JPS6439649U - - Google Patents

Info

Publication number
JPS6439649U
JPS6439649U JP1987135857U JP13585787U JPS6439649U JP S6439649 U JPS6439649 U JP S6439649U JP 1987135857 U JP1987135857 U JP 1987135857U JP 13585787 U JP13585787 U JP 13585787U JP S6439649 U JPS6439649 U JP S6439649U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
power semiconductor
chip
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987135857U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987135857U priority Critical patent/JPS6439649U/ja
Publication of JPS6439649U publication Critical patent/JPS6439649U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/015Manufacture or treatment of bond wires
    • H10W72/01515Forming coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
JP1987135857U 1987-09-03 1987-09-03 Pending JPS6439649U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987135857U JPS6439649U (enExample) 1987-09-03 1987-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987135857U JPS6439649U (enExample) 1987-09-03 1987-09-03

Publications (1)

Publication Number Publication Date
JPS6439649U true JPS6439649U (enExample) 1989-03-09

Family

ID=31395834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987135857U Pending JPS6439649U (enExample) 1987-09-03 1987-09-03

Country Status (1)

Country Link
JP (1) JPS6439649U (enExample)

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