DE3818894A1 - Lottraeger, verfahren zu dessen herstellung und verfahren zur montage von halbleiteranordnungen unter dessen verwendung - Google Patents

Lottraeger, verfahren zu dessen herstellung und verfahren zur montage von halbleiteranordnungen unter dessen verwendung

Info

Publication number
DE3818894A1
DE3818894A1 DE3818894A DE3818894A DE3818894A1 DE 3818894 A1 DE3818894 A1 DE 3818894A1 DE 3818894 A DE3818894 A DE 3818894A DE 3818894 A DE3818894 A DE 3818894A DE 3818894 A1 DE3818894 A1 DE 3818894A1
Authority
DE
Germany
Prior art keywords
solder
carrier
holes
hole
carrier web
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3818894A
Other languages
German (de)
English (en)
Other versions
DE3818894C2 (https=
Inventor
Tadao Kushima
Tasao Soga
Kazuji Yamada
Mitugu Shirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3818894A1 publication Critical patent/DE3818894A1/de
Application granted granted Critical
Publication of DE3818894C2 publication Critical patent/DE3818894C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE3818894A 1987-06-05 1988-06-03 Lottraeger, verfahren zu dessen herstellung und verfahren zur montage von halbleiteranordnungen unter dessen verwendung Granted DE3818894A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62139791A JPS63304636A (ja) 1987-06-05 1987-06-05 はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法

Publications (2)

Publication Number Publication Date
DE3818894A1 true DE3818894A1 (de) 1988-12-22
DE3818894C2 DE3818894C2 (https=) 1991-01-31

Family

ID=15253510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3818894A Granted DE3818894A1 (de) 1987-06-05 1988-06-03 Lottraeger, verfahren zu dessen herstellung und verfahren zur montage von halbleiteranordnungen unter dessen verwendung

Country Status (3)

Country Link
US (1) US4906823A (https=)
JP (1) JPS63304636A (https=)
DE (1) DE3818894A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565908A3 (https=) * 1992-04-16 1994-02-16 Ibm
EP0670594A1 (en) * 1994-03-02 1995-09-06 Kabushiki Kaisha Toshiba Semiconductor package and fabrication method thereof
US6953145B2 (en) 2000-08-05 2005-10-11 Robert Bosch Gmbh Soldering method for mounting electric components

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US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
JP2629435B2 (ja) * 1990-10-17 1997-07-09 日本電気株式会社 アレイ状光素子用サブ基板の作製方法
GB9414145D0 (en) * 1994-07-13 1994-08-31 Electrotech Ltd Forming a layer
US5211328A (en) * 1992-05-22 1993-05-18 International Business Machines Method of applying solder
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
US5307983A (en) * 1993-04-27 1994-05-03 At&T Bell Laboratories Method of making an article comprising solder bump bonding
DE4322391A1 (de) * 1993-06-30 1995-01-12 Volker Hoehns Bondeinrichtung
JPH07122594A (ja) * 1993-10-28 1995-05-12 Hitachi Ltd 導電性バンプの形成方法
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
WO1996008037A1 (en) * 1994-09-06 1996-03-14 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
US5547902A (en) * 1995-01-18 1996-08-20 Advanced Micro Devices, Inc. Post hot working process for semiconductors
DE19507207A1 (de) * 1995-03-02 1996-09-05 Sel Alcatel Ag Verfahren zur Herstellung von Kontaktwarzen aus Lötmetall auf metallischen Kontaktflächen
US6099935A (en) * 1995-12-15 2000-08-08 International Business Machines Corporation Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
JP3346695B2 (ja) * 1996-02-23 2002-11-18 京セラ株式会社 半導体素子収納用パッケージの製造方法
DE19634646A1 (de) * 1996-08-27 1998-03-05 Pac Tech Gmbh Verfahren zur selektiven Belotung
US6063701A (en) * 1996-09-14 2000-05-16 Ricoh Company, Ltd. Conductive particle transferring method
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US7819301B2 (en) * 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7007833B2 (en) 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
JP3410639B2 (ja) 1997-07-23 2003-05-26 株式会社日立製作所 ペースト充填方法及びはんだ付け方法及びペースト印刷機
US6621037B2 (en) * 1997-10-16 2003-09-16 Magna International Inc. Welding material with conductive sheet and method
US6689982B2 (en) 1997-10-16 2004-02-10 Magna International, Inc. Apparatus and method for welding aluminum tubes
US6713707B2 (en) 1997-10-16 2004-03-30 Magna International, Inc. Welding material and method without carrier
US6105852A (en) * 1998-02-05 2000-08-22 International Business Machines Corporation Etched glass solder bump transfer for flip chip integrated circuit devices
WO2001028726A1 (en) * 1998-04-20 2001-04-26 Senju Metal Industry Co., Ltd. Solder coating material and production method therefor
US6056191A (en) 1998-04-30 2000-05-02 International Business Machines Corporation Method and apparatus for forming solder bumps
SG74729A1 (en) * 1998-05-29 2000-08-22 Hitachi Ltd Method of forming bumps
US6869008B2 (en) 1998-05-29 2005-03-22 Hitachi, Ltd. Method of forming bumps
US6402014B1 (en) 1998-05-29 2002-06-11 Hitachi, Ltd. Method of forming bumps
US6295730B1 (en) * 1999-09-02 2001-10-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
US7156361B1 (en) * 1999-09-02 2007-01-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
JP2002111201A (ja) * 2000-10-03 2002-04-12 Ibiden Co Ltd プリント基板の製造方法
US20020146896A1 (en) * 2001-04-06 2002-10-10 Yoo Woo Sik Metallizaton methods using foils
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
JP6225193B2 (ja) * 2013-10-08 2017-11-01 リンテック株式会社 電子部品実装体の製造方法
US9263329B2 (en) * 2014-03-19 2016-02-16 Intel Corporation Methods of connecting a first electronic package to a second electronic package
CN112333929B (zh) * 2020-11-02 2021-11-09 丽水阡陌汽车电子有限公司 一种大规模集成电路芯片生产加工处理设备
CN112743278B (zh) * 2020-12-24 2022-07-12 上海洪铺钢结构工程有限公司 一种钢箱梁焊接用翻转胎架

