JPH0226261U - - Google Patents
Info
- Publication number
- JPH0226261U JPH0226261U JP1988103861U JP10386188U JPH0226261U JP H0226261 U JPH0226261 U JP H0226261U JP 1988103861 U JP1988103861 U JP 1988103861U JP 10386188 U JP10386188 U JP 10386188U JP H0226261 U JPH0226261 U JP H0226261U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- integrated circuit
- semiconductor device
- thickness
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103861U JPH0226261U (enExample) | 1988-08-05 | 1988-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103861U JPH0226261U (enExample) | 1988-08-05 | 1988-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226261U true JPH0226261U (enExample) | 1990-02-21 |
Family
ID=31335066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988103861U Pending JPH0226261U (enExample) | 1988-08-05 | 1988-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226261U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817988A (ja) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | 樹脂封止型半導体装置及びその製造方法 |
| JP2010045265A (ja) * | 2008-08-15 | 2010-02-25 | Techwin Opto-Electronics Co Ltd | Ｌｅｄリードフレームの製造方法 |
-
1988
- 1988-08-05 JP JP1988103861U patent/JPH0226261U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817988A (ja) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | 樹脂封止型半導体装置及びその製造方法 |
| JP2010045265A (ja) * | 2008-08-15 | 2010-02-25 | Techwin Opto-Electronics Co Ltd | Ｌｅｄリードフレームの製造方法 |