CN1636167A - 用于印刷微粒改良的电触点的方法和材料 - Google Patents

用于印刷微粒改良的电触点的方法和材料 Download PDF

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CN1636167A
CN1636167A CNA018179274A CN01817927A CN1636167A CN 1636167 A CN1636167 A CN 1636167A CN A018179274 A CNA018179274 A CN A018179274A CN 01817927 A CN01817927 A CN 01817927A CN 1636167 A CN1636167 A CN 1636167A
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conductive
cementitious mixtures
conductive surface
particulate
hard particulate
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赫伯特·诺伊豪斯
邹斌
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NanoPierce Technologies Inc
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NanoPierce Technologies Inc
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Publication of CN1636167A publication Critical patent/CN1636167A/zh
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Abstract

本发明涉及通过模版或丝网印刷方法在电接触面上形成微粒改良的凸起的材料和方法。该材料是导电墨水、导电浆糊、或导电粘合剂与导电硬微粒的混合物(104)。该方法包括通过模版印刷、丝网印刷、或其它分配工艺(110)把混合物涂覆在电接触面上(108)。在另一个实施方案中，墨水、浆糊、或粘合剂沉积物。一旦固化(114)，沉积物就会在接触面上形成硬的导电凸起，使其具有粗糙、导电、沙纸状的表面，该表面能容易地与相对接触面接触，而不需要再对两表面任一作其它任何表面处理。

Description

用于印刷微粒改良的电触点的方法和材料
相关申请的交叉引用
本申请要求享受在2000年10月24日提交的，名称为“用于印刷微粒改良的触点的方法和材料(Method and Material for PrintingParticle Enhanced Contacts)”的美国临时专利申请第60/243,092号的优先权，这里引用其全部内容作为参考。
技术领域
本发明大体涉及用于连接相对电触点之电接触面的制备。本发明尤其涉及用模版印刷或丝网印刷及类似沉积处理方法在电接触面上形成由微粒改良的凸起构成的导电的沙纸状表面的材料和方法。
背景技术
在美国专利第5,083,697号中，DiFrancesco已经首先公开了通过改良接触面的微粒来改善接触面之间的电、热、及机械连接的理念。该方法的主要优点在于，当坚硬的微粒穿过任何绝缘表面的障碍(如氧化物)时，硬微粒形成了极短的电路通路。而且，与只是平表面之间的触点相比，由很多粗糙的微粒形成的接触面之间连接的较大表面积也能改善热传导。(例如，5微米直径的工业用金刚石一般具有大约为1m2/g的表面积。)
