JPH0338647U - - Google Patents
Info
- Publication number
- JPH0338647U JPH0338647U JP1989099542U JP9954289U JPH0338647U JP H0338647 U JPH0338647 U JP H0338647U JP 1989099542 U JP1989099542 U JP 1989099542U JP 9954289 U JP9954289 U JP 9954289U JP H0338647 U JPH0338647 U JP H0338647U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- element mounting
- semiconductor
- lead
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/536—
-
- H10W72/5363—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989099542U JPH0338647U (enExample) | 1989-08-25 | 1989-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989099542U JPH0338647U (enExample) | 1989-08-25 | 1989-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338647U true JPH0338647U (enExample) | 1991-04-15 |
Family
ID=31648585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989099542U Pending JPH0338647U (enExample) | 1989-08-25 | 1989-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338647U (enExample) |
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1989
- 1989-08-25 JP JP1989099542U patent/JPH0338647U/ja active Pending