JPS59146960U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS59146960U
JPS59146960U JP1983041670U JP4167083U JPS59146960U JP S59146960 U JPS59146960 U JP S59146960U JP 1983041670 U JP1983041670 U JP 1983041670U JP 4167083 U JP4167083 U JP 4167083U JP S59146960 U JPS59146960 U JP S59146960U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
conductive path
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983041670U
Other languages
English (en)
Other versions
JPS6348130Y2 (ja
Inventor
風見　明
関根　俊雄
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1983041670U priority Critical patent/JPS59146960U/ja
Publication of JPS59146960U publication Critical patent/JPS59146960U/ja
Application granted granted Critical
Publication of JPS6348130Y2 publication Critical patent/JPS6348130Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例を説明する上面図、第２図は第１図の■
−■線断面図、第３図は本考案を説明する上面図である
。 １１は混成集積回路基板、１２は導電路、１３は固着パ
ッド、１４はヒートシンク、１５はパワー半導体素子、
１６は拡張部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 良熱伝導性の混成集積回路基板と該基板上に設けた所望
    の導電路と該導電路の一部に設けたヒートシンクと略同
    −形状の固着パッドと該固着パッドに半田付けしたヒー
    トシンクと前記ヒートシンク上に固着したパワー半導体
    素子とを具備する混成集積回路に於いて、前記固着パッ
    ドの少くとも隣接した他の導電路と接する辺に拡張部を
    設けて半田だめとして成る混成集積回路。
JP1983041670U 1983-03-22 1983-03-22 混成集積回路 Granted JPS59146960U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983041670U JPS59146960U (ja) 1983-03-22 1983-03-22 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983041670U JPS59146960U (ja) 1983-03-22 1983-03-22 混成集積回路

Publications (2)

Publication Number Publication Date
JPS59146960U true JPS59146960U (ja) 1984-10-01
JPS6348130Y2 JPS6348130Y2 (ja) 1988-12-12

Family

ID=30172242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983041670U Granted JPS59146960U (ja) 1983-03-22 1983-03-22 混成集積回路

Country Status (1)

Country Link
JP (1) JPS59146960U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056167A (ja) * 1973-09-14 1975-05-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056167A (ja) * 1973-09-14 1975-05-16

Also Published As

Publication number Publication date
JPS6348130Y2 (ja) 1988-12-12

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