JPS63304636A - はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法 - Google Patents

はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法

Info

Publication number
JPS63304636A
JPS63304636A JP62139791A JP13979187A JPS63304636A JP S63304636 A JPS63304636 A JP S63304636A JP 62139791 A JP62139791 A JP 62139791A JP 13979187 A JP13979187 A JP 13979187A JP S63304636 A JPS63304636 A JP S63304636A
Authority
JP
Japan
Prior art keywords
solder
carrier
sheet
semiconductor device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62139791A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465535B2 (https=
Inventor
Tadao Kushima
九嶋　忠雄
Tasao Soga
太佐男 曽我
Kazuji Yamada
一二 山田
Mitsugi Shirai
白井　貢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62139791A priority Critical patent/JPS63304636A/ja
Priority to DE3818894A priority patent/DE3818894A1/de
Priority to US07/202,027 priority patent/US4906823A/en
Publication of JPS63304636A publication Critical patent/JPS63304636A/ja
Publication of JPH0465535B2 publication Critical patent/JPH0465535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP62139791A 1987-06-05 1987-06-05 はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法 Granted JPS63304636A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62139791A JPS63304636A (ja) 1987-06-05 1987-06-05 はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
DE3818894A DE3818894A1 (de) 1987-06-05 1988-06-03 Lottraeger, verfahren zu dessen herstellung und verfahren zur montage von halbleiteranordnungen unter dessen verwendung
US07/202,027 US4906823A (en) 1987-06-05 1988-06-03 Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62139791A JPS63304636A (ja) 1987-06-05 1987-06-05 はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法

Publications (2)

Publication Number Publication Date
JPS63304636A true JPS63304636A (ja) 1988-12-12
JPH0465535B2 JPH0465535B2 (https=) 1992-10-20

Family

ID=15253510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62139791A Granted JPS63304636A (ja) 1987-06-05 1987-06-05 はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法

Country Status (3)

Country Link
US (1) US4906823A (https=)
JP (1) JPS63304636A (https=)
DE (1) DE3818894A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111201A (ja) * 2000-10-03 2002-04-12 Ibiden Co Ltd プリント基板の製造方法
JPWO2015052780A1 (ja) * 2013-10-08 2017-03-09 リンテック株式会社 電子部品実装体の製造方法
CN112333929A (zh) * 2020-11-02 2021-02-05 梅虞进 一种大规模集成电路芯片生产加工处理设备
CN112743278A (zh) * 2020-12-24 2021-05-04 上海洪铺钢结构工程有限公司 一种钢箱梁焊接用翻转胎架

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
JP2629435B2 (ja) * 1990-10-17 1997-07-09 日本電気株式会社 アレイ状光素子用サブ基板の作製方法
GB9414145D0 (en) * 1994-07-13 1994-08-31 Electrotech Ltd Forming a layer
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5211328A (en) * 1992-05-22 1993-05-18 International Business Machines Method of applying solder
US5197655A (en) * 1992-06-05 1993-03-30 International Business Machines Corporation Fine pitch solder application
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
US5307983A (en) * 1993-04-27 1994-05-03 At&T Bell Laboratories Method of making an article comprising solder bump bonding
DE4322391A1 (de) * 1993-06-30 1995-01-12 Volker Hoehns Bondeinrichtung
JPH07122594A (ja) * 1993-10-28 1995-05-12 Hitachi Ltd 導電性バンプの形成方法
JPH07245360A (ja) * 1994-03-02 1995-09-19 Toshiba Corp 半導体パッケージおよびその製造方法
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
WO1996008037A1 (en) * 1994-09-06 1996-03-14 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
US5547902A (en) * 1995-01-18 1996-08-20 Advanced Micro Devices, Inc. Post hot working process for semiconductors
DE19507207A1 (de) * 1995-03-02 1996-09-05 Sel Alcatel Ag Verfahren zur Herstellung von Kontaktwarzen aus Lötmetall auf metallischen Kontaktflächen
US6099935A (en) * 1995-12-15 2000-08-08 International Business Machines Corporation Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
JP3346695B2 (ja) * 1996-02-23 2002-11-18 京セラ株式会社 半導体素子収納用パッケージの製造方法
DE19634646A1 (de) * 1996-08-27 1998-03-05 Pac Tech Gmbh Verfahren zur selektiven Belotung
US6063701A (en) * 1996-09-14 2000-05-16 Ricoh Company, Ltd. Conductive particle transferring method
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US7819301B2 (en) * 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7007833B2 (en) 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
JP3410639B2 (ja) 1997-07-23 2003-05-26 株式会社日立製作所 ペースト充填方法及びはんだ付け方法及びペースト印刷機
US6621037B2 (en) * 1997-10-16 2003-09-16 Magna International Inc. Welding material with conductive sheet and method
US6689982B2 (en) 1997-10-16 2004-02-10 Magna International, Inc. Apparatus and method for welding aluminum tubes
US6713707B2 (en) 1997-10-16 2004-03-30 Magna International, Inc. Welding material and method without carrier
US6105852A (en) * 1998-02-05 2000-08-22 International Business Machines Corporation Etched glass solder bump transfer for flip chip integrated circuit devices
WO2001028726A1 (en) * 1998-04-20 2001-04-26 Senju Metal Industry Co., Ltd. Solder coating material and production method therefor
US6056191A (en) 1998-04-30 2000-05-02 International Business Machines Corporation Method and apparatus for forming solder bumps
SG74729A1 (en) * 1998-05-29 2000-08-22 Hitachi Ltd Method of forming bumps
US6869008B2 (en) 1998-05-29 2005-03-22 Hitachi, Ltd. Method of forming bumps
US6402014B1 (en) 1998-05-29 2002-06-11 Hitachi, Ltd. Method of forming bumps
US6295730B1 (en) * 1999-09-02 2001-10-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
US7156361B1 (en) * 1999-09-02 2007-01-02 Micron Technology, Inc. Method and apparatus for forming metal contacts on a substrate
DE10038330C2 (de) * 2000-08-05 2002-07-11 Bosch Gmbh Robert Lötverfahren zur Befestigung elektrischer Bauelemente
US20020146896A1 (en) * 2001-04-06 2002-10-10 Yoo Woo Sik Metallizaton methods using foils
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
US9263329B2 (en) * 2014-03-19 2016-02-16 Intel Corporation Methods of connecting a first electronic package to a second electronic package

