelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of the switching material, e.g. post-treatment, doping
- H10N70/046—Modification of the switching material, e.g. post-treatment, doping by diffusion, e.g. photo-dissolution
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Patterning of the switching material
- H10N70/066—Patterning of the switching material by filling of openings, e.g. damascene method
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8822—Sulfides, e.g. CuS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/15—Current-voltage curve
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11975799P | 1999-02-11 | 1999-02-11 | |
PCT/US2000/003571 WO2000048196A1 (en) | 1999-02-11 | 2000-02-11 | Programmable microelectronic devices and methods of forming and programming same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60034663D1 true DE60034663D1 (de) | 2007-06-14 |
Family
ID=22386195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60034663T Expired - Lifetime DE60034663D1 (de) | 1999-02-11 | 2000-02-11 | Programmierbare mikroelektronische struktur sowie verfahren zu ihrer herstellung und programmierung |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1159743B1 (de) |
JP (1) | JP2002536840A (de) |
KR (1) | KR20010110433A (de) |
CN (1) | CN1175423C (de) |
AT (1) | ATE361530T1 (de) |
AU (1) | AU763809B2 (de) |
CA (1) | CA2362283A1 (de) |
DE (1) | DE60034663D1 (de) |
HK (1) | HK1039395B (de) |
WO (1) | WO2000048196A1 (de) |
Families Citing this family (124)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP4119950B2 (ja) * | 2000-09-01 | 2008-07-16 | 独立行政法人科学技術振興機構 | コンダクタンスの制御が可能な電子素子 |
EP1344223A4 (de) * | 2000-10-31 | 2005-05-25 | Univ California | Organisches bistabildes bauelement und organische speicherzellen |
WO2002037572A1 (fr) * | 2000-11-01 | 2002-05-10 | Japan Science And Technology Corporation | Reseau a pointes, circuit non, et circuit electronique contenant ceux-ci |
US6653193B2 (en) | 2000-12-08 | 2003-11-25 | Micron Technology, Inc. | Resistance variable device |
US6638820B2 (en) | 2001-02-08 | 2003-10-28 | Micron Technology, Inc. | Method of forming chalcogenide comprising devices, method of precluding diffusion of a metal into adjacent chalcogenide material, and chalcogenide comprising devices |
US6727192B2 (en) * | 2001-03-01 | 2004-04-27 | Micron Technology, Inc. | Methods of metal doping a chalcogenide material |
US6818481B2 (en) | 2001-03-07 | 2004-11-16 | Micron Technology, Inc. | Method to manufacture a buried electrode PCRAM cell |
US6734455B2 (en) | 2001-03-15 | 2004-05-11 | Micron Technology, Inc. | Agglomeration elimination for metal sputter deposition of chalcogenides |
WO2002082452A2 (en) * | 2001-04-06 | 2002-10-17 | Axon Technologies Corporation | Microelectronic device, structure, and system, including a memory structure having a variable programmable property and method of forming the same |
US6873540B2 (en) * | 2001-05-07 | 2005-03-29 | Advanced Micro Devices, Inc. | Molecular memory cell |
CN1276518C (zh) | 2001-05-07 | 2006-09-20 | 先进微装置公司 | 使用复合分子材料的浮置栅极存储装置 |
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US6768157B2 (en) | 2001-08-13 | 2004-07-27 | Advanced Micro Devices, Inc. | Memory device |
DE60130586T2 (de) | 2001-08-13 | 2008-06-19 | Advanced Micro Devices, Inc., Sunnyvale | Speicherzelle |
US6838720B2 (en) | 2001-08-13 | 2005-01-04 | Advanced Micro Devices, Inc. | Memory device with active passive layers |
US6806526B2 (en) | 2001-08-13 | 2004-10-19 | Advanced Micro Devices, Inc. | Memory device |
US6737312B2 (en) | 2001-08-27 | 2004-05-18 | Micron Technology, Inc. | Method of fabricating dual PCRAM cells sharing a common electrode |
US6784018B2 (en) | 2001-08-29 | 2004-08-31 | Micron Technology, Inc. | Method of forming chalcogenide comprising devices and method of forming a programmable memory cell of memory circuitry |
US6709958B2 (en) * | 2001-08-30 | 2004-03-23 | Micron Technology, Inc. | Integrated circuit device and fabrication using metal-doped chalcogenide materials |
US6646902B2 (en) | 2001-08-30 | 2003-11-11 | Micron Technology, Inc. | Method of retaining memory state in a programmable conductor RAM |
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WO2003032392A2 (en) * | 2001-10-09 | 2003-04-17 | Axon Technologies Corporation | Programmable microelectronic device, structure, and system, and method of forming the same |
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US6791859B2 (en) | 2001-11-20 | 2004-09-14 | Micron Technology, Inc. | Complementary bit PCRAM sense amplifier and method of operation |
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US20030143782A1 (en) | 2002-01-31 | 2003-07-31 | Gilton Terry L. | Methods of forming germanium selenide comprising devices and methods of forming silver selenide comprising structures |
US6809362B2 (en) * | 2002-02-20 | 2004-10-26 | Micron Technology, Inc. | Multiple data state memory cell |
US7151273B2 (en) | 2002-02-20 | 2006-12-19 | Micron Technology, Inc. | Silver-selenide/chalcogenide glass stack for resistance variable memory |
US6849868B2 (en) * | 2002-03-14 | 2005-02-01 | Micron Technology, Inc. | Methods and apparatus for resistance variable material cells |
