JPH01146531U - - Google Patents
Info
- Publication number
- JPH01146531U JPH01146531U JP1988042066U JP4206688U JPH01146531U JP H01146531 U JPH01146531 U JP H01146531U JP 1988042066 U JP1988042066 U JP 1988042066U JP 4206688 U JP4206688 U JP 4206688U JP H01146531 U JPH01146531 U JP H01146531U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- package
- wire
- bottom side
- base ends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042066U JPH01146531U (enExample) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042066U JPH01146531U (enExample) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146531U true JPH01146531U (enExample) | 1989-10-09 |
Family
ID=31268491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988042066U Pending JPH01146531U (enExample) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146531U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536868A (ja) * | 1991-07-29 | 1993-02-12 | Mitsubishi Electric Corp | 薄型半導体装置 |
-
1988
- 1988-03-31 JP JP1988042066U patent/JPH01146531U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536868A (ja) * | 1991-07-29 | 1993-02-12 | Mitsubishi Electric Corp | 薄型半導体装置 |