JPH038445U - - Google Patents

Info

Publication number
JPH038445U
JPH038445U JP6767989U JP6767989U JPH038445U JP H038445 U JPH038445 U JP H038445U JP 6767989 U JP6767989 U JP 6767989U JP 6767989 U JP6767989 U JP 6767989U JP H038445 U JPH038445 U JP H038445U
Authority
JP
Japan
Prior art keywords
lead frame
substrate
integrated circuit
semiconductor element
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6767989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6767989U priority Critical patent/JPH038445U/ja
Publication of JPH038445U publication Critical patent/JPH038445U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の混成集積回路装置
の側面図、第２図は他の実施例の側面図、第３図
は従来の装置の側面図である。 １３……絶縁金属基板、１４……アルミ基板、
１６……導体、１７……リードフレーム、１８…
…肉厚部、１９，２２……半田、２０……金属ワ
イヤ、２１……半導体素子、２３……セラミツク
基板。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上に半導体素子とリードフレームを設けた
    混成集積回路装置において、 基板に接続されるリードフレームの基端に蓄熱
    量が大きくなるよう肉厚部を形成し、該肉厚部に
    半導体素子を半田を介し実装したことを特徴とす
    る混成集積回路装置におけるリードフレーム。
JP6767989U 1989-06-09 1989-06-09 Pending JPH038445U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6767989U JPH038445U (ja) 1989-06-09 1989-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6767989U JPH038445U (ja) 1989-06-09 1989-06-09

Publications (1)

Publication Number Publication Date
JPH038445U true JPH038445U (ja) 1991-01-28

Family

ID=31601464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6767989U Pending JPH038445U (ja) 1989-06-09 1989-06-09

Country Status (1)

Country Link
JP (1) JPH038445U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115854A (ja) * 1985-11-15 1987-05-27 Sharp Corp マルチチツプデバイス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115854A (ja) * 1985-11-15 1987-05-27 Sharp Corp マルチチツプデバイス

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