JPH0338647U - - Google Patents

Info

Publication number
JPH0338647U
JPH0338647U JP1989099542U JP9954289U JPH0338647U JP H0338647 U JPH0338647 U JP H0338647U JP 1989099542 U JP1989099542 U JP 1989099542U JP 9954289 U JP9954289 U JP 9954289U JP H0338647 U JPH0338647 U JP H0338647U
Authority
JP
Japan
Prior art keywords
semiconductor device
element mounting
semiconductor
lead
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989099542U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989099542U priority Critical patent/JPH0338647U/ja
Publication of JPH0338647U publication Critical patent/JPH0338647U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989099542U 1989-08-25 1989-08-25 Pending JPH0338647U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989099542U JPH0338647U (enExample) 1989-08-25 1989-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989099542U JPH0338647U (enExample) 1989-08-25 1989-08-25

Publications (1)

Publication Number Publication Date
JPH0338647U true JPH0338647U (enExample) 1991-04-15

Family

ID=31648585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989099542U Pending JPH0338647U (enExample) 1989-08-25 1989-08-25

Country Status (1)

Country Link
JP (1) JPH0338647U (enExample)

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