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US3621564A (en) * 1968-05-10 1971-11-23 Nippon Electric Co Process for manufacturing face-down-bonded semiconductor device
JPS5835935A (ja) * 1981-08-28 1983-03-02 Fujitsu Ltd 半導体装置及びその製造方法
JPS60117643A (ja) * 1983-11-29 1985-06-25 Nec Kansai Ltd 双方向性ツエナ−ダイオ−ド
JPS60234396A (ja) * 1984-05-08 1985-11-21 富士通株式会社 ハンダパツドの形成方法
JPS61244035A (ja) * 1985-04-22 1986-10-30 Fujitsu Ltd バンプ電極の接続方法
JPS61251152A (ja) * 1985-04-30 1986-11-08 Fujitsu Ltd バンプ形成方法
JPS61296728A (ja) * 1985-06-26 1986-12-27 Fujitsu Ltd 集積回路接続部の形成方法

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US3621564A (en) * 1968-05-10 1971-11-23 Nippon Electric Co Process for manufacturing face-down-bonded semiconductor device
JPS5835935A (ja) * 1981-08-28 1983-03-02 Fujitsu Ltd 半導体装置及びその製造方法
JPS60117643A (ja) * 1983-11-29 1985-06-25 Nec Kansai Ltd 双方向性ツエナ−ダイオ−ド
JPS60234396A (ja) * 1984-05-08 1985-11-21 富士通株式会社 ハンダパツドの形成方法
JPS61244035A (ja) * 1985-04-22 1986-10-30 Fujitsu Ltd バンプ電極の接続方法
JPS61251152A (ja) * 1985-04-30 1986-11-08 Fujitsu Ltd バンプ形成方法
JPS61296728A (ja) * 1985-06-26 1986-12-27 Fujitsu Ltd 集積回路接続部の形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0565908A3 (https=) * 1992-04-16 1994-02-16 Ibm
EP0670594A1 (en) * 1994-03-02 1995-09-06 Kabushiki Kaisha Toshiba Semiconductor package and fabrication method thereof
US5814890A (en) * 1994-03-02 1998-09-29 Kabushiki Kaisha Toshiba Thin-type semiconductor package
US6953145B2 (en) 2000-08-05 2005-10-11 Robert Bosch Gmbh Soldering method for mounting electric components

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US4906823A (en) 1990-03-06
DE3818894C2 (https=) 1991-01-31
JPH0465535B2 (https=) 1992-10-20
JPS63304636A (ja) 1988-12-12

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