JPH02114943U - - Google Patents

Info

Publication number
JPH02114943U
JPH02114943U JP1989022554U JP2255489U JPH02114943U JP H02114943 U JPH02114943 U JP H02114943U JP 1989022554 U JP1989022554 U JP 1989022554U JP 2255489 U JP2255489 U JP 2255489U JP H02114943 U JPH02114943 U JP H02114943U
Authority
JP
Japan
Prior art keywords
semiconductor element
base metal
resin
mounting structure
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989022554U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989022554U priority Critical patent/JPH02114943U/ja
Publication of JPH02114943U publication Critical patent/JPH02114943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/5363
    • H10W72/884
    • H10W74/00
    • H10W90/736

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989022554U 1989-02-28 1989-02-28 Pending JPH02114943U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989022554U JPH02114943U (enExample) 1989-02-28 1989-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989022554U JPH02114943U (enExample) 1989-02-28 1989-02-28

Publications (1)

Publication Number Publication Date
JPH02114943U true JPH02114943U (enExample) 1990-09-14

Family

ID=31240778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989022554U Pending JPH02114943U (enExample) 1989-02-28 1989-02-28

Country Status (1)

Country Link
JP (1) JPH02114943U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248658A (ja) * 2011-05-27 2012-12-13 Aisin Seiki Co Ltd 半導体装置
JP2013536585A (ja) * 2010-08-25 2013-09-19 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気回路の製造方法および電気回路
WO2015037072A1 (ja) * 2013-09-11 2015-03-19 三菱電機株式会社 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013536585A (ja) * 2010-08-25 2013-09-19 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気回路の製造方法および電気回路
JP2012248658A (ja) * 2011-05-27 2012-12-13 Aisin Seiki Co Ltd 半導体装置
WO2015037072A1 (ja) * 2013-09-11 2015-03-19 三菱電機株式会社 半導体装置及びその製造方法
JPWO2015037072A1 (ja) * 2013-09-11 2017-03-02 三菱電機株式会社 半導体装置及びその製造方法

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