JPS63137955U - - Google Patents
Info
- Publication number
- JPS63137955U JPS63137955U JP1987028780U JP2878087U JPS63137955U JP S63137955 U JPS63137955 U JP S63137955U JP 1987028780 U JP1987028780 U JP 1987028780U JP 2878087 U JP2878087 U JP 2878087U JP S63137955 U JPS63137955 U JP S63137955U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- mounting table
- lead frame
- hole
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987028780U JPS63137955U (enExample) | 1987-03-02 | 1987-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987028780U JPS63137955U (enExample) | 1987-03-02 | 1987-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137955U true JPS63137955U (enExample) | 1988-09-12 |
Family
ID=30832058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987028780U Pending JPS63137955U (enExample) | 1987-03-02 | 1987-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137955U (enExample) |
-
1987
- 1987-03-02 JP JP1987028780U patent/JPS63137955U/ja active Pending