JPS5056167A - - Google Patents
Info
- Publication number
- JPS5056167A JPS5056167A JP10305673A JP10305673A JPS5056167A JP S5056167 A JPS5056167 A JP S5056167A JP 10305673 A JP10305673 A JP 10305673A JP 10305673 A JP10305673 A JP 10305673A JP S5056167 A JPS5056167 A JP S5056167A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10305673A JPS5056167A (ja) | 1973-09-14 | 1973-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10305673A JPS5056167A (ja) | 1973-09-14 | 1973-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5056167A true JPS5056167A (ja) | 1975-05-16 |
Family
ID=14344002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10305673A Pending JPS5056167A (ja) | 1973-09-14 | 1973-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5056167A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146960U (ja) * | 1983-03-22 | 1984-10-01 | 三洋電機株式会社 | 混成集積回路 |
-
1973
- 1973-09-14 JP JP10305673A patent/JPS5056167A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146960U (ja) * | 1983-03-22 | 1984-10-01 | 三洋電機株式会社 | 混成集積回路 |
| JPS6348130Y2 (ja) * | 1983-03-22 | 1988-12-12 |