JPS6175137U - - Google Patents

Info

Publication number
JPS6175137U
JPS6175137U JP1984159816U JP15981684U JPS6175137U JP S6175137 U JPS6175137 U JP S6175137U JP 1984159816 U JP1984159816 U JP 1984159816U JP 15981684 U JP15981684 U JP 15981684U JP S6175137 U JPS6175137 U JP S6175137U
Authority
JP
Japan
Prior art keywords
module
semiconductor
cooling
module case
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984159816U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984159816U priority Critical patent/JPS6175137U/ja
Publication of JPS6175137U publication Critical patent/JPS6175137U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は、従来の半導体モジユールの冷却装置
の一例の断面図、第２図は、本考案の一実施例の
半導体モジユールの冷却装置の斜視図、第３図〜
第５図は、第２図に示す実施例の作用の説明図、
第６図〜第１０図は、他の実施例の作用の説明図
である。 １……半導体チツプ、２……配線基板、３……
モジユールケース、４……冷却器、５……ボルト
、６……冷却調整板、７……マスク、８……熱伝
導性グリース、９……スペーサー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプから熱を除くための熱伝導路を有
    する半導体モジユール冷却装置であつて、上記モ
    ジユール内に於ける冷却されるべき小電力及び大
    電力の半導体チツプと、上記半導体チツプが発生
    する熱を逃がす熱伝導方法と、上記熱伝導方法を
    収めるモジユールケースと、上記モジユールケー
    スから熱を除くための上記モジユールケースに結
    合される空冷または液冷などの方式により冷却さ
    れた冷却器より成る電子装置に於いて、上記モジ
    ユールケースと上記冷却器との間に配置された冷
    却調整方法であり、上記大電力の半導体チツプに
    向い合う部分に熱伝導性グリースが充填されその
    熱伝導性グリースの周囲にスペーサー又はマスク
    を配置することを特徴とする半導体モジユールの
    冷却装置。
JP1984159816U 1984-10-24 1984-10-24 Pending JPS6175137U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984159816U JPS6175137U (ja) 1984-10-24 1984-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984159816U JPS6175137U (ja) 1984-10-24 1984-10-24

Publications (1)

Publication Number Publication Date
JPS6175137U true JPS6175137U (ja) 1986-05-21

Family

ID=30717762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984159816U Pending JPS6175137U (ja) 1984-10-24 1984-10-24

Country Status (1)

Country Link
JP (1) JPS6175137U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235357A (ja) * 1990-01-29 1991-10-21 Internatl Business Mach Corp <Ibm> ヒートシンク構造体
JP2012004358A (ja) * 2010-06-17 2012-01-05 Denso Corp 半導体モジュール実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03235357A (ja) * 1990-01-29 1991-10-21 Internatl Business Mach Corp <Ibm> ヒートシンク構造体
JP2012004358A (ja) * 2010-06-17 2012-01-05 Denso Corp 半導体モジュール実装構造

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