JPS6439649U - - Google Patents
Info
- Publication number
- JPS6439649U JPS6439649U JP1987135857U JP13585787U JPS6439649U JP S6439649 U JPS6439649 U JP S6439649U JP 1987135857 U JP1987135857 U JP 1987135857U JP 13585787 U JP13585787 U JP 13585787U JP S6439649 U JPS6439649 U JP S6439649U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor device
- power semiconductor
- chip
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Description
第１図は本考案の一実施例の電力半導体装置の
要部断面図、第２図は同実施例で用いたヒートシ
ンクの斜視図、第３図は従来例の電力半導体装置
の要部断面図、第４図および第５図はそれぞれ従
来技術の問題点を示した上面図および断面図であ
る。 １……基板、２……ヒートシンク、３……半導
体チツプ、５……クリームハンダ、６……端子。
要部断面図、第２図は同実施例で用いたヒートシ
ンクの斜視図、第３図は従来例の電力半導体装置
の要部断面図、第４図および第５図はそれぞれ従
来技術の問題点を示した上面図および断面図であ
る。 １……基板、２……ヒートシンク、３……半導
体チツプ、５……クリームハンダ、６……端子。
Claims (1)
- 半導体チツプと、該チツプを搭載する放熱用の
ヒートシンクを備えた電力半導体装置において、
前記ヒートシンクの半導体チツプ搭載面に端子を
ハンダ付するための凹部を設けたことを特徴とす
る電力半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987135857U JPS6439649U (ja) | 1987-09-03 | 1987-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987135857U JPS6439649U (ja) | 1987-09-03 | 1987-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439649U true JPS6439649U (ja) | 1989-03-09 |
Family
ID=31395834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987135857U Pending JPS6439649U (ja) | 1987-09-03 | 1987-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439649U (ja) |
-
1987
- 1987-09-03 JP JP1987135857U patent/JPS6439649U/ja active Pending