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3320658A (en) * 1964-06-26 1967-05-23 Ibm Method of making electrical connectors and connections
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
NL6613526A (https=) * 1966-09-26 1968-03-27
US3531852A (en) * 1968-01-15 1970-10-06 North American Rockwell Method of forming face-bonding projections
JPS557022B1 (https=) * 1968-05-10 1980-02-21
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
GB1407710A (en) * 1973-05-15 1975-09-24 Standard Telephones Cables Ltd Electrical contact rivet
JPS5846388B2 (ja) * 1978-04-19 1983-10-15 日本電気ホームエレクトロニクス株式会社 半田供給方法
US4209893A (en) * 1978-10-24 1980-07-01 The Bendix Corporation Solder pack and method of manufacture thereof
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
JPS5835935A (ja) * 1981-08-28 1983-03-02 Fujitsu Ltd 半導体装置及びその製造方法
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
JPS60117643A (ja) * 1983-11-29 1985-06-25 Nec Kansai Ltd 双方向性ツエナ−ダイオ−ド
JPS60234396A (ja) * 1984-05-08 1985-11-21 富士通株式会社 ハンダパツドの形成方法
JPS61244035A (ja) * 1985-04-22 1986-10-30 Fujitsu Ltd バンプ電極の接続方法
JPS61251152A (ja) * 1985-04-30 1986-11-08 Fujitsu Ltd バンプ形成方法
JPH071772B2 (ja) * 1985-06-26 1995-01-11 富士通株式会社 集積回路接続部の形成方法
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
US4759491A (en) * 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111201A (ja) * 2000-10-03 2002-04-12 Ibiden Co Ltd プリント基板の製造方法
JPWO2015052780A1 (ja) * 2013-10-08 2017-03-09 リンテック株式会社 電子部品実装体の製造方法
CN112333929A (zh) * 2020-11-02 2021-02-05 梅虞进 一种大规模集成电路芯片生产加工处理设备
CN112333929B (zh) * 2020-11-02 2021-11-09 丽水阡陌汽车电子有限公司 一种大规模集成电路芯片生产加工处理设备
CN112743278A (zh) * 2020-12-24 2021-05-04 上海洪铺钢结构工程有限公司 一种钢箱梁焊接用翻转胎架

Also Published As

Publication number Publication date
DE3818894A1 (de) 1988-12-22
US4906823A (en) 1990-03-06
DE3818894C2 (https=) 1991-01-31
JPH0465535B2 (https=) 1992-10-20

Similar Documents

Publication Publication Date Title
JPS63304636A (ja) はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
US5480835A (en) Electrical interconnect and method for forming the same
US6153940A (en) Core metal soldering knob flip-chip technology
US7674362B2 (en) Method for fabrication of a conductive bump structure of a circuit board
EP0819318B1 (en) A solder bump structure for a microelectronic substrate
KR100257420B1 (ko) 결합 재료 범프에 의해 상호접속되는 시스템
US5902686A (en) Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
US5660321A (en) Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
TWI225899B (en) Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US7560374B2 (en) Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
JPH1070153A (ja) 電子部品の接続方法
EP1022775B1 (en) Method of fabrication of semiconductor device and mounting structure thereof
US6551650B1 (en) Dip formation of flip-chip solder bumps
US20030036220A1 (en) Printed circuit board having plating conductive layer with bumps and its manufacturing method
US20100038777A1 (en) Method of making a sidewall-protected metallic pillar on a semiconductor substrate
JPH1197471A (ja) 半導体デバイスおよびその実装構造体並びにその製造方法
JPH04263434A (ja) 電気的接続接点の形成方法および電子部品の実装方法
JP7838230B2 (ja) 配線基板及び配線基板の製造方法
KR100863772B1 (ko) 솔더볼 및 공동이 형성된 몰드를 이용한 솔더볼의 제조방법
JPH09270428A (ja) はんだバンプ形成方法
JPH09186162A (ja) 金属バンプの形成方法
JPH07307341A (ja) バンプの形成方法
KR20090069825A (ko) 솔더 범프 제작용 템플릿
KR100952678B1 (ko) 솔더 범프 제작용 템플릿
JP2019005789A (ja) はんだ接合材とその製造方法、はんだバンプ付電子部品の製造方法および接合体