JPS62131492U - - Google Patents

Info

Publication number
JPS62131492U
JPS62131492U JP1986018688U JP1868886U JPS62131492U JP S62131492 U JPS62131492 U JP S62131492U JP 1986018688 U JP1986018688 U JP 1986018688U JP 1868886 U JP1868886 U JP 1868886U JP S62131492 U JPS62131492 U JP S62131492U
Authority
JP
Japan
Prior art keywords
electronic component
heat transfer
bellows
coolant
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986018688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986018688U priority Critical patent/JPS62131492U/ja
Publication of JPS62131492U publication Critical patent/JPS62131492U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Description

【図面の簡単な説明】
第１図は本考案の原理断面図、第２図は本考案
の実施例の断面図で、ａは一実施例の断面図、ｂ
は他の実施例の断面図、第３図は冷却装置の概要
を示す斜視図、第４図は従来の断面図を示す。 図において、１はプリント基板、２は電子部品
、３は冷却プレート、４はベローズ、５は伝熱素
子、６は冷媒を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 冷媒６が循環される循環路３Ａを有する冷却プ
    レート３と、プリント基板１に実装された電子部
    品２と、一方が該冷却プレート３に固着され、他
    方が伝熱素子５に係止されたベローズ４とを備え
    、該伝熱素子５が該電子部品２の表面側に当接さ
    れ、該冷媒６の循環により該電子部品２の冷却を
    行う電子部品の冷却構造であつて、 前記ベローズ４を前記循環路３Ａに突出させて
    配設すると共に、 ヒートパイプ構造によつて前記伝熱素子５が形
    成され、かつ前記電子部品２が前記プリント基板
    １よりＳ型に形成されたリード端子２Ａによつて
    保持されて成ることを特徴とする電子部品の冷却
    構造。
JP1986018688U 1986-02-12 1986-02-12 Pending JPS62131492U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986018688U JPS62131492U (ja) 1986-02-12 1986-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986018688U JPS62131492U (ja) 1986-02-12 1986-02-12

Publications (1)

Publication Number Publication Date
JPS62131492U true JPS62131492U (ja) 1987-08-19

Family

ID=30812585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986018688U Pending JPS62131492U (ja) 1986-02-12 1986-02-12

Country Status (1)

Country Link
JP (1) JPS62131492U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165272A (ja) * 2012-02-13 2013-08-22 Asustek Computer Inc 放熱モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165272A (ja) * 2012-02-13 2013-08-22 Asustek Computer Inc 放熱モジュール

Similar Documents

Publication Publication Date Title
JPS62131492U (ja)
JPH01104092U (ja)
JPS6364097U (ja)
JPS58175641U (ja) 半導体部品の取付装置
JPS6230397U (ja)
JPS646085U (ja)
JPH0385652U (ja)
JPS6310596U (ja)
JPS6217146U (ja)
JPS6172894U (ja)
JPS59146960U (ja) 混成集積回路
JPS6022841U (ja) 放熱器
JPS6175137U (ja)
JPS6127391U (ja) 入出力ユニツトの放熱構造
JPS59103450U (ja) 回路ユニツト
JPS6444644U (ja)
JPS5936297U (ja) 電子機器の冷却構造
JPH02131395U (ja)
JPS61166543U (ja)
JPS5984848U (ja) 高電力部品を含んだ電子回路ユニツトの実装構造
JPS60121696U (ja) プリント基板実装筐体の放熱構造
JPS602891U (ja) 加熱調理器
JPS6169890U (ja)
JPS59177957U (ja) 放熱器
JPS62134252U (ja)