JPH038445U - - Google Patents
Info
- Publication number
- JPH038445U JPH038445U JP1989067679U JP6767989U JPH038445U JP H038445 U JPH038445 U JP H038445U JP 1989067679 U JP1989067679 U JP 1989067679U JP 6767989 U JP6767989 U JP 6767989U JP H038445 U JPH038445 U JP H038445U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- substrate
- integrated circuit
- semiconductor element
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/736—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067679U JPH038445U (enExample) | 1989-06-09 | 1989-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989067679U JPH038445U (enExample) | 1989-06-09 | 1989-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH038445U true JPH038445U (enExample) | 1991-01-28 |
Family
ID=31601464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989067679U Pending JPH038445U (enExample) | 1989-06-09 | 1989-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH038445U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62115854A (ja) * | 1985-11-15 | 1987-05-27 | Sharp Corp | マルチチツプデバイス |
-
1989
- 1989-06-09 JP JP1989067679U patent/JPH038445U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62115854A (ja) * | 1985-11-15 | 1987-05-27 | Sharp Corp | マルチチツプデバイス |