JPS6230397U - - Google Patents

Info

Publication number
JPS6230397U
JPS6230397U JP1985121693U JP12169385U JPS6230397U JP S6230397 U JPS6230397 U JP S6230397U JP 1985121693 U JP1985121693 U JP 1985121693U JP 12169385 U JP12169385 U JP 12169385U JP S6230397 U JPS6230397 U JP S6230397U
Authority
JP
Japan
Prior art keywords
electronic components
cooling device
circuit board
printed circuit
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985121693U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985121693U priority Critical patent/JPS6230397U/ja
Publication of JPS6230397U publication Critical patent/JPS6230397U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の原理斜視図、第２図は本考案
による一実施例の説明図で、ａは要部側面図、ｂ
１，ｂ２は要部断面図、第３図は本考案の他の実
施例を示す要部側面図、第４図は従来の要部側面
図を示す。 図において、１はプリント基板、２は電子部品
、３は放熱フインモジユール、４はカバー、５は
放熱フイン、２Ａは表面を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 プリント基板１に実装された複数の電子部品２
    と、 該電子部品２のそれぞれに対して送風Ａを行う
    送風手段とを備え、該電子部品２の冷却を行う冷
    却装置であつて、 前記プリント基板１の実装面を覆うと共に、着
    脱可能なカバー４と、 該カバー４に係止され、前記電子部品２のそれ
    ぞれの表面２Ａに所定の当接面が圧接されるよう
    対応して配置された複数の放熱フイン５とを有し
    て構成された放熱フインモジユール３が設けられ
    て成ることを特徴とする電子部品の冷却装置。
JP1985121693U 1985-08-08 1985-08-08 Pending JPS6230397U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985121693U JPS6230397U (ja) 1985-08-08 1985-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985121693U JPS6230397U (ja) 1985-08-08 1985-08-08

Publications (1)

Publication Number Publication Date
JPS6230397U true JPS6230397U (ja) 1987-02-24

Family

ID=31011199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985121693U Pending JPS6230397U (ja) 1985-08-08 1985-08-08

Country Status (1)

Country Link
JP (1) JPS6230397U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013066A (ja) * 1996-06-25 1998-01-16 Nec Shizuoka Ltd 電子部品の放熱構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013066A (ja) * 1996-06-25 1998-01-16 Nec Shizuoka Ltd 電子部品の放熱構造

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