JPH03122552U - - Google Patents

Info

Publication number
JPH03122552U
JPH03122552U JP1990031459U JP3145990U JPH03122552U JP H03122552 U JPH03122552 U JP H03122552U JP 1990031459 U JP1990031459 U JP 1990031459U JP 3145990 U JP3145990 U JP 3145990U JP H03122552 U JPH03122552 U JP H03122552U
Authority
JP
Japan
Prior art keywords
insulating substrate
insulating
substrate
power element
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990031459U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990031459U priority Critical patent/JPH03122552U/ja
Publication of JPH03122552U publication Critical patent/JPH03122552U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す構成図、第２図
は本考案の実装工程図、第３図は従来の素子実装
構造図、第４図は従来の実装工程図である。 図中、Ａ……金属ベース基板、Ｂ……絶縁性基
板、１……パワー素子、２……ヒートシンク、３
，４……はんだ、７……アルミワイヤ、１１……
小信号素子、１５……金ワイヤ、２１……絶縁層
、２２……導電層、２３……パツドである。

Claims (1)

  1. 【実用新案登録請求の範囲】 小信号素子１１を実装した絶縁性基板Ｂと、 表面の絶縁層２１上に該絶縁性基板を搭載し、
    また該絶縁層上に形成した導電層２２上にヒート
    シンク２を介してパワー素子１を実装した金属ベ
    ース基板Ａと、 該パワー素子の各部と前記絶縁性基板上のパタ
    ーンとを接続する金属ワイヤ７とを備えてなるこ
    とを特徴とする半導体素子の実装構造。
JP1990031459U 1990-03-27 1990-03-27 Pending JPH03122552U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990031459U JPH03122552U (ja) 1990-03-27 1990-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990031459U JPH03122552U (ja) 1990-03-27 1990-03-27

Publications (1)

Publication Number Publication Date
JPH03122552U true JPH03122552U (ja) 1991-12-13

Family

ID=31534230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990031459U Pending JPH03122552U (ja) 1990-03-27 1990-03-27

Country Status (1)

Country Link
JP (1) JPH03122552U (ja)

Similar Documents

Publication Publication Date Title
JPH03122552U (ja)
JPS6395271U (ja)
JPH0336137U (ja)
JPH0396064U (ja)
JPH0233442U (ja)
JPH03120052U (ja)
JPH038445U (ja)
JPS6161833U (ja)
JPH0338653U (ja)
JPS6355538U (ja)
JPH0320450U (ja)
JPH0179846U (ja)
JPH0256460U (ja)
JPH0221776U (ja)
JPH01130552U (ja)
JPH01176946U (ja)
JPH0343732U (ja)
JPS63149544U (ja)
JPS6429885U (ja)
JPH0217848U (ja)
JPS62160556U (ja)
JPS62135443U (ja)
JPH0272536U (ja)
JPS63142849U (ja)
JPH0353854U (ja)