JPH0338653U - - Google Patents
Info
- Publication number
- JPH0338653U JPH0338653U JP9796789U JP9796789U JPH0338653U JP H0338653 U JPH0338653 U JP H0338653U JP 9796789 U JP9796789 U JP 9796789U JP 9796789 U JP9796789 U JP 9796789U JP H0338653 U JPH0338653 U JP H0338653U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- pattern
- heat dissipation
- dissipation structure
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る集積回路の放熱構造を示
す断面図、第２図は他の実施例を示す断面図、第
３図は従来の集積回路の放熱構造を示す断面図で
ある。 ５…集積回路素子、６…半田層、１１…セラミ
ツク基板、１２…第１のパターン、１３…第２の
パターン、１４…導体孔。
す断面図、第２図は他の実施例を示す断面図、第
３図は従来の集積回路の放熱構造を示す断面図で
ある。 ５…集積回路素子、６…半田層、１１…セラミ
ツク基板、１２…第１のパターン、１３…第２の
パターン、１４…導体孔。
Claims (1)
- 基板の表裏面に集積回路を搭載する第１のパタ
ーンと外部に露呈する第２のパターンを各々形成
すると共に、これら両パターンを接続する導体孔
を設けたことを特徴とする集積回路の放熱構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9796789U JPH0338653U (ja) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9796789U JPH0338653U (ja) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338653U true JPH0338653U (ja) | 1991-04-15 |
Family
ID=31647086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9796789U Pending JPH0338653U (ja) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338653U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036050A (ja) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | 積層回路基板の製造方法 |
| WO2016013362A1 (ja) * | 2014-07-22 | 2016-01-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155973A (ja) * | 1974-06-07 | 1975-12-16 | ||
| JPS6413788A (en) * | 1987-07-07 | 1989-01-18 | Fujitsu Ltd | Printed board |
-
1989
- 1989-08-24 JP JP9796789U patent/JPH0338653U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155973A (ja) * | 1974-06-07 | 1975-12-16 | ||
| JPS6413788A (en) * | 1987-07-07 | 1989-01-18 | Fujitsu Ltd | Printed board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036050A (ja) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | 積層回路基板の製造方法 |
| WO2016013362A1 (ja) * | 2014-07-22 | 2016-01-28 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
| CN106471870A (zh) * | 2014-07-22 | 2017-03-01 | 株式会社自动网络技术研究所 | 电路结构体 |
| US9974182B2 (en) | 2014-07-22 | 2018-05-15 | Autonetworks Technologies, Ltd. | Circuit assembly |