JPS62204327U - - Google Patents
Info
- Publication number
- JPS62204327U JPS62204327U JP9318486U JP9318486U JPS62204327U JP S62204327 U JPS62204327 U JP S62204327U JP 9318486 U JP9318486 U JP 9318486U JP 9318486 U JP9318486 U JP 9318486U JP S62204327 U JPS62204327 U JP S62204327U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heater
- wire bonding
- clamper
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/075—
-
- H10W72/07141—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9318486U JPS62204327U (enExample) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9318486U JPS62204327U (enExample) | 1986-06-17 | 1986-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204327U true JPS62204327U (enExample) | 1987-12-26 |
Family
ID=30955545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9318486U Pending JPS62204327U (enExample) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204327U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237731A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |
-
1986
- 1986-06-17 JP JP9318486U patent/JPS62204327U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0237731A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |