JPS62163966U - - Google Patents
Info
- Publication number
- JPS62163966U JPS62163966U JP1986053016U JP5301686U JPS62163966U JP S62163966 U JPS62163966 U JP S62163966U JP 1986053016 U JP1986053016 U JP 1986053016U JP 5301686 U JP5301686 U JP 5301686U JP S62163966 U JPS62163966 U JP S62163966U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- metal wire
- thin metal
- die pad
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/581—
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- H10W72/884—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986053016U JPS62163966U (enExample) | 1986-04-07 | 1986-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986053016U JPS62163966U (enExample) | 1986-04-07 | 1986-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163966U true JPS62163966U (enExample) | 1987-10-17 |
Family
ID=30878695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986053016U Pending JPS62163966U (enExample) | 1986-04-07 | 1986-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163966U (enExample) |
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1986
- 1986-04-07 JP JP1986053016U patent/JPS62163966U/ja active Pending