JPH02114943U - - Google Patents
Info
- Publication number
- JPH02114943U JPH02114943U JP1989022554U JP2255489U JPH02114943U JP H02114943 U JPH02114943 U JP H02114943U JP 1989022554 U JP1989022554 U JP 1989022554U JP 2255489 U JP2255489 U JP 2255489U JP H02114943 U JPH02114943 U JP H02114943U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- base metal
- resin
- mounting structure
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022554U JPH02114943U (enExample) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022554U JPH02114943U (enExample) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114943U true JPH02114943U (enExample) | 1990-09-14 |
Family
ID=31240778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989022554U Pending JPH02114943U (enExample) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114943U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012248658A (ja) * | 2011-05-27 | 2012-12-13 | Aisin Seiki Co Ltd | 半導体装置 |
| JP2013536585A (ja) * | 2010-08-25 | 2013-09-19 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気回路の製造方法および電気回路 |
| WO2015037072A1 (ja) * | 2013-09-11 | 2015-03-19 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
-
1989
- 1989-02-28 JP JP1989022554U patent/JPH02114943U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013536585A (ja) * | 2010-08-25 | 2013-09-19 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気回路の製造方法および電気回路 |
| JP2012248658A (ja) * | 2011-05-27 | 2012-12-13 | Aisin Seiki Co Ltd | 半導体装置 |
| WO2015037072A1 (ja) * | 2013-09-11 | 2015-03-19 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| JPWO2015037072A1 (ja) * | 2013-09-11 | 2017-03-02 | 三菱電機株式会社 | 半導体装置及びその製造方法 |