JPH03122536U - - Google Patents
Info
- Publication number
- JPH03122536U JPH03122536U JP1990031768U JP3176890U JPH03122536U JP H03122536 U JPH03122536 U JP H03122536U JP 1990031768 U JP1990031768 U JP 1990031768U JP 3176890 U JP3176890 U JP 3176890U JP H03122536 U JPH03122536 U JP H03122536U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- edge
- circuit device
- small protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/581—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990031768U JPH03122536U (enExample) | 1990-03-27 | 1990-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990031768U JPH03122536U (enExample) | 1990-03-27 | 1990-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03122536U true JPH03122536U (enExample) | 1991-12-13 |
Family
ID=31534560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990031768U Pending JPH03122536U (enExample) | 1990-03-27 | 1990-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03122536U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158440A (en) * | 1980-05-12 | 1981-12-07 | Hitachi Ltd | Semiconductor device |
| JPH0254567A (ja) * | 1988-08-17 | 1990-02-23 | Nec Kyushu Ltd | 樹脂封止型半導体装置 |
| JPH02166743A (ja) * | 1988-12-21 | 1990-06-27 | Nec Corp | 半導体集積回路装置 |
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1990
- 1990-03-27 JP JP1990031768U patent/JPH03122536U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158440A (en) * | 1980-05-12 | 1981-12-07 | Hitachi Ltd | Semiconductor device |
| JPH0254567A (ja) * | 1988-08-17 | 1990-02-23 | Nec Kyushu Ltd | 樹脂封止型半導体装置 |
| JPH02166743A (ja) * | 1988-12-21 | 1990-06-27 | Nec Corp | 半導体集積回路装置 |