JPS6194356U - - Google Patents
Info
- Publication number
- JPS6194356U JPS6194356U JP1984178563U JP17856384U JPS6194356U JP S6194356 U JPS6194356 U JP S6194356U JP 1984178563 U JP1984178563 U JP 1984178563U JP 17856384 U JP17856384 U JP 17856384U JP S6194356 U JPS6194356 U JP S6194356U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat sink
- mounting
- electrical components
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の一実施例に係るヒートシンク
の側断面図、第2図はその上面図つまり第1図に
おける方向矢視図、第3図はこのヒートシンク
を半田デイプした状態を示す側断面図、第4図は
このヒートシンクを用いた実装状態を示す側断面
図である。第5図及び第6図は各々溝部の形状の
バリエーシヨンを説明する略示図である。第7図
は従来技術による実装状態を示す側断面図、第8
図は従来のヒートシンクを半田デイプした状態を
示す側断面図、第9図は部品接合状態の従来例を
示す略示図である。 1…ヒートシンク、11…周辺部、12…平坦
部、13…溝部、2…基板、3…電気部品(半導
体チツプ)、4…半田。
の側断面図、第2図はその上面図つまり第1図に
おける方向矢視図、第3図はこのヒートシンク
を半田デイプした状態を示す側断面図、第4図は
このヒートシンクを用いた実装状態を示す側断面
図である。第5図及び第6図は各々溝部の形状の
バリエーシヨンを説明する略示図である。第7図
は従来技術による実装状態を示す側断面図、第8
図は従来のヒートシンクを半田デイプした状態を
示す側断面図、第9図は部品接合状態の従来例を
示す略示図である。 1…ヒートシンク、11…周辺部、12…平坦
部、13…溝部、2…基板、3…電気部品(半導
体チツプ)、4…半田。
Claims (1)
- 基板に電気部品を実装する場合に基板と電気部
品との間に介在させて用いる基板実装用ヒートシ
ンクであつて、その電気部品取り付けがわが、周
辺部と、該周辺部よりも低くなつた平坦部とを有
し、かつ該平坦部と前記周辺部との間に溝部を有
することを特徴とする基板実装用ヒートシンク。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984178563U JPH0322919Y2 (ja) | 1984-11-24 | 1984-11-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984178563U JPH0322919Y2 (ja) | 1984-11-24 | 1984-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6194356U true JPS6194356U (ja) | 1986-06-18 |
JPH0322919Y2 JPH0322919Y2 (ja) | 1991-05-20 |
Family
ID=30736128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984178563U Expired JPH0322919Y2 (ja) | 1984-11-24 | 1984-11-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0322919Y2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009208106A (ja) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | コネクタ用めっき角線材料 |
JP2021145081A (ja) * | 2020-03-13 | 2021-09-24 | 日立Astemo株式会社 | 半導体装置の製造方法および半導体装置 |
-
1984
- 1984-11-24 JP JP1984178563U patent/JPH0322919Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009208106A (ja) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | コネクタ用めっき角線材料 |
JP2021145081A (ja) * | 2020-03-13 | 2021-09-24 | 日立Astemo株式会社 | 半導体装置の製造方法および半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0322919Y2 (ja) | 1991-05-20 |
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