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US6751114B2 (en) | 2002-03-28 | 2004-06-15 | Micron Technology, Inc. | Method for programming a memory cell |
JP4332881B2 (ja) | 2002-04-30 | 2009-09-16 | 独立行政法人科学技術振興機構 | 固体電解質スイッチング素子及びそれを用いたfpga、メモリ素子、並びに固体電解質スイッチング素子の製造方法 |
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US6831019B1 (en) | 2002-08-29 | 2004-12-14 | Micron Technology, Inc. | Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes |
US7364644B2 (en) | 2002-08-29 | 2008-04-29 | Micron Technology, Inc. | Silver selenide film stoichiometry and morphology control in sputter deposition |
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US6813178B2 (en) | 2003-03-12 | 2004-11-02 | Micron Technology, Inc. | Chalcogenide glass constant current device, and its method of fabrication and operation |
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JP5724651B2 (ja) | 2011-06-10 | 2015-05-27 | ソニー株式会社 | 記憶素子および記憶装置 |
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JP2014038675A (ja) | 2012-08-15 | 2014-02-27 | Sony Corp | 記憶装置および駆動方法 |
EP2973234B1 (de) | 2013-03-12 | 2018-10-24 | Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University | Dendritische strukturen und etiketten |
WO2014208050A1 (ja) | 2013-06-27 | 2014-12-31 | 日本電気株式会社 | スイッチング素子とその製造方法および半導体装置とその製造方法 |
WO2016073910A1 (en) | 2014-11-07 | 2016-05-12 | Arizona Board Of Regents On Behalf Of Arizona State University | Information coding in dendritic structures and tags |
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JP6860871B2 (ja) | 2015-12-07 | 2021-04-21 | ナノブリッジ・セミコンダクター株式会社 | 抵抗変化素子、半導体装置、及び半導体装置の製造方法 |
US10797105B2 (en) | 2016-07-01 | 2020-10-06 | Nec Corporation | Semiconductor device and method for producing semiconductor device |
JP7061797B2 (ja) | 2016-08-04 | 2022-05-02 | ナノブリッジ・セミコンダクター株式会社 | 整流素子及び該整流素子を有するスイッチング素子 |
US11127694B2 (en) | 2017-03-23 | 2021-09-21 | Arizona Board Of Regents On Behalf Of Arizona State University | Physical unclonable functions with copper-silicon oxide programmable metallization cells |
WO2018190241A1 (ja) | 2017-04-11 | 2018-10-18 | 日本電気株式会社 | スイッチ回路とこれを用いた半導体装置およびスイッチ方法 |
US10466969B2 (en) | 2017-05-08 | 2019-11-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Tunable true random number generator using programmable metallization cell(s) |
EP3639188A4 (de) | 2017-06-16 | 2021-03-17 | Arizona Board of Regents on behalf of Arizona State University | Polarisiertes scannen von dendritischen identifikatoren |
US11598015B2 (en) | 2018-04-26 | 2023-03-07 | Arizona Board Of Regents On Behalf Of Arizona State University | Fabrication of dendritic structures and tags |
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IL61678A (en) * | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Programmable cell and programmable electronic arrays comprising such cells |
JPH0770731B2 (ja) * | 1990-11-22 | 1995-07-31 | 松下電器産業株式会社 | 電気可塑性素子 |
US5177567A (en) * | 1991-07-19 | 1993-01-05 | Energy Conversion Devices, Inc. | Thin-film structure for chalcogenide electrical switching devices and process therefor |
BE1007902A3 (nl) * | 1993-12-23 | 1995-11-14 | Philips Electronics Nv | Schakelelement met geheugen voorzien van schottky tunnelbarriere. |
US5837564A (en) * | 1995-11-01 | 1998-11-17 | Micron Technology, Inc. | Method for optimal crystallization to obtain high electrical performance from chalcogenides |
US5761115A (en) * | 1996-05-30 | 1998-06-02 | Axon Technologies Corporation | Programmable metallization cell structure and method of making same |
WO1999028914A2 (en) * | 1997-12-04 | 1999-06-10 | Axon Technologies Corporation | Programmable sub-surface aggregating metallization structure and method of making same |
-
2000
- 2000-02-11 WO PCT/US2000/003571 patent/WO2000048196A1/en active IP Right Grant
- 2000-02-11 JP JP2000599033A patent/JP2002536840A/ja active Pending
- 2000-02-11 EP EP00911772A patent/EP1159743B1/de not_active Expired - Lifetime
- 2000-02-11 KR KR1020017010174A patent/KR20010110433A/ko not_active Application Discontinuation
- 2000-02-11 AU AU33613/00A patent/AU763809B2/en not_active Ceased
- 2000-02-11 CA CA002362283A patent/CA2362283A1/en not_active Abandoned
- 2000-02-11 AT AT00911772T patent/ATE361530T1/de not_active IP Right Cessation
- 2000-02-11 DE DE60034663T patent/DE60034663D1/de not_active Expired - Lifetime
- 2000-02-11 CN CNB008037167A patent/CN1175423C/zh not_active Expired - Lifetime
-
2002
- 2002-02-04 HK HK02100841.9A patent/HK1039395B/zh not_active IP Right Cessation
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CN1340197A (zh) | 2002-03-13 |
EP1159743A4 (de) | 2004-04-21 |
CA2362283A1 (en) | 2000-08-17 |
JP2002536840A (ja) | 2002-10-29 |
EP1159743B1 (de) | 2007-05-02 |
ATE361530T1 (de) | 2007-05-15 |
EP1159743A1 (de) | 2001-12-05 |
WO2000048196A9 (en) | 2001-11-01 |
HK1039395B (zh) | 2007-12-14 |
KR20010110433A (ko) | 2001-12-13 |
AU3361300A (en) | 2000-08-29 |
WO2000048196A1 (en) | 2000-08-17 |
HK1039395A1 (en) | 2002-04-19 |
CN1175423C (zh) | 2004-11-10 |
AU763809B2 (en) | 2003-07-31 |
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