JPH01137543U - - Google Patents
Info
- Publication number
- JPH01137543U JPH01137543U JP1988033991U JP3399188U JPH01137543U JP H01137543 U JPH01137543 U JP H01137543U JP 1988033991 U JP1988033991 U JP 1988033991U JP 3399188 U JP3399188 U JP 3399188U JP H01137543 U JPH01137543 U JP H01137543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor components
- wiring pattern
- view
- semiconductor
- surround
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案一実施例の斜視図、第２図は同
上の要部断面図、第３図は同上の要部拡大斜視図
、第４図は他の実施例の斜視図、第５図は同上の
要部断面図、第６図はさらに他の実施例の要部斜
視図、第７図は同上の要部断面図、第８図はさら
に他の実施例の斜視図、第９図は従来例の斜視図
、第１０図は他の従来例の斜視図、第１１図は同
上の要部断面図である。 １は絶縁板、３は配線パターン、４はプリント
配線基板、５は半導体部品、６は放熱板である。
上の要部断面図、第３図は同上の要部拡大斜視図
、第４図は他の実施例の斜視図、第５図は同上の
要部断面図、第６図はさらに他の実施例の要部斜
視図、第７図は同上の要部断面図、第８図はさら
に他の実施例の斜視図、第９図は従来例の斜視図
、第１０図は他の従来例の斜視図、第１１図は同
上の要部断面図である。 １は絶縁板、３は配線パターン、４はプリント
配線基板、５は半導体部品、６は放熱板である。
Claims (1)
- 絶縁板に配線パターンを設けたプリント配線基
板上に複数の半導体部品を実装し、複数の半導体
部品の上面に要所が密着される放熱板を各半導体
部品の上方を囲むように配設し、該放熱板を配線
パターンのグランドパターンに接続したことを特
徴とするハイブリツド集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988033991U JPH01137543U (ja) | 1988-03-15 | 1988-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988033991U JPH01137543U (ja) | 1988-03-15 | 1988-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137543U true JPH01137543U (ja) | 1989-09-20 |
Family
ID=31260710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988033991U Pending JPH01137543U (ja) | 1988-03-15 | 1988-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137543U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274481A (ja) * | 1995-03-31 | 1996-10-18 | Nippon Densan Corp | 電子部品冷却装置 |
-
1988
- 1988-03-15 JP JP1988033991U patent/JPH01137543U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274481A (ja) * | 1995-03-31 | 1996-10-18 | Nippon Densan Corp | 電子部品冷却装置 |