DiFrancesco建议，可以用各种工艺形成微粒改良的接触面，例如使用化学气相沉积、喷溅沉积、蒸发、电解镀、及无电镀的方法。但是，这些方法中的很多种都有实用方面的不足。例如，化学气相沉积、喷溅沉积、蒸发方法要求在进行金属沉积前把硬微粒特别设置在需要的接触表面上。这些方法还要求接触表面保持平坦，以便不会干扰微粒的布置。
另外，很多电触点材料(如铝)不适合这种沉积及镀的化学反应和工艺。在这些情况下，必须使用特殊的过渡金属层和附加的工序步骤来化学激活接触表面，和/或在触点与金属沉积物之间设置化学分离层。并且，沉积和镀过程要使用大量危险材料。这些材料既有腐蚀性又有毒性，而且难以处置和储存。对这些危险材料进行安全、不危害环境的处理是复杂而昂贵的。最后，按照这些工艺的沉积物累积起来，使厚度以给定的速度增长。所以，总的沉积物厚度与沉积时间成比例。如果想用的电学元件需要在接触面上有较厚的沉积，那么沉积的时间就会长得令人无法接受。
在2001年3月19日提交的，名称为“电学元件的组装及制造方法(Electrical Component Assembly and Method of Fabrication)”的美国专利申请第09/812,140号中，Neuhaus等人提出了通过提供电流而使硬微粒和金属从溶液中电解共沉积到电触点上的方法。同样，在2001年7月15日提交的、名称为“制备微粒改良的电接触面的无电处理方法(Electroless Process for the Preparation ofParticle-Enhanced Electric Contact Surfaces)”的美国专利申请第09/883,012号中，Bahn等人提出了硬微粒和金属无电共沉积到电接触面上的方法。
虽然可以使用电解和无电镀工艺，但它们都有一定局限性，使得在某些情况下不能使用它们。例如，关于电解镀，金属和微粒的沉积只发生在与电流源电接触的表面上。因此，如果要同时沉积多个触点，那么，或者每一个触点都必须由单独的电流源供电，或者所有的触点必须连接到一个公共的电流源。在实践中，这严重限制了可以不用所不希望的应用以及随后从临时导电连接层的去除而被处理的多触点的结构和设置。虽然无电镀处理不需要电流，并因此没有这种限制，但比起电解系统来，无电系统在进行沉积时要慢得多。
发明内容
本发明提供一种制备微粒改良的、导电表面的材料及方法，而不需要使用两步沉积处理或者上述的电解或无电镀处理。该材料是导电墨水、导电浆糊或导电粘合剂、以及添加的导电硬微粒的混合物，当材料干燥或固化时，该混合物变成导电的具有沙纸状表面的导电固体。该创新方法包括用模版印刷、丝网印刷或其它分配工艺把混合物沉积到电接触面上。在另一实施方案中，首先用模版印刷或丝网印刷方法印刷墨水、浆糊、或粘合剂，然后把微粒涂覆在墨水、浆糊、或粘合剂沉积物的上面。一旦固化，沉积物就会在接触面上提供坚硬的电触点凸起。丝网或模版的物理尺寸控制由这些方法形成的沉积物的厚度。所以，可以像形成薄沉积物那样快速地形成厚沉积物。
以这种创新方法，可以形成接触面的任何结构。由于不需要电流，所以不需要与多个触点电连接。当基片是半导体晶片时，这尤其是个优点，其中电接触面(如触片)永远不会电连接。本发明可以使用普通的接触面材料，即使是那些在电解或无电不能使用的那些材料。特别是，可以不用材料或步骤就能对铝触点进行处理。另外，在所公开的直接分配的过程中，所用的危险材料量较少。在处理过程中，所有的危险材料都被蒸发，并且不会产生固体或液体废料。
本发明的沉积过程的目的是为了在电接触面上形成导电的、沙纸状的表面，从而在电学元件连接的接触面之间提供改善了的电接触和热传导。导电的硬微粒能穿透相对电触点的表面，不需要清洁两个触点表面中的任一个。这种穿透动作作用于任何表面障碍物，例如，氧化物、油、污垢、助熔剂或其它物质，并在电学元件的触点之间建立较强的电连接。微粒改良的表面也允许机械连接的简单方法，例如，通过在接触面之间涂覆绝缘的粘合剂。硬微粒也能穿透这种粘合剂。
附图说明
图1是本发明第一实施方案的把导电液体及硬微粒的混合物模版或微粒印刷在接触面上的步骤的流程图；以及
图2是本发明第二实施方案的把导电液体和随后使用的硬微粒模版或微粒印刷在接触面上的步骤的流程图。
具体实施方式
本发明包括一种新的结块材料，以及用于把结块材料沉积到电学元件的电接触面上的方法。在一个示例性的实施方案中，与微粒改良的表面电连接的“凸起”沉积在基片的粘结片上。可以通过把例如导电墨水、导电浆糊、或导电粘合剂这样的导电材料用模版或丝网印刷沉积到接触面上，来形成导电凸起。可以这样形成凸起的微粒改良的表面：在模版或丝网印刷之前，把导电微粒与结块材料(如墨水、焊膏、或导电粘合剂)混合起来；或者，在凸起被模版或丝网印刷后、而在结块材料固化前，可以把导电材料涂覆在预制的凸起表面上。
可以在几乎任何电学元件上预先进行所公开的印刷处理，例如，在印刷电路板、软性电路带、芯片载体、芯片模块、智能卡触点、智能镶嵌触点、以及具有接触面的其它基片上。该沉积处理可以同时应用于一个阵列中的多个电学元件上。这样一个阵列可以是一维或者两维的。多个电学元件的中的每一个至少具有一个电触点位置。一旦混合物涂覆到触点位置上，可以把电学元件阵列分成许多单独的电学元件，因而能在一个操作中同时形成很多电学元件。本发明的方法特别适用于半导体片干燥之前的触片处理，其中的阵列是半导体晶片。
通常，在模版或丝网印刷方法中使用的导电材料是把两成分混合起来的混合物，这两种成分是：(1)导电墨水、导电浆糊、或导电粘合剂；以及(2)导电硬微粒。导电材料混合物的第一成分的实施例包括、但不限于：ORMET1007(美国专利第5,830,389号公开的)-一种液相非稳定导电墨水；Alchemetal AC-78(AlchemetalCorporation，Jackson Heights，NY)-导电且可软焊的金属填充聚合物；以及Epoxies 40-3900(Epoxies，Etc...，Cranston，IR)-银填充环氧树脂。另外，焊膏也可以用作导电材料。共同地，这种导电墨水、导电浆糊、或导电粘合剂在这里可以称为粘性混合物。
导电材料混合物的第二成分是导电硬微粒，最好是涂覆金属的固有导电或绝缘的硬微粒。这些导电硬微粒被加入或区分于墨水、浆糊、或粘合剂中使这种材料呈现导电性的任何导电微粒或填料。一旦墨水、浆糊、或粘合剂凝固成固体，这些添加的导电硬微粒会使这些材料具有粗糙、导电、沙纸状的表面。这种微粒改良的、沙纸状的表面能穿透障碍而与相对的接触面电连接，而不需要在两个电学元件的接触面连接之前进行表面制备或清洁。
可以用金属制成导电硬微粒，这些金属例如有：铜、铝、镍、锡、铋、银、金、铂、钯、锂、铍、硼、钠、镁、钾、钙、镓、锗、铷、锶、铟、锑、铯、和钡，以及这些金属的合金和金属互化物。优选使用镍这种金属。
如上所述，导电硬微粒也可以用由一层导电金属覆盖或包围的绝缘核微粒形成，如上面所列举的那些。在该情况下，绝缘核微粒可以是非金属材料，例如，金属氧化物、氮化物、硼化物、硅及其它碳化物、硼纤维、碳纤维、石榴石、和金刚石。金刚石是优选的非金属硬微粒。镍和铜是这种核微粒的优选的金属涂层。其中需要热导体，金刚石和陶瓷是优选的材料。在本发明的一个实施方案中，硬微粒由被镀了一层镍的金刚石核构成。也可以用一薄层金来涂覆导电硬微粒。金提供低触点电阻并防止接触面氧化。金的替代物包括：铂、钯、铬、钯-镍合金、和锡镍合金。
如图1和2所示，沉积过程通常包括表面制备、混合、材料沉积、和固化。众所周知，良好的粘附力始于接触面的适当表面制备(步骤102、202)。通过适当的制备，表面上的污物被去除，变成一个干净的、无氧化物的表面。根据接触面和污物的类型，需要不同的预处理。一般说来，在涂覆导电墨水或浆糊之前，必须去除的表面污物可以包括如下的一种或几种：水分、有机污物(如油和润滑剂)、抛光剂、氧化物膜、污垢、和助熔剂。通常会用酸、丙酮、丁酮或其它类似溶剂来彻底清洁基片的接触面。沉积涂层下的污物会造成可以导致不良电连接的问题。对于有些基片，可能需要附加的表面制备步骤(如喷砂)，以确保优良的粘附力。
根据所需导电表面的类型，有几种制备材料的方法。可以如图1的流程所示的那样，在沉积前把硬微粒与导电墨水、浆糊、或粘合剂完全混合起来；或者，如图2所示那样，在涂覆了墨水、浆糊、或粘合剂之后、其未固化之前，把硬微粒加入预制的墨水、浆糊、或粘性“凸起”中。在图1所示的第一实施方案中，导电微粒与墨水、浆糊、或粘合剂混合(步骤104)。可以附加一个预先的分步，因为特别的墨水、浆糊、或粘合剂本身的结构式可以由两种或多种亚成分构成。在图2所示的过程中，其中微粒没有与墨水、浆糊、或粘合剂混合，该混合步骤如步骤204所示。例如，AlchemetalAC-78浆糊和Epoxies Etc.40-3900银充填环氧树脂各需要预先混合各种成分来制备浆糊或粘合剂。不同墨水、浆糊、或粘合剂的分子式构成差别很大，我们应该遵循这些材料的生产商的如下建议。
为了成功地用模版或丝网印刷进行沉积，应该小心留意墨水、浆糊、或粘合剂材料以及模版或丝网。对于形成足够的沉积以避免在各个接触面之间形成沉积材料的跨接、或者在模版或丝网孔的沉积区域中造成空穴来说，墨水、浆糊、或粘合剂的流变能力是很重要的。不应该使用含有会产生难以去除的残余物的化学成分的墨水、浆糊、或粘合剂。通常，根据对墨水、浆糊、或粘合剂通过模版孔或丝网的运动的详细分析，可以预知墨水、浆糊、或粘合剂的沉积性能。为了实现高质量的印刷，考虑硬微粒的大小、以及微粒相对于墨水、浆糊、或粘合剂的重量比、以及墨水或浆糊的流变能力(如粘性)也是很重要的。应该把墨水、浆糊、或粘合剂调整到合适的粘性。粘性太高的墨水、浆糊、或粘合剂难以沉积，并且表面轮廓难以控制。但是，粘性太低的墨水、浆糊、或粘合剂具有太高的流动性，因而会产生微粒沉淀的问题，其中微粒不会保持在凸起的表面上。对模版或丝网的选择也是很重要的，因为模版或丝网很大程度上决定了沉积的精度和尺寸。需要注意混合过程中的这些参数。
通过对本发明的实验和测试，已经发现，导电性能是墨水、浆糊、或粘合剂的化学式，微粒大小，以及墨水、浆糊、或粘合剂中硬微粒之浓度综合作用的结果。要严格选择导电墨水、浆糊、或粘合剂以及导电硬微粒，以确保低电阻。
可以用模版印刷或丝网印刷方法来沉积结块材料。众所周知，模版通常有一个片，上面有不能透过的区域以及让墨水、浆糊、或粘合剂和硬微粒通过而到达基片下面的孔。为了达到本发明的目的，可以使用厚度为50微米到1-2毫米的模版。同样公知，丝网印刷通常使用由乳剂覆盖的细的、网眼状纤维丝网。在乳剂上施加需要的图案，并把丝网暴露在光线下。乳剂的暴光区域硬化成难以渗透的表面，同时从由图案保护的未暴光区域冲洗乳剂，从而使墨水、浆糊、或粘合剂以及硬微粒通过而到达基片下面。
把模版或丝网放置在电学元件上(步骤106、206)，然后模版上的孔或者丝网上的图案通常印在电学元件的接触面上。在图1所示的第一实施方案中，墨水、浆糊、或粘合剂和微粒的混合物被涂覆到模版或丝网上(步骤108)，并通过模版孔或丝网的未暴光区域而在接触面上形成沉积(步骤110)。在图2所示的第二实施方案中，只有墨水、浆糊、或粘合剂被涂覆到模版或丝网上(步骤208)，并通过模版孔或丝网的未暴光区域而在接触面上形成沉积(步骤210)。无论在任一情况中，一旦已经形成了沉积，就可以去除模版或丝网(步骤112、212)。
在图2所示的第二实施方案中，硬微粒随后被涂覆到墨水、浆糊、或粘合剂沉积物的表面上(步骤214)。硬微粒通常分散在电学元件上，从而它们能粘附接触面上的墨水、浆糊、或粘合剂沉积物，或者微粒可以分别分配到各个触点位置上。在替换实施方案中，可以在去除模版或丝网前涂覆微粒，从而微粒只涂覆到接触面上的沉积区域。
模版或丝网的目的是为了限制混合物只涂覆到电学元件的接触面上，并控制沉积的形状。仅在模版的情况下，也可以用模版的厚度来控制沉积的厚度。关于模版或丝网印刷，可以用手工、半自动、或由合适的印刷设备控制来自动地进行沉积处理。有些基片具有凹触片并自成图案。这些基片不需要模版或丝网。在这些情况下，用橡胶滚轴把结块混合物压到基片上，而材料聚积到凹接触区域中。结块材料也可以用刷、浸或分配的方法直接涂覆到接触面上。
接着，墨水、浆糊、或粘合剂以及硬微粒的沉积混合物固化，从而硬微粒被束缚在墨水、浆糊、或粘合剂中(步骤114、216)。通常，固化包括两个或更多阶段，包括：干燥或去除溶剂；烧结、以及聚合物固化。混合物需要在炉子中固化。固化的流程和温度依所用的墨水、浆糊、或粘合剂而不同。注意选择所用的硬微粒，要对固化处理几乎没有影响。
例如，Alchemetal AC-78的固化过程如下。沉积的材料被小心地放置在预热过的炉子中在大约100-120℃的温度下固化5分钟(以去除水分而不产生水泡)。然后温度要升高到220℃保持10分钟，最后升高至260℃保持5分钟。(这是生产商建议的最佳固化循环。)在固化过程之前和过程中，不应该接触沉积表面。然后把电学元件从炉子中移出并冷却至室温。现在沉积材料是导电的。生产商也建议了另外一种红外线固化方法，以避免由于暴露在过高的固化温度下造成的对基片的潜在破坏。建议对低温基片(如塑料)使用红外线固化方法。当需要大幅缩短固化时间时(＜5分钟)也可以使用红外线固化方法。
通常，在固化之后，在涂覆绝缘粘合剂以把沉积表面与相配的接触面粘结起来而形成电连接之前，需要经常用水或溶剂清洗沉积表面上的可能的表面残余物。
对于制备在把晶片切割成小方块之前用于安装在圆片级上的倒装晶片的半导体晶片来说，本发明方法是适宜的。所述的处理同时形成所需要的“凸起”和微粒改良的触点。因为该处理适用于铝，所以不需要常用的“凸起下金属化(under bump metalization)”处理。由于铝是用在半导体晶片上的标准触点金属，所以可以用一个应用来处理晶片上所有的触点，而不需要暂时金属化来电连接触片。
通过形成微粒改良的凸起，本发明允许使用非常简单的直接晶片安装方法，例如，使用Neuhaus等人在2001年3月19日提交的名称为“电学元件的组装和制造方法(Electrical ComponentAssembly and Method of Fabrication)”的美国专利申请第09/812,140号公开的绝缘粘合剂。本发明也提供简单的方法来把元件热连接到基片上。在该申请中，硬微粒的导热性使元件与基片之间具有低热阻。同时可以实现导电性。
实验和测试
位于Colorado Springs，Colorado的NanoPierce Technologies，Inc.已经进行了大量实验。下面是对四个实验实例的描述。
实验1
Ormet1007 Ormet Corporation(Carlsbad，CA)生产的。材料最初保存在冷藏库中。容器被加热到室温。把大约2克墨水放在小Pyrex盘中。加入直径在10-25微米之间的镀镍金刚石，并用一个小刮刀搅拌该混合物。向红棕色墨水中加入镀镍金刚石微粒，直到混合物明显由于加入灰色微粒而变暗。相对浓度估计为1份微粒对10份墨水。
铝、铜、和不锈钢面板被脱脂并干燥。不需要从面板上去除原来的氧化物。厚度约为100微米的模版放在面板上。用刮刀把墨水和微粒的混合物通过模版尽量薄地涂覆在面板上。然后对面板实施Ormet Corporation推荐的固化流程。该循环如下：首先，在95℃的空气中保持40分钟；接着，在210℃的惰性气体中保持2分钟(例如，气相形式的3MFluorinet FC-70)；最后，在175℃的空气中保持60分钟。
用光学显微镜检查固化后的墨水微粒沉积物。沉积物粗糙并呈沙纸状。用Zeiss轮廓曲线仪测量沉积物的表面轮廓曲线。表面的变化在5-20微米之间。墨水微粒材料牢固地粘结在金属面板上，不能被刮掉或削掉。样品也被切开，以便观察固化的墨水微粒沉积物的内部结构。观察到，微粒均匀而紧密地固定在整个墨水中，从内部到表面几乎没有变化。用电阻表证实了沉积物表面与面板之间的导电性。
实验2
用Alchemetal AC-78，导电的金属填充聚合物浆糊(AlchemetalCorporation，Jackson Heights，NY)代替导电墨水重复进行第一个实验。混合物中所用的微粒是Amplex RB 50％的镀铜金刚石(即，铜占50％的微粒重量)，微粒直径在10-20微米之间。微粒对浆糊的比率同样估计为1比10。Alchemetal Corporation为AC-78推荐的流程如下：首先，在100℃的空气中保持5分钟；接着，在220℃的空气中保持10分钟；最后，在260℃的空气中保持5分钟。光学检查、粘性、和导电性结果与第一个实验中的结果一样。
实验3
再次重复第一个实验，这次用Epoxies 40-3900银填充环氧树脂(Epoxies，Etc.，Cranston，RI)代替导电墨水。在该实验中，镀镍金刚石微粒对环氧粘合剂的比率在1比19的量级，微粒的重量只占混合物重量的百分之五。首先，两成分的环氧树脂-催化剂和树脂-以1比1的比率混合。然后，1克Amplex镀镍金刚石与19克环氧粘合剂混合。该混合物通过50微米厚的模版涂覆到铝和铜基片上。该混合物在110℃的温度下固化10分钟。光学检查、粘性、和导电性结果与第一和第二个实验中的结果一样。
实验4
再次重复第一个实验，但在该实验中，不用把镀镍金刚石微粒混合进盘子中的墨水中，而是通过模版把墨水单独涂覆在金属面板上。然后把微粒洒在“湿”墨水上。用刮刀把微粒轻轻按压进墨水中。再次对墨水进行推荐的固化流程。如前所述，光学检查、粘性、和导电性结果与第一个实验中的结果一样。
总之，所有上述形成物具有导电性；具有粗糙，呈沙纸状的表面；并且牢固地粘附在铜、铝和不锈钢上。
虽然上面已经以一定详细程度，或参考一个或多个单独的实施方案对本发明的各种实施方案进行了说明，但本领域普通技术人员可以在不背离本发明的主旨和范围的前提下，对公开的实施方案作各种改进。很明显，上述说明中所述的以及附图中所示的全部内容将被解释为只为了说明具体的实施方案但不限于这些实施方案。在不背离如下面权利要求所限定的本发明的基本概念的前提下，可以对细节或结构加以改进。

Claims (31)

1.一种用于在导电表面上形成导电触点的合成物，所述合成物包括：
能粘附到所述导电表面上的粘性混合物，
其中，所述粘性混合物包括在所述粘性混合物的固化基础上形成导电固体的前体；以及
多个导电硬微粒，
其中，至少一部分所述多个导电硬微粒使所述导电固体形成粗糙、导电、沙纸状的表面，以及
其中，所述多个导电硬微粒具有至少与要电和机械连接到所述导电表面的相对导电表面一样的硬度。
2.如权利要求1所述的合成物，其中，所述多个导电硬微粒是多个金属微粒，其包括至少一种以下成分：铜、铝、镍、锡、铋、银、金、铂、钯、锂、铍、硼、钠、镁、钾、钙、镓、锗、铷、锶、铟、锑、铯、和钡，以及这些金属的合金和金属互化物。
3.如权利要求1所述的合成物，其中，所述多个导电硬微粒包括多个由金属层包围的绝缘微粒核。
4.如权利要求3所述的合成物，其中，所述多个绝缘微粒核包括至少一种以下成分：金刚石、石榴石、陶瓷、氧化物、硅化物、硅酸盐、碳化物、碳酸盐、硼化物、硼纤维、和氮化物。
5.如权利要求3所述的合成物，其中，所述金属层包括至少以下一种成分：铜、铝、镍、锡、铋、银、金、铂、钯、锂、铍、硼、钠、镁、钾、钙、镓、锗、铷、锶、铟、锑、铯、和钡，以及这些金属的合金和金属互化物。
6.如权利要求3所述的合成物，其中，所述金属层包括镍层，以及其中所述多个绝缘微粒核包括金刚石。
7.如权利要求1所述的合成物，其中，所述粘性混合物包括导电墨水。
8.如权利要求1所述的合成物，其中，所述粘性混合物包括导电浆糊。
9.如权利要求1所述的合成物，其中，所述粘性混合物包括导电粘合剂。
10.如权利要求1所述的合成物，其中，所述导电表面包括集成电路芯片的触片。
11.如权利要求1所述的合成物，其中，所述导电表面包括多个分立的导电表面。
12.如权利要求11所述的合成物，其中，所述多个分立的导电表面彼此电绝缘。
13.如权利要求11所述的合成物，其中，所述多个分立的导电表面包括集成电路芯片的面阵列触点结构。
14.如权利要求11所述的合成物，其中，所述多个分立的导电表面包括多个在半导体晶片上的集成电路器件的接触面。
15.一种用于在电学元件的导电表面上形成导电触点凸起的方法，所述方法包括：
把模版放置在所述电学元件上，
其中，所述模版包括孔图案，所述导电表面通过孔而暴露；
把粘性混合物与多个导电硬微粒混合，
其中，所述粘性混合物包括在所述粘性混合物的固化基础上形成导电固体的前体，
其中，所述粘性混合物能粘附在所述导电表面上，
以及
其中，所述多个导电硬微粒中的每一个都具有至少与要电和机械连接到所述导电表面的相对导电表面一样的硬度；
通过所述模版中的所述孔把所述粘性混合物与导电硬微粒的混合物涂覆到所述导电表面上；
从所述电学元件上去除所述模版；以及
固化涂覆在所述导电表面上的所述粘性混合物与导电硬微粒的混合物，以形成所述导电固体，
其中，至少一部分所述多个导电硬微粒使所述导电固体形成粗糙、导电、沙纸状的表面。
16.一种用于在电学元件的导电表面上形成导电触点凸起的方法，所述方法包括：
把模版放置在所述电学元件上，
其中，所述模版包括孔图案，所述导电表面通过孔而暴露；
通过所述模版中的所述孔把粘性混合物涂覆在所述导电表面上，
其中，所述粘性混合物包括在所述粘性混合物的固化基础上形成导电固体的前体，以及
其中，所述粘性混合物能粘附在所述导电表面上；
从所述电学元件上去除所述模版；
在涂覆到所述导电表面上的所述粘性混合物上沉积多个导电硬微粒，
其中，所述多个导电硬微粒中的每一个都具有至少与要电和机械连接到所述导电表面的相对导电表面一样的硬度；以及
固化所述粘性混合物，以形成所述导电固体，
其中，至少一部分所述多个导电硬微粒使所述导电固体形成粗糙、导电、沙纸状的表面。
17.一种用于在电学元件的导电表面上形成导电触点凸起的方法，所述方法包括：
把丝网放置在所述电学元件上，
其中，所述丝网包括暴露区域图案和非暴露区域，
其中，所述暴露区域对可印刷的粘性混合物和微粒是不可透过的，
其中，所述非暴露区域包括栅格限定孔，可印刷的粘性混合物以及大小适当的微粒可以通过这些孔，以及其中，所述非暴露区域与所述导电表面对准；
把粘性混合物与多个导电硬微粒混合，
其中，所述粘性混合物包括在所述粘性混合物的固化基础上形成导电固体的前体，
其中，所述粘性混合物能粘附在所述导电表面上，
其中，所述多个导电硬微粒中的每一个都具有至少与要电和机械连接到所述导电表面的相对导电表面一样的硬度，以及
其中，所述多个导电硬微粒中的每一个的大小都可以使其通过所述丝网中的栅格孔；
通过按压所述混合物，使其通过所述丝网非暴露区域中的栅格孔，从而把所述粘性混合物与导电硬微粒的混合物涂覆到所述导电表面上；
从所述电学元件上去除所述丝网；以及
固化涂覆在所述导电表面上的所述粘性混合物与导电硬微粒的混合物，以形成所述导电固体，
其中，至少一部分所述多个导电硬微粒使所述导电固体形成粗糙、导电、沙纸状的表面。
18.一种用于在电学元件的导电表面上形成导电触点凸起的方法，所述方法包括：
把丝网放置在所述电学元件上，
其中，所述丝网包括暴露区域图案和非暴露区域，
其中，所述暴露区域对可印刷的粘性混合物是不可透过的，
其中，所述非暴露区域包括栅格限定孔，可印刷的粘性混合物可以通过这些孔，以及
其中，所述非暴露区域与所述导电表面对准；
通过按压所述混合物，使其通过所述丝网非暴露区域中的栅格孔，从而把粘性混合物涂覆到所述导电表面上，
其中，所述粘性混合物包括在所述粘性混合物的固化基础上形成导电固体的前体，以及
其中，所述粘性混合物能粘附在所述导电表面上；
从所述电学元件上去除所述丝网；
在涂覆到所述导电表面上的所述粘性混合物上沉积多个导电硬微粒，
其中，所述多个导电硬微粒中的每一个都具有至少与要电和机械连接到所述导电表面的相对导电表面一样的硬度；以及
固化所述粘性混合物，以形成所述导电固体，
其中，至少一部分所述多个导电硬微粒使所述导电固体形成粗糙、导电、沙纸状的表面。
19.如权利要求15、16、17、或18所述的方法，其中，所述多个导电硬微粒是多个金属微粒，其包括至少一种以下成分：铜、铝、镍、锡、铋、银、金、铂、钯、锂、铍、硼、钠、镁、钾、钙、镓、锗、铷、锶、铟、锑、铯、和钡，以及这些金属的合金和金属互化物。
20.如权利要求15、16、17、或18所述的方法，其中，所述多个导电硬微粒包括多个由金属层包围的绝缘微粒核。
21.如权利要求20所述的方法，其中，所述多个绝缘微粒核包括至少一种以下成分：金刚石、石榴石、陶瓷、氧化物、硅化物、硅酸盐、碳化物、碳酸盐、硼化物、硼纤维、和氮化物。
22.如权利要求20所述的方法，其中，所述金属层包括至少以下一种成分：铜、铝、镍、锡、铋、银、金、铂、钯、锂、铍、硼、钠、镁、钾、钙、镓、锗、铷、锶、铟、锑、铯、和钡，以及这些金属的合金和金属互化物。
23.如权利要求20所述的方法，其中，所述金属层包括镍层，以及其中所述多个绝缘微粒核包括金刚石。
24.如权利要求15、16、17、或18所述的方法，其中，所述粘性混合物包括导电墨水。
25.如权利要求15、16、17、或18所述的方法，其中，所述粘性混合物包括导电浆糊。
26.如权利要求15、16、17、或18所述的方法，其中，所述粘性混合物包括导电粘合剂。
27.如权利要求15、16、17、或18所述的方法，其中，所述导电表面包括集成电路芯片的触片。
28.如权利要求15、16、17、或18所述的方法，其中，所述导电表面包括多个分立的导电表面。
29.如权利要求28所述的方法，其中，所述多个分立的导电表面彼此电绝缘。
30.如权利要求28所述的方法，其中，所述多个分立的导电表面包括集成电路芯片的面阵列触点结构。
31.如权利要求28所述的方法，其中，所述多个分立的导电表面包括多个在半导体晶片上的集成电路器件的接触面。
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CN104205312A (zh) * 2012-03-29 2014-12-10 田中贵金属工业株式会社 芯片接合用导电性糊及利用该导电性糊的芯片接合方法
CN110198843A (zh) * 2017-01-18 2019-09-03 微软技术许可有限责任公司 丝网印刷液态金属
CN108318162A (zh) * 2018-01-10 2018-07-24 中山大学 一种柔性传感器及其制备方法
CN108318162B (zh) * 2018-01-10 2019-11-29 中山大学 一种柔性传感器及其制备方法

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