DE3414961C2 - - Google Patents

Info

Publication number
DE3414961C2
DE3414961C2 DE3414961A DE3414961A DE3414961C2 DE 3414961 C2 DE3414961 C2 DE 3414961C2 DE 3414961 A DE3414961 A DE 3414961A DE 3414961 A DE3414961 A DE 3414961A DE 3414961 C2 DE3414961 C2 DE 3414961C2
Authority
DE
Germany
Prior art keywords
adhesive
electrically conductive
particles
heat
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3414961A
Other languages
German (de)
English (en)
Other versions
DE3414961A1 (de
Inventor
Yoshitugu Imano
Kazuhito Nara Jp Ozawa
Yoshitomo Kashihara Nara Jp Kitanishi
Katsuhide Nara Jp Shino
Yukihiro Kashihara Nara Jp Inoue
Yoshinori Oogita
Kazuhiro Nakao
Shigeki Nara Jp Komaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE3414961A1 publication Critical patent/DE3414961A1/de
Application granted granted Critical
Publication of DE3414961C2 publication Critical patent/DE3414961C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
DE19843414961 1983-04-21 1984-04-19 Verfahren zum bonden von lsi-chips auf einen anschlusssockel Granted DE3414961A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58071020A JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法

Publications (2)

Publication Number Publication Date
DE3414961A1 DE3414961A1 (de) 1984-10-25
DE3414961C2 true DE3414961C2 (enExample) 1992-04-23

Family

ID=13448415

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843414961 Granted DE3414961A1 (de) 1983-04-21 1984-04-19 Verfahren zum bonden von lsi-chips auf einen anschlusssockel

Country Status (3)

Country Link
US (1) US4744850A (enExample)
JP (1) JPS59195837A (enExample)
DE (1) DE3414961A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19702186A1 (de) * 1997-01-23 1998-07-30 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU565919B2 (en) * 1983-06-13 1987-10-01 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
JPS6150344A (ja) * 1984-08-18 1986-03-12 Hitachi Chem Co Ltd 集積回路の接続方法
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
JPH081768B2 (ja) * 1985-02-13 1996-01-10 富士ゼロックス株式会社 異方導電性フィルム、これを用いた半導体装置およびその製造方法
WO1986006573A1 (en) * 1985-04-30 1986-11-06 Amp Incorporated Circuit panel without soldered connections and method of fabricating the same
EP0218849A1 (de) * 1985-09-12 1987-04-22 Siemens Aktiengesellschaft Trägerband für einen filmmontierten Schaltkreis
EP0265077A3 (en) * 1986-09-25 1989-03-08 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
JPS63119552A (ja) * 1986-11-07 1988-05-24 Sharp Corp Ｌｓｉチツプ
JPS63160347A (ja) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ｉｃチツプ
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
JPH084101B2 (ja) * 1987-06-25 1996-01-17 松下電器産業株式会社 半導体装置の製造方法
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JPH0211329U (enExample) * 1988-07-06 1990-01-24
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
DE3922671A1 (de) * 1989-07-10 1991-01-24 Siemens Ag Akustoelektronisches bauelement mit einer oberflaechenwellenanordnung und einer elektronischen halbleiterschaltung
DE69026992T2 (de) * 1989-08-17 1996-10-24 Canon Kk Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen
JPH0738502B2 (ja) * 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
JP2756184B2 (ja) * 1990-11-27 1998-05-25 株式会社日立製作所 電子部品の表面実装構造
US5258577A (en) * 1991-11-22 1993-11-02 Clements James R Die mounting with uniaxial conductive adhesive
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
EP0641019A3 (en) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc Flexible lead frame printed on a polymer.
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
KR950020972A (ko) * 1993-12-21 1995-07-26 쯔지 하루오 전극 단자가 미소 피치를 갖는 경우에도 전극 단자의 고신뢰성 접속을 달성할 수 있는 패널 실장 구조 및 패널 실장 방법
US5627405A (en) * 1995-07-17 1997-05-06 National Semiconductor Corporation Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer
DE69622412T2 (de) * 1995-08-29 2003-03-20 Minnesota Mining And Mfg. Co., Saint Paul Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
DE19630593C2 (de) * 1996-07-30 2001-07-05 Fraunhofer Ges Forschung Verfahren zum Verbinden einer integrierten Schatung mit einem Substrat und elektronische Schaltungsanordnung
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
US6228206B1 (en) 1997-07-30 2001-05-08 Drug Delivery Technologies, Inc. Bonding agent composition containing conductive filler and method of bonding electrode to printed conductive trace with same
JP2000003977A (ja) 1998-06-16 2000-01-07 Shinko Electric Ind Co Ltd 半導体チップ実装用基板
US6255208B1 (en) 1999-01-25 2001-07-03 International Business Machines Corporation Selective wafer-level testing and burn-in
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
US6630203B2 (en) 2001-06-15 2003-10-07 Nanopierce Technologies, Inc. Electroless process for the preparation of particle enhanced electric contact surfaces
CN1636167A (zh) * 2000-10-24 2005-07-06 纳诺皮尔斯技术公司 用于印刷微粒改良的电触点的方法和材料
DE10059765A1 (de) * 2000-11-30 2002-06-06 Koninkl Philips Electronics Nv Baugruppe mit Verbindungsstruktur
WO2002067017A2 (en) * 2001-01-22 2002-08-29 Nanopierce Technologies, Inc. Optical device module and method of fabrication
JPWO2003003798A1 (ja) * 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
JP3893100B2 (ja) * 2002-10-29 2007-03-14 新光電気工業株式会社 配線基板への電子部品搭載方法
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
US8816807B2 (en) * 2010-05-21 2014-08-26 Purdue Research Foundation Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981070A (en) * 1973-04-05 1976-09-21 Amdahl Corporation LSI chip construction and method
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
NL7605233A (nl) * 1976-05-17 1977-11-21 Philips Nv Van een micro circuit voorziene elementaire schijf met electrolytisch aangegroeide soldeerbollen alsmede werkwijze voor het vervaardigen daarvan.
JPS535255A (en) * 1976-07-05 1978-01-18 Hitachi Ltd Mold for molding resin
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4460804A (en) * 1982-08-02 1984-07-17 Svejkovsky Roger L Flexible electrically conductive adhesive tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19702186A1 (de) * 1997-01-23 1998-07-30 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen
DE19702186C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen

Also Published As

Publication number Publication date
JPS59195837A (ja) 1984-11-07
US4744850A (en) 1988-05-17
DE3414961A1 (de) 1984-10-25

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN