JPH0211329U - - Google Patents
Info
- Publication number
- JPH0211329U JPH0211329U JP1988090116U JP9011688U JPH0211329U JP H0211329 U JPH0211329 U JP H0211329U JP 1988090116 U JP1988090116 U JP 1988090116U JP 9011688 U JP9011688 U JP 9011688U JP H0211329 U JPH0211329 U JP H0211329U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- conductor pattern
- conductive adhesive
- anisotropic conductive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090116U JPH0211329U (enExample) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090116U JPH0211329U (enExample) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211329U true JPH0211329U (enExample) | 1990-01-24 |
Family
ID=31314648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988090116U Pending JPH0211329U (enExample) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211329U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Ｌｓｉチツプボンデイング方法 |
-
1988
- 1988-07-06 JP JP1988090116U patent/JPH0211329U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Ｌｓｉチツプボンデイング